Ag-Cu钎料钎焊ZTA陶瓷与TC4钛合金
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  • 英文篇名:Brazing ZTA ceramic to TC4 alloy using Ag-Cu filler metal
  • 作者:王晓阳 ; 曹健 ; 代翔宇 ; 冯吉才
  • 英文作者:WANG Xiaoyang;CAO Jian;DAI Xiangyu;FENG Jicai;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology;
  • 关键词:ZTA陶瓷 ; TC4钛合金 ; 钎焊 ; 界面组织
  • 英文关键词:ZTA ceramic;;TC4 alloy;;brazing;;interface microstructure
  • 中文刊名:HJXB
  • 英文刊名:Transactions of the China Welding Institution
  • 机构:哈尔滨工业大学先进焊接与连接国家重点实验室;
  • 出版日期:2019-03-25
  • 出版单位:焊接学报
  • 年:2019
  • 期:v.40
  • 基金:国家自然科学基金资助项目(51622503;U1537206)
  • 语种:中文;
  • 页:HJXB201903010
  • 页数:7
  • CN:03
  • ISSN:23-1178/TG
  • 分类号:53-57+64+169
摘要
使用Ag-Cu钎料钎焊ZTA陶瓷与TC4钛合金,利用扫描电子显微镜(SEM)、能谱分析仪(EDS)和X射线衍射仪(XRD)等设备分析了钎焊接头界面组织,阐明了反应机理,并研究了钎焊温度对接头界面组织和力学性能的影响.结果表明,钎焊接头的界面结构为ZTA陶瓷/TiO+Ti_3(Cu,Al)_3O/Ag(s,s)/Ti_2Cu_3/TiCu/Ti_2Cu/α+β-Ti/TC4合金.随着钎焊温度的升高,钎缝中Ag基固溶体层变薄,Ti-Cu金属间化合物层变厚,当钎焊温度达到890℃时,Ti-Cu金属间化合物几乎占据整了个钎缝区域.随着温度的升高,接头抗剪强度先增大后减小,在钎焊温度为890℃时,接头的室温抗剪强度达到最大值,其值为43.2 MPa.
        Ag-Cu filler was used to braze ZTA ceramic and TC4 alloy. Scanning electron microscopy, energy disperse spectroscopy and X ray diffraction were used to identify the interfacial microstructure and the reaction mechanism of the joints was clarified. The typical interfacial microstructure was ZTA ceramic/TiO+Ti_3(Cu,Al)_3O/Ag(s,s)/Ti_2Cu_3/TiCu/Ti_2Cu/α+β-Ti/TC4 alloy. The experiments were carried at the brazing temperature from 810 °C to 910 °C. The results indicated that as the brazing temperature increased, Ag-based solid solution layer thinned and Ti-Cu intermetallic compound layers thickened. When brazed at 890 °C for 10 min, Ti-Cu intermetallic compounds occupied almost the entire brazing area, and the shear strength of the joints reached the highest value of 43.2 MPa.
引文
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