镍元素对AgCu28钎焊焊缝的影响
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摘要
在氢气气氛下,对TU1、4J33和镀镍4J33进行钎焊,使用钎料为AgCu28和AgCu28Ni0.75,利用扫描电镜、能谱分析仪和金相显微镜,对钎焊焊缝微观组织形貌进行观测。结果表明,在实验的钎焊工艺下,AgCu28钎料钎焊TU1的焊缝组织良好,为银铜共晶组织,基本无晶界渗透现象,AgCu28Ni0.75钎料钎焊TU1的焊缝,钎料向母材晶界渗透现象严重;在AgCu28钎料中添加镍元素,或被焊母材含有镍元素或者被焊接母材外有镀镍层时,钎焊焊缝出现明显的成分偏析现象。
Herein,we experimentally addressed the brazing in H_2 atmosphere of microwave electric vacuum device components,made of TU1,4 J33 and Ni-plated 4 J33 alloys,with AgCu28 and AgCu28 Ni0.75 solders.The influence of the addition of Ni in AgCu28 solder on the microstructures,phases and mechanical behavior of the welded seam was investigated with scanning electron microscope,energy dispersive spectroscopy and metallographic microscope.The preliminary results show that the Ni addition had a major impact.To be specific,Ag-Cu eutectic alloy formed at the well-brazed TU1 seam with no grain boundary penetration;AgCu28 Ni0.75 solder was found to seriously diffuse into the grain boundaries of the base metal.In addition,the Ni,added into AgCu28 solder and/or plated on the base metal surfaces,accounted for the significant surface segregation.
Herein,we experimentally addressed the brazing in H_2 atmosphere of microwave electric vacuum device components,made of TU1,4 J33 and Ni-plated 4 J33 alloys,with AgCu28 and AgCu28 Ni0.75 solders.The influence of the addition of Ni in AgCu28 solder on the microstructures,phases and mechanical behavior of the welded seam was investigated with scanning electron microscope,energy dispersive spectroscopy and metallographic microscope.The preliminary results show that the Ni addition had a major impact.To be specific,Ag-Cu eutectic alloy formed at the well-brazed TU1 seam with no grain boundary penetration;AgCu28 Ni0.75 solder was found to seriously diffuse into the grain boundaries of the base metal.In addition,the Ni,added into AgCu28 solder and/or plated on the base metal surfaces,accounted for the significant surface segregation.
引文
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[3] 刘燕文,王小霞,田宏,等.纳米粒子薄膜热电子发射性能[J].中国科学信息科学,2015,45:145-156
[4] Shin Y M,Barnett L R,Gamzina D,et al.Terahertz Vacuum Electronic Circuits Fabricated by UV Lithographic Molding and Reactive Ion Etching[J].Applied Physics Letter,2009,95(18):181 505-1-181 505-3
[5] 刘燕文,田宏,陆玉新,等.用于浸渍阴极的钨海绵基体的净化[J].真空科学与技术学报,2018,38(2):144-149
[6] James A.Dayton,Jr,et al.Diamond-Studded Helical Traveling Wave Tube[J].IEEE Transactions on Electron Devices,2005,52(5):695-701
[7] 翟会敏,刘敏玉,陈炳林.A-95陶瓷输能窗热冲击下失效原因分析[J].真空电子技术,2017,(5):77-79
[8] 陈昀,杨磊,梁田,等.陶瓷-金属封接部件的失效分析[J].真空电子技术,2017,(5):32-42
[9] 刘联宝.陶瓷-金属封接技术指南[M].北京:国防工业出版社,1990
[10] 王卫杰,何晓梅.Ag-Cu-Ni焊料在真空开关管中的应用研究[J].真空电子技术,2004,(4):45-48
[11] 《电子工业生产技术手册》编委会.电子工业生产技术手册(4)电真空器件卷[M].北京:国防工业出版社,1990
[12] 刘浩博,秦优琼,孙磊,等.Ag-Cu共晶钎料的真空钎焊紫铜工艺[J].上海工程技术大学学报,2013,27(2):147-150
[13] 张启运,庄鸿寿.钎焊手册(第2版)[M].北京:机械工业出版社,2008
[14] 连欣,曲文卿,李海涛,等.AgCu28 钎料钎焊无氧铜晶界渗透行为分析[J].北京航空航天大学学报,2014,40(5):717-720
[15] 方继恒,张吉明,田娟娟,等.连铸Ag-28Cu-0.75Ni 合金相组成、组织及性能[J].稀有金属,2017,41(7):759-767
[16] 崔忠圻,谭耀春.金属学与热处理(第二版)[M].北京:机械工业出版社,2007
[17] 何鹏,曹健,徐富家,等.Ag-28Cu钎焊TA2/BT20接头组织分析[J].焊接学报,2009,30(12):9-12
[18] 俞伟元,陈学定,路文江,等.铝钎焊接头中Cu元素的扩散行为研究[J].材料科学与工艺,2007,15(3):383-386