Cu-Ni-Ti合金的成分-弹性性能关系的高通量表征
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摘要
铍铜合金性能优异,但潜存毒性危害, Cu-Ni-Ti合金是替代铍铜的潜在候选材料。采用多元扩散偶实验方法对Cu-Ni-Ti合金展开研究,进行Cu-Ni-Ti合金的成分-弹性性能关系的高通量表征。结果表明,根据成分变化情况可将扩散偶Cu-Ni-Ti界面扩散层分为具有独特相组成的若干区域。在650℃热处理400 h后的Cu-Ni-Ti界面扩散层的纳米压痕点区域包括了纯Cu, fcc(Cu), CuTi, fcc(Ti),纯Ti和Cu-Ni无限互溶固溶体等几个相区,在700℃热处理400 h后的Cu-Ni-Ti界面扩散层的压痕点区域依次包括了纯Ti, hcp(Ti),化合物两相区、 Cu-Ni固溶体和纯Ni等几个相区。对应不同相区域和成分,其弹性模量和硬度呈现一定的规律性变化。由本文所述的高通量研究方法和实验结果,可对Cu-Ni-Ti铜合金体系的成分-弹性性能关系进行定性或定量分析。
Beryllium copper elastic alloys show excellent properties but have the danger of poisonousness. The Cu-Ni-Ti alloy is a potential alternative as the substitution of beryllium copper alloy. At present, a high-throughput diffusion-multiple experiment was done to investigate the composition-elasticity relationship of the Cu-Ni-Ti alloy. The results showed that the diffusion layer could be divided into several parts with different phases by the composition distribution. The nanoindentation region of the diffusion layer after the diffusion-multiple sample heating for 400 h at 650 ℃ consisted of pure Cu, fcc(Cu), CuTi, fcc(Ti), pure Ti and Cu-Ni binary solution. The nanoindentation region after the sample heating for 400 h at 700 ℃ consisted of pure Ti, hcp(Ti), two-compound region, Cu-Ni binary solution and pure Ni. The elastic modulus and hardness showed regular changes in different phase regions. On the basis of the high-throughput approach and the results obtained, the relationship between the composition and elasticity of Cu-Ni-Ti copper alloy could be analyzed qualitatively or quantitatively.
Beryllium copper elastic alloys show excellent properties but have the danger of poisonousness. The Cu-Ni-Ti alloy is a potential alternative as the substitution of beryllium copper alloy. At present, a high-throughput diffusion-multiple experiment was done to investigate the composition-elasticity relationship of the Cu-Ni-Ti alloy. The results showed that the diffusion layer could be divided into several parts with different phases by the composition distribution. The nanoindentation region of the diffusion layer after the diffusion-multiple sample heating for 400 h at 650 ℃ consisted of pure Cu, fcc(Cu), CuTi, fcc(Ti), pure Ti and Cu-Ni binary solution. The nanoindentation region after the sample heating for 400 h at 700 ℃ consisted of pure Ti, hcp(Ti), two-compound region, Cu-Ni binary solution and pure Ni. The elastic modulus and hardness showed regular changes in different phase regions. On the basis of the high-throughput approach and the results obtained, the relationship between the composition and elasticity of Cu-Ni-Ti copper alloy could be analyzed qualitatively or quantitatively.
引文
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[3] Tang R J,Wang J,Yin J L,Yan B,You F Q.Research of new copper based elastic alloy [J].Materials Reviews,2005,19(1):54.(唐人剑,王军,殷俊林,严彪,尤富强.新型弹性合金研究 [J].材料导报,2005,19(1):54.)
[4] Gong S P.The development and application of copper based elastic alloy [J].Nonferrous Metals Processing,2005,34(2):33.(龚寿鹏.铜基弹性合金的开发与应用 [J].有色金属加工,2005,34(2):33.)
[5] Zhao Y,Huang G J,Wang J W.The solid phase transition layer sequences of the Cu-Ni-Sn diffusion couple interface [J].Chinese Journal of Rare Metals,2017,41(2):140.(赵洋,黄国杰,王建伟.Cu-Ni-Sn扩散偶的界面过渡层固相序列分析 [J].稀有金属,2017,41(2):140.)
[6] Yuan H F,Xu L.Research status and development trend of the elastic copper alloy [J].Hunan Nonferrous Metals,2014,30(3):46.(苑和锋,徐玲.弹性铜合金研究现状及发展趋势 [J].湖南有色金属,2014,30(3):46.)
[7] Zhao J C.A combinatorial approach for efficient mapping of phase diagrams and properties [J].J.Mater.Res.,2011,16(6):1565.
[8] Cahn Robert W.Materials science:rapidally assessment[J].Nature,2001(410):643.
[9] Zeng K,Stierman R,Chiu T C,Edwards D,Ano K,Tu K N.Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability [J].Journal of Applied Physics,2005,97(2):024508.
[10] Son H Y,Jung G J,Park B J,Paik K W.A study on the thermal reliability of Cu/SnAg double-bump flip-chip assemblies on organic substrates [J].Journal of Electronic Materials,2008,37(12):1832.
[11] Xu L,Pang J,Che F.Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level reliability [J].Journal of Electronic Materials,2008,37(6):880.
[12] Kerstin Wernberg,Thomas Bohme,Wolfgang H.Muller.Kirkendall voids in the intermetallic layers of solder joints MEMS [J].Computational Materials Science,2009,45(3):827.
[13] Levchenko V A,Borisenko V A.Temperature dependence of the elastic modulus of copper and its alloys [J].Chemical and Petroleum Engineering,1978,14(7):609.
[14] Wang J,Liu C L,Leinenbach C,Ulrich E K,Peter J U,Jrg F L.Experimental investigation and thermodynamic assessment of the Cu-Sn-Ti ternary system [J].CALPHAD,2011,35(1):82.
[15] Johnson W L.Thermodynamic and kinetic aspects of the crystal to glass transformation in metallic materials [J].Prog.in Mater.Sci.,1986,30:81.
[16] d′Heurle F M.Nucleation of a new phase from the interaction of two adjacent phases [J].J.Mater.Res.,1988,3:167.
[17] Clevenger L A,Thompson C V.Nucleation-limited phase selection during reactions in Ni/Si multilayer thin films [J].J.Appl.Phys.,1990,67:1325.
[18] Lee B J,Hwang H M,Lee H M.Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation [J].Acta Mater.,1997,45:1867.