基于选择性激光烧结的石墨骨架电镀铜工艺实验研究
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摘要
为改善结合界面的状况,缩短工艺流程,降低铜的消耗,减少生产投入,采用选择性激光烧结成型技术快速制备多孔石墨成型件。在此基础上,研究了不同石墨预制体状态、电镀工艺参数和电镀时间对镀层的沉积速率、表观形貌以及镀层与基体结合状况的影响。结果表明:未经真空压力浸渍酚醛树脂的石墨预制体,其镀层与基体的结合力不符合应用要求,在真空压力下浸渍酚醛树脂2～3次后,镀层沉积速率较佳,镀层与基体的结合力符合应用要求;电镀时间为30～50min时,沉积速率较佳,可得到表面覆盖完整、连续且有光泽的镀层;电流密度为5×102～6.25×10~2 A·m~(-2)时,镀层晶粒均匀致密,可得到较佳的镀层。
To improve the interface,shorten the process,and reduce copper consumption as well as production input,we use selective laser sintering technology to rapidly prepare molded parts of porous graphite.The effects of graphite preformation states,electroplating process parameters,and plating time on the deposition rate,the apparent morphology and bonding conditions of the plating and substrate are studied.The results reveal that for the preformed graphite that is not impregnated with phenolic resin,the bonding strength between the plating and the substrate does not meet the application requirements.After the preformed graphite is immersed in phenolic resin for 2-3 times under a vacuum pressure,the plating deposition rate is best,and the bonding force between the plating and the substrate meets the application requirements.When the electroplating time is 30 min to 50 min,the deposition rate is best,and a complete,continuous,and glossy plating on the surface can be obtained.When the current density is 5×10~2-6.25×10~2 A·m~(-2),the plated grains are uniform and dense,and a better plating can be obtained.
To improve the interface,shorten the process,and reduce copper consumption as well as production input,we use selective laser sintering technology to rapidly prepare molded parts of porous graphite.The effects of graphite preformation states,electroplating process parameters,and plating time on the deposition rate,the apparent morphology and bonding conditions of the plating and substrate are studied.The results reveal that for the preformed graphite that is not impregnated with phenolic resin,the bonding strength between the plating and the substrate does not meet the application requirements.After the preformed graphite is immersed in phenolic resin for 2-3 times under a vacuum pressure,the plating deposition rate is best,and the bonding force between the plating and the substrate meets the application requirements.When the electroplating time is 30 min to 50 min,the deposition rate is best,and a complete,continuous,and glossy plating on the surface can be obtained.When the current density is 5×10~2-6.25×10~2 A·m~(-2),the plated grains are uniform and dense,and a better plating can be obtained.
引文
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[3]Zhan Y Z,Zhang G D.Graphite and SiC hybrid particles reinforced copper composite and its tribological characteristic[J].Journal of Materials Science Letters,2003,22(15):1087-1089.
[4]Queipo P,Granda M,Santamaría R,et al.Preparation of pitch-based carbon-copper composites for electrical applications[J].Fuel,2004,83(11/12):1625-1634.
[5]Wang W F,Xu S F,Ying M F,et al.Research on the copper coating graphite copper matrix composites[J].Journal of Hefei University of Technology(Natural Science),1999(1):37-40.王文芳,许少凡,应美芳,等.镀铜石墨-铜基复合材料组织与性能研究[J].合肥工业大学学报(自然科学版),1999(1):37-40.
[6]Li C Q,Wang Z T,Zhao G G.Characteristics of electroless copper-coated graphite and its copper matrix composites[J].Journal of Heilongjiang Institute of Science and Technology,2011,21(5):349-352,399.李长青,王振廷,赵国刚.化学镀铜石墨粉及其铜基复合材料的性能[J].黑龙江科技学院学报,2011,21(5):349-352,399.
[7]Wen C C,Kuo W S.Experimental study on shear failure behaviors and wear resistance of copperelectroplated graphite compacts[J].Advanced Materials Research,2014,934:53-59.
[8]Liu J.Preparation and friction and wear properties of copper-based composite pantograph slides[D].Changsha:Hunan University,2007.刘军.铜基复合材料受电弓滑板的制备及其摩擦磨损性能研究[D].长沙:湖南大学,2007.
[9]Wu H H,Yan J N,Li T F,et al.Experimental study on molding precision for Graphite/Phenolic resin mixed powders processed by selective laser sintering[J].Laser&Optoelectronics Progress,2017,54(8):081405.吴海华,鄢俊能,李腾飞,等.石墨/酚醛树脂混合粉末选择性激光烧结成型精度实验研究[J].激光与光电子学进展,2017,54(8):081405.
[10]Wu H H,Li T F,Xiao L N,et al.Research on forming process of flake graphite powder by selective laser sintering[J].Laser&Optoelectronics Progress,2016,53(10):101409.吴海华,李腾飞,肖林楠,等.鳞片石墨粉末选择性激光烧结成型工艺研究[J].激光与光电子学进展,2016,53(10):101409.
[11]State Bureau of Technical Supervision.Adhesives,180°peel strength test method for a flexible-bongedto-rigid test specimen assembly:GB/T 2790-1995[S].Beijing:China Standards Press,1996-08-01.国家技术监督局.胶粘剂180°剥离强度试验方法:挠性材料对刚性材料:GB/T 2790-1995[S].北京:中国标准出版社,1996-08-01.
[12]Zhang Y C,Hu R N,Xiang R.Electroplating handbook[M].4th ed.Beijing:National Defense Industry Press,2011:15-26.张允诚,胡如南,向荣.电镀手册[M].4版,北京:国防工业出版社,2011:15-26.
[13]Andersen J E,Bech-Nielsen G,Mller P.Bulk crystalline copper electrodeposited on polycrystalline gold surfaces observed by in-situ scanning tunneling microscopy[J].Surface&Coatings Technology,1994,70(1):87-95.