ZnO纳米颗粒对Cu(Mo)/Sn-3.0Ag-0.5Cu-xZnO焊点界面IMC生长行为的影响
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摘要
采用F4N回流炉制备了0.5wt%和1.0wt%两种ZnO纳米复合钎料Cu(Mo)/Sn-3.0Ag-0.5Cu的焊点。在170℃对焊点进行不同时间(0、48、96、144、192和240 h)的等温时效处理。采用SEM对焊点界面形态进行分析。结果表明随着时效时间的增加,界面形态由间断的扇贝状演化为连续的扇贝状。相同时效时间下,0.5wt%ZnO纳米复合钎料的界面金属间化合物(IMC)层较1.0wt%ZnO复合钎料的界面平缓,界面IMC的扩散系数随着ZnO含量的增加而增大,分别为5.44×10~(-18)m~2/s和8.03×10~(-18) m~2/s。探明了ZnO纳米颗粒阻碍界面IMC层生长的机理。
Cu(Mo)/Sn-3.0Ag-0.5Cu solder joints were prepared by using F4N reflux furnace and 0.5 wt% and 1.0 wt%ZnO nano composite solders. Isothermal aging treatment of solder joints was carried out for different time(0, 48, 96, 144, 192 and 240 h) at 170 C. Interface morphology was analyzed by SEM. The results show that with the increase of aging time, the interface morphology evolves from interval scallop shape to continuous scallop type. Compared with intermetallic compound(IMC) layer of 1.0 wt% ZnO nano composite solder, the IMC layer of 0.5 wt% ZnO nano composite solder is flatter under the same aging time. The diffusion coefficients of interfacial IMC layer increases with the increase of content of ZnO, which are 5.44 ×10~(-18) m~2/s and 8.03 ×10~(-18) m~2/s, respectively. The mechanism of interfacial IMC layer growth hindered by ZnO nanoparticles has been explored.
Cu(Mo)/Sn-3.0Ag-0.5Cu solder joints were prepared by using F4N reflux furnace and 0.5 wt% and 1.0 wt%ZnO nano composite solders. Isothermal aging treatment of solder joints was carried out for different time(0, 48, 96, 144, 192 and 240 h) at 170 C. Interface morphology was analyzed by SEM. The results show that with the increase of aging time, the interface morphology evolves from interval scallop shape to continuous scallop type. Compared with intermetallic compound(IMC) layer of 1.0 wt% ZnO nano composite solder, the IMC layer of 0.5 wt% ZnO nano composite solder is flatter under the same aging time. The diffusion coefficients of interfacial IMC layer increases with the increase of content of ZnO, which are 5.44 ×10~(-18) m~2/s and 8.03 ×10~(-18) m~2/s, respectively. The mechanism of interfacial IMC layer growth hindered by ZnO nanoparticles has been explored.
引文
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[3]王要利,张柯柯,乔新贺,等.RE对Sn2.5Ag0.7Cu/Cu焊点性能的影响[J].中国有色金属学报,2012,22(5):1407-1412.
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[5]李小军,田君,戴品强,等.RE及Ni对Zn20Sn高温无铅钎料显微组织及性能的影响[J].稀有金属材料与工程,2018,47(6):1860-1865.
[6]Hu X W,Li Y L,Lin Y,et al.Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification[J].Journal of Alloys and Compounds,2015,625:241-250.
[7]El-Daly A A,El-Taher A M,Gouda S.Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products[J].Materials Design,2015,65:796-805.
[8]El-Daly A A,El-Taher A M,Dalloul T R.Enhanced ductility and mechanical strength of Ni-doped Sn-3.0Ag-0.5Cu lead-free solders[J].Materials and Design,2014,55:309-318.
[9]张亮,韩继光,何成文,等.热循环对SnAg Cu(纳米Al)/Cu焊点界面与性能影响[J].材料工程,2014(3):55-59.
[10]成军,屈敏,崔岩,等.低Ag无铅钎料SnAg CuBiNi的界面生长与可靠性分析[J].特种铸造及有色合金,2017(10):117-120.
[11]HodúlovúE,Palcut M,Lechovic姚E,et al.Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X(X=Bi,In)solders with Cu substrate[J].Journal of Alloys and Compounds,2011,509(25):7052-7059.
[12]Tu X X,Yi D Q,Wu J.Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints:thermal behavior,microstructure and mechanical properties[J].Journal of Alloys and Compounds,2017,698:317-328.
[13]Tang Y,Luo S M,Wang K Q,et al.Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-TiO2solder joints[J].Journal of Alloys and Compounds,2016,684:299-309.
[14]Mehrabi K,Khodabakhshi F,Zareh E,et al.Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys[J].Journal of Alloys and Compounds,2016,688:143-155.
[15]El-Daly A A,Desoky W M,Elmosalami T A,et al.Microstructural modifications and properties of SiC nanoparticles-reinforced Sn-3.0Ag-0.5Cu solder alloy[J].Materials and Design,2015,65:196-1204.
[16]Zhang Z,Hu X W,Jiang X X,et al.Influences of mono-Ni(P)and dual-Cu/Ni(P)plating on the interfacial microstructure evolution of solder joints[J].Metallurgical and Materials Transactions A,2019,50(1):480-492.
[17]Qu M,Cao T Z,Cui Y,et al.Influence of ZnO particles addition on interface morphology evolution of Sn-3Ag-0.5Cu solder joints[J].AIP Conference Proceedings,1971(1):050009.
[18]Gu Y,Zhao X C,Li Y,et al.Effect of nano-Fe2O3additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates[J].Journal of Alloys and Compounds,2015,627:39-47.