LTCC基板上焊球失效模式影响因素分析
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摘要
基于LTCC基板的BGA封装结构在高密度射频封装领域被受到特别关注。在对其板级集成互联可靠性研究的基础上,以焊球失效模式为切入点,从基板及导体材料、焊盘结构、焊接工艺等方面展开分析,探讨了LTCC基板焊球失效模式的影响因素以期改善焊球失效情况。
The LTCC modules with BGA have received special attention in the field of high density RF package. Based on the reliability research of board level BGA interconnection, focused on the failure modes of solder ball, and discussed the influencing factors from aspects of substrate materials, pad structure and process, in order to improve the BGA interconnect reliability.
The LTCC modules with BGA have received special attention in the field of high density RF package. Based on the reliability research of board level BGA interconnection, focused on the failure modes of solder ball, and discussed the influencing factors from aspects of substrate materials, pad structure and process, in order to improve the BGA interconnect reliability.
引文
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[2]Tero Kangasvieri.Surface-mountable LTCC-Si P module approachfor reliable RF and millimeter-wave packaging.IEEE MTT-SInternational Microwave Symposium 2008,Digest,Atlanta,GA,USA,2008.
[3]陈春梅,伍艺龙,李慧.LTCC基板装配间隙对微波特性的影响分析[J].电子工艺技术,2017,38(6):323-325.
[4]孙轶,何睿,班玉宝,等.陶瓷焊球阵列封装可靠性研究与试验分析[J].航空科学技术,2014(8):87-90.
[5]Olivier Gaillard.Board level reliability testing of hermetic packages equipped with high-relinterconnection solutionsand dedicated to space applications[C].EMPC 2013,Grenoble,France,2013.
[6]工业和信息化部电子第四研究所,电子科技集团公司第58研究所,电子科技集团公司第43研究所,等.球栅阵列(BGA)试验方法:GJB 7677-2012[S].北京:总装电子信息基础部,2012.
[7]王从香,侯清健.银浆料LTCC镀金基板工程化应用研究[J].电子机械工程,2015(3):45-49.