系统级集成射频垂直互连技术
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摘要
随着电子装备朝着多功能、高性能方向发展的同时,硬件还要变轻、变小,成本还要更低,其内部模块/组件集成密度要求不断提升,传统的平面混合集成密度已接近极限,三维异质异构集成必将成为新一代电子功能单元的主流形态。系统级集成射频垂直互连技术是三维异质异构集成系统的关键技术之一,对系统级集成射频垂直互连技术的发展动态及应用前景进行了综述。
With the development of electronic equipment in a multi-functional and high-performance direction,the hardware will be lighter,smaller and less cost,3D Heterogeneous integrated becomes a trend and necessity. System-scale integrated RF vertical interconnection is one of key techniques for 3D heterogeneous integrated system. The development of System-scale RF vertical interconnection for systemscale integrated was summarized.
With the development of electronic equipment in a multi-functional and high-performance direction,the hardware will be lighter,smaller and less cost,3D Heterogeneous integrated becomes a trend and necessity. System-scale integrated RF vertical interconnection is one of key techniques for 3D heterogeneous integrated system. The development of System-scale RF vertical interconnection for systemscale integrated was summarized.
引文
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[21]刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016(3):135-138.
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[27]Reid J Robert,Eric D Marsh,Richard T Webster.Micromachined Rectangular-Coaxial Transmission Lines[J].IEEE Trans Microwave Theory Tech,2006,54:3433-3442.
[2]胡明春,周志鹏,严伟.相控阵雷达收发组件技术[M].北京:国防工业出版社,2010:326-328.
[3]Rao R Tummala,Madhavan Swaminathan.Introduction to Systemon-Package(SOP)[M].New York:Mc Graw-Hill,2008:11-23.
[4]Schuh P,Rieger R.Fleckenstein,T/R-module technologies today and possible evolutions[C]//Radar Conference-Surveillance for a Safer World,2009:1-5.
[5]Abbosh A M.Ultra wideband vertical microstrip to microstriptransiton[J].IET Microwave and Antenna Propagation,2007,1(5):968-972.
[6]李民,冯志刚.BGA/MCM进入现在组装技术的主流[J].电子工艺技术,1997,18(5):179-184.
[7]Katsuyuki Yoshida,Takayuki Shirasaki,Seigo Matsuzono,et al.50 GHz Broadband SMT Package for Microwave Application[C]//Electronic Components and Technology Conference,2001.
[8]Pinel S,Chakraborty S,Roellig M,et al.3D Intergrated LTCCModule usingμBGA technology for compact C-band RF FrontEnd Module[C]//IEEE MTT-S International Microwave Symposium,2002.
[9]Tero Kangasvieri,Mikko Komulaimen,Heli Jantunen,et al.LowLoss and Wideband Package Transitions for Microwave and millimeter-Wave MCMsp[J].IEEE Transactions On Advanced Packaging,2008,31:170-181.
[10]Bessemoulin A,Cheng A C S,Ball A.A Hermetic Surface-Mount Ball Grid Array(BGA)LTCC Package for Multi-function T/R MMICs up to Ku-band[C]//IEEE International Conference on Microwaves,2011.
[11]Putaala J,Nousiainen O,Jantunen H,et al.Failure Detection of BGA Transition Structures at High Frequencies[C]//Electronics Systemintegration Technology Confernce,2006.
[12]Jussi Putaala,Tero Kangasvieri,Olli Nousiainen,et al.Detection of Thermal Cycling-Induced Failures in RF/Microwave BGAAssemblied[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31:240-247.
[13]Sashidhar Movva,Gerardo Aguirre.High Reliability Second Level Interconnects Using Polymer Core BGAs[C]//Electronic Components and Technology Conference,2004.
[14]Rolf Johannessen,Froydis Oldervoll,Sintef Ict,et al.Investigation of Compliant Interconnector for Ball Grid Array[C]//European Microelectronics and Packaging Conference,2009.
[15]Galloway Jesse,Syed Ahmer,Kang Won Joon,et al.Mechanical,Thermal,and Electrical Analysis of a Compliant Interconnect[J].IEEE Transactions on Components and Packaging Technologies,2005,28:297-302.
[16]黄正.美国军用射频连接器的发展[J].中国电子科学研究院学报,2007(4):197-205.
[17]张战峰.国外军用连接器技术及发展趋势[J].机电元件,2004(3):47-52.
[18]Carter David.'Fuzz Button'interconnects at microwave and mmwave frequencies[C]//IEE Seminar,2000.
[19]Strack D,Fudem H,Kuss F,et al.Solder Free Interconnects for Mixed Signal(DC/Microwave)Systems[C]//IEEE MTT-SInternational Microwave Symposium,1999.
[20]徐利,王子良,胡进,等.基于毛纽扣的LTCC微波模块垂直互连技术[J].射频与微波,2013(12):538-541.
[21]刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016(3):135-138.
[22]郭旭光.3D组装面阵列垂直互连技术及可靠性[D].哈尔滨:哈尔滨工业大学,2015.
[23]严伟,吴金财,郑伟.三维微波多芯片组件垂直微波互联技术[J].微波学报,2012(10):1-6.
[24]张兆华,吴金财,王锋.基于树脂包封的微波三维多芯片组件技术研究[J].现代雷达,2013(12):64-67.
[25]Yu Bo,Liu Y,Hu Xing,et al.Micromachined Silicon Channels for THz Interconnect[C]//Wireless&Microwave Technology Conference,2014.
[26]Reid J La Meres,Christopher Mc Intosh,Monther Abusultan.Novel 3D Coaxial Interconnect System for Use in System-inPackage Applicaitons[J].IEEE Transactions on advanced packaging,2010(2):37-47.
[27]Reid J Robert,Eric D Marsh,Richard T Webster.Micromachined Rectangular-Coaxial Transmission Lines[J].IEEE Trans Microwave Theory Tech,2006,54:3433-3442.