摘要
构造了一种基于悬丝约束支撑的变刚度微纳测头。利用压电装置驱动柔性机构变形,改变悬丝所受的轴向张紧力及横向刚度,进而改变测头约束支撑机构的整体刚度。通过正交试验法优化测头的各项结构参数,确定最优尺寸。基于有限元方法,仿真验证测头的各向同性、灵敏度、固有频率及瞬态响应等性能。通过仿真得到测头刚度关于悬丝轴向伸长量的变化曲线,结果表明测头具有一定的变刚度性能。提出的变刚度测头丰富了现有测头的结构形式,研究成果对该类型结构形式的测头的实际应用奠定了前期基础。
A variable stiffness micro-nano probe was constructed based on the suspension wire constraint support. The piezoelectric device was used to drive the deformation of the flexible mechanism to change the axial tension and the transverse stiffness of the suspension wire,and then changing the overall stiffness of the probe constraining support mechanism. The orthogonal test method was used to optimize the structural parameters of the probe,and determine the optimal dimensions. The isotropy,sensitivity,natural frequency and transient response of the probe were verified by the finite element method. The curve of the probe stiffness respecting the axial extension of suspension wire was obtained by applying the simulation. The result indicates that the probe has a certain variable stiffness performance. The proposed variable stiffness probe enriches the structure of the existing probe,and the research results laid a foundation for the practical application of this type probe structure.
引文
1 He M,Liu R,Li Y,et al.Tactile probing system based on microfabricated capacitive sensor.Sensors&Actuators a Physical,2013;194:128-134
2吴俊杰,李源,李东升,等.MEMS电容式三维微触觉测头设计及校准.光学精密工程,2013;21(12):3087-3094Wu Junjie,Li Yuan,Li Dongsheng,et al.MEMS capacitive threedimensional micro-tactile head design and calibration.Optics and Precision Engineering,2013;21(12):3087-3094
3陈晓怀,陈贺,王珊,等.微纳测量机测头弹性结构的参数设计.光学精密工程,2013;21(10):2587-2593Chen Xiaohuai,Chen He,Wang Shan,et al.Parameter design of the elastic structure of the micro-machined measuring head.Optics and Precision Engineering,2013;21(10):2587-2593
4 Alblalaihid K,Kinnell P,Lawes S.Fabrication and characterisation of a novel smart suspension for micro-CMM probes.Sensors&Actuators a Physical,2015;232:368-375
5 Alblalaihid K,Kirk T,Lawes S,et al.Fabrication of a smart suspension structure of micro tactile probing.Procedia Engineering,2014;87:1164-1167
6 Bonello P,Brennan M J,Elliott S J,et al.Designs for an adaptive tuned vibration absorber with variable shape stiffness element.Proceedings Mathematical Physical&Engineering Sciences,2005;461(2064):3955-3976
7 Challa V R,Prasad M G,Shi Y,et al.A vibration energy harvesting device with bidirectional resonance frequency tunability.Smart Materials&Structures,2008;17(1):15010-15035
8刘芳芳,费业泰,夏豪杰.纳米坐标测量机的三维接触式测头机构.纳米技术与精密工程,2011;9(3):249-252Liu Fangfang,Fei Yetai,Xia Haojie.Three-dimensional contact probe mechanism of nano coordinate measuring machine.Nanotechnology and Precision Engineering,2011;9(3):249-252
9查小娜,杨洪涛,费业泰.三维纳米接触式测头结构设计与优化.安徽理工大学学报(自然科学版),2015;35(4):40-44Zha Xiaona,Yang Hongtao,Fei Yetai.Design and optimization of three-dimensional nano contact probe structure.Journal of Anhui University of Science and Technology(Natural Science),2015;35(4):40-44
10 Pril W.Development of high precision mechanical probes for coordinate measuring machines.Technische Universiteitndhoven,2002;25(2):100-102
11 Alblalaihid K,Lawes S,Kinnell P.Variable stiffness probing systems for micro-coordinate measuring machines.Precision Engineering,2016;43:262-269
12邱轶兵.试验设计与数据处理.合肥:中国科学技术大学出版社,2008:101-127Qiu Yibing.Experimental design and data processing.Hefei:University of Science and Technology of China Press,2008:101-127
13 Fan K C,Cheng F,Pan W T,et al.Analysis of the contact probe mechanism for micro-coordinate measuring machines.Optoelectronics Instrumentation&Data Processing,2010;46(4):340-346
14陈贺,陈晓怀,王珊,等.微纳米测量机测头结构的参数设计及分析.计量学报,2013;34(5):401-405Chen He,Chen Xiaohuai,Wang Shan,et al.Parameter design and analysis of probe structure for micro-nanometers.Journal of the Chinese Society for Metrology,2013;34(5):401-405
15于唤唤,张宏伟,张晓杰,等.触针式光电三维微位移测量系统设计及标定.电子测量与仪器学报,2012;26(7):616-623Yu Huanhuan,Zhang Hongwei,Zhang Xiaojie,et al.Design and calibration of three-dimensional micro-displacement measuring system for stylus photoelectric.Journal of Electronic Measurement and Instrument,2012;26(7):616-623