基于有限元法的IGBT模块复合材料等效导热率计算研究
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摘要
在柔性直流输电飞速发展驱使下,IGBT模块日益小型化,其内部发热问题愈加严重,因此,对IGBT模块内部散热问题的研究具有很实际的价值。针对现有材料导热率研究的计算均有相应的局限性问题,采取有限元分析方法建立ANSYS有限元分析模型,研究了复合材料等效导热率计算的方法,对比Maxwell-Eucken方程、文献中的试验数据以及所提方法的计算结果,说明所提方法的可行性。最后利用所提方法,得出了考虑填料的形状、大小、体积分数、填料颗粒导热率、填料颗粒团聚等因素对复合材料等效导热率的变化规律。
In order to adapt to the development of flexible HVDC transmission technology, IGBT modules are becoming smaller, but the internal heating problem of IGBT modules is becoming more and more prominent. Therefore, the issues related to thermal dissipation of IGBT module packages for further exploration have an important guiding significance and practical value. The numerical calculation has its own scope of application and limitation, and the experimental studies are reliable but high cost.At present, ANSYS finite element method to calculate equivalent thermal conductivity of polymeric composites is seldom reported. Then, the method to calculate equivalent thermal conductivity of polymeric composites is studied based on finite element method.The comparison of Maxwell-Eucken equations, experimental results of reference and the obtained results shows the feasibility of this method. Finally, The change regulations of equivalent thermal conductivity of composites considering the factor of filler shape, size, volume fraction, the thermal conductivity of filler particles, particles agglomeration are obtained.
In order to adapt to the development of flexible HVDC transmission technology, IGBT modules are becoming smaller, but the internal heating problem of IGBT modules is becoming more and more prominent. Therefore, the issues related to thermal dissipation of IGBT module packages for further exploration have an important guiding significance and practical value. The numerical calculation has its own scope of application and limitation, and the experimental studies are reliable but high cost.At present, ANSYS finite element method to calculate equivalent thermal conductivity of polymeric composites is seldom reported. Then, the method to calculate equivalent thermal conductivity of polymeric composites is studied based on finite element method.The comparison of Maxwell-Eucken equations, experimental results of reference and the obtained results shows the feasibility of this method. Finally, The change regulations of equivalent thermal conductivity of composites considering the factor of filler shape, size, volume fraction, the thermal conductivity of filler particles, particles agglomeration are obtained.
引文
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[21] I.A.Tsekmes,R.Kochetov,P.H.F.Morshuis,et al.Modeling the Thermal Conductivity of Polymeric Composites Based on Experimental Observations[J].IEEE Transactions on Dielectrics and Electrical Insulation,2014,21(2):412-423.
[2] 叶宏,徐斌,王军,等.陶瓷微球填充型隔热涂料的有效导热系数[J].中国科学技术大学学报(自然科学版).2006,36(4):361-363.
[3] 陈则韶,钱军,叶一火.复合材料等效导热系数的理论推算[J].中国科学技术大学学报(自然科学版),2004,34(4):417-423.
[4] 刘祥宽,Mehari Salomon,胡献国,等.基于球型填充相复合材料有效导热系数的计算[J].合肥工业大学学报(自然科学版),2008,31(9):1378-1381.
[5] 王璞玉,胡旭晓,周洁,等.聚合物基复合材料导热模型的研究现状及应用[J].材料导报:综述篇,2010,24(5):108-112.
[6] 刘金世,薛庆忠.碳纳米管复合材料的有效导热率[J].石油大学学报,2004,28(5):142-144.
[7] 闵新民,安继明,饶宝林,等.聚合物基纳米复合材料导热率计算[J].武汉理工大学学报,2007,29(7):26-29.
[8] 周远翔,郭绍伟,聂琼,等.纳米氧化铝对硅橡胶空间电荷特性的影响[J].高电压技术,2010,36(7):1605-1611.
[9] 徐晓英,王世安,王辉.复合导电高分子材料微观网络结构及导电行为仿真分析[J].高电压技术,2012,38(9):2221-2229.
[10] Kumlutas D,Tavman I H.A Numerical and Experimental Study on Thermal Conductivity of Particle Filled Polymer Composites [J].Journal of Thermlplastics Composite Materials,2006,19(4):441-455.
[11] Atila M.Optimization of High Pin Count Cavity-up Enhanced Plastic Ball Grid Array (EPBGA) Packages for Robust Design [C].In:Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference,INTERPACK′97,New York:IEEE,1997:376-388.
[12] Yin Y,Tu S T.Thermal Conductivities of PTFE Composites With Random Distributed Graphite Particles [J].Journal of Reinforced Plastics and Composites,2002,21(18):1619-1627.
[13] Tu S T,Cai W Z,Yin Y,et al.Numerical Simulation of Saturation Behavior of Physical Properties in Composites with Randomly Distributed Second-phase [J].Journal of Composite Materials,2005,39(7):617-631.
[14] 张朝晖.ANSYS热分析工程与应用[M].北京:中国铁道出版社,2010.
[15] 杨强生,浦保荣.高等传热学:热传导和对流传热与传质[M].上海:上海交通大学出版社,1996.
[16] V.J.Ervin,J.W.Klett,C.M.Mundt.Estimation of the Thermal Conductivity of Composites[J].Journal of Materials Science,1999,34(14):3545-3553.
[17] R.Kochetov.Thermal and Electrical Properties of Nanocomposites,Including Material Processing,Ph.D.Degree Dissertation[D].The Netherlands:Delft University of Technology,2012.
[18] 杨世铭,陶文铨.传热学[M].北京:北京高等教育出版社,2006.
[19] Z.Han,J.W.Wood,H.Herman,et al.Thermal Properties of Composites Filled with Different Fillers[C].Conference Record of the IEEE International 2008:497-501.
[20] W.Evans,R.Prasher,J.Fish,et al.Effect of Aggregation and Interfacial Thermal Resistance on Thermal Conductivity of Nanocomposites and Colloidal Nanofluids[J].Internationat Journal of Heat and Mass Transfer,2008,51:1431-1438.
[21] I.A.Tsekmes,R.Kochetov,P.H.F.Morshuis,et al.Modeling the Thermal Conductivity of Polymeric Composites Based on Experimental Observations[J].IEEE Transactions on Dielectrics and Electrical Insulation,2014,21(2):412-423.