前处理工艺对钛合金化学镀镍性能的影响
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摘要
研究了三种前处理工艺对钛合金化学镀镍的影响,通过扫描电子显微镜、弯折试验仪、维氏硬度计、电化学曲线对化学镀镍层的微观形貌、结合力、硬度、耐蚀性进行了表征与分析。结果表明:采用浸蚀/浸锌前处理工艺获取的化学镀镍层结晶最致密,孔隙最少,与基体表面的结合力最好,镀层的硬度可达534 HV,镀层自腐蚀电位为-0.3980 V,自腐蚀电流密度为2.927μA·cm-2,其耐蚀性优于其他两种前处理工艺获得的镀层。
The effects of three pretreatment processes on the electroless nickel plating of titanium alloy were studied. Scanning electron microscopy(SEM),bending tester,Vickers hardness tester and electrochemical curve were used to analyze the microstructure,bonding strength,hardness and corrosion resis-tance of the nickel plating. The results showed that the nickel plating layer obtained through the etchingand zinc leaching pretreatment had the most compact crystals,the smallest pores and the best adhesionof the substrate. The nickel plating prepared by this method is with the hardness of 534 HV,the self-corrosion potential of -0.3980 V and the self-corrosion current density of 2.927 μA·cm-2,possessing thebetter corrosion resistance than the other two coatings prepared by other pretreatment processes.
The effects of three pretreatment processes on the electroless nickel plating of titanium alloy were studied. Scanning electron microscopy(SEM),bending tester,Vickers hardness tester and electrochemical curve were used to analyze the microstructure,bonding strength,hardness and corrosion resis-tance of the nickel plating. The results showed that the nickel plating layer obtained through the etchingand zinc leaching pretreatment had the most compact crystals,the smallest pores and the best adhesionof the substrate. The nickel plating prepared by this method is with the hardness of 534 HV,the self-corrosion potential of -0.3980 V and the self-corrosion current density of 2.927 μA·cm-2,possessing thebetter corrosion resistance than the other two coatings prepared by other pretreatment processes.
引文
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[2] Huang T C,Wei M C,Chen H I. Preparation of hydro-gen-permselective palladium-silver alloy composite mem-branes by electroless co-deposition[J]. Separation&Pu-rification Technology,2003,32(1-3):239-245.
[3]李宁,袁国伟,黎德育.化学镀镍基合金理论与技术[M].哈尔滨:哈尔滨工业大学出版社,2000.
[4]吴振东,李阿丹,于升学.钛合金表面复合化学镀NiP-金刚石微粉工艺[J].新技术新工艺,2003,9:44-45.
[5]翟金坤.化学镀镍磷合金镀层的原理与应用[J].中国表面工程,1988,1:20-22.
[6]姜晓霞,沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000.
[7]刘海萍,李正,毕四富,等.化学镀Ni-P基体的磷含量对亚硫酸盐镀金体系置换镀金层表面形貌的影响[J].复旦学报(自然科学版),2012,51(2):196-200.
[8]邵光杰,秦秀娟.电镀Ni-P合金镀层工艺研究[J].材料保护,2000,33(6):3-5.
[9]周伟岩,康书文.钛合金化学镀镍工艺[J].电镀与精饰,2006,28(3):20-21.
[10]李东光.化学镀液配方与制备200例[M].北京:化学工业出版社,2012.
[11]Krulik G A,Mandich N V. Low corrosivity catalyst con-taining ammonium ions for activation of copper for elec-troless nickel plating[P]. US5219815. 1993.
[12]Krishnan K H,John S,Srinivasan K N,et al. An overallaspect of electroless Ni-P depositions:A review article[J]. Metallurgical&Materials Transactions A,2006,37(6):1917-1926.
[13]康新婷.钛基体表面处理对无氰电刷镀银结合力的影响[J].钛工业进展,2005,22(3):15-17.
[14]黄晓梅,李宁,蒋丽敏,等.铝及铝合金电镀的浸锌工艺[J].电镀与环保,2005,25(2):1-4.
[15]刘建华,吴国龙,李松梅,等.化学方法退除钛合金阳极氧化膜的对比研究[J].稀有金属材料与工程,2012,41(8):1331-1335.