248nm准分子激光刻蚀的无裂损石英玻璃表面微通道
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摘要
利用248nm纳秒准分子激光,采用掩模投影和石英玻璃前表面直写刻蚀的方法,研究了激光脉冲能量密度、重复频率、扫描次数对微通道裂损的影响规律,分析了石英玻璃激光刻蚀及裂损的机理。结果表明,248nm纳秒准分子激光刻蚀石英玻璃的机理为光致电离及热烧蚀的共同作用;无裂损刻蚀JGS1型石英玻璃的激光能量密度阈值范围为16~30J·cm~(-2),刻蚀率可达每脉冲500nm;随着激光重复频率及扫描次数的增加,微通道容易因热积累及等离子体微爆炸冲击作用而裂损。基于优化的激光加工参数,当微通道宽度小于100μm时,可以实现无裂损的直线型(深度小于或等于50μm)及圆弧型(深度小于或等于28.5μm)微通道的加工。
With the method of mask projection and direct-writing etching on the front surface of silica glass by a 248 nm nanosecond excimer laser,the influence laws of laser pulse energy density,repetition frequency,scanning times on micro-groove cracks are studied,and the mechanisms of laser etching and cracking of silica glass are analyzed.The results show that the mechanism of silica glass etched by a 248 nm nanosecond pulse excimer laser is the joint effects of photoionization and thermal ablation.The laser energy density threshold range for the crack-free etching of JGS1 silica glass is 16-30J·cm~(-2) and the etching rate can be up to 500 nm per pulse.With the increase of laser repetition frequency and scanning times,the micro-grooves are easily cracked because of the heat accumulation and plasma micro-explosion shocking.Based on the optimized laser processing parameters,when the width of microgrooves is less than 100μm,the processing of crack-free linear-type(the depth is less than or equal to 50μm)and circular-arc-type(the depth is less than or equal to 28.5μm)micro-grooves can be achieved.
With the method of mask projection and direct-writing etching on the front surface of silica glass by a 248 nm nanosecond excimer laser,the influence laws of laser pulse energy density,repetition frequency,scanning times on micro-groove cracks are studied,and the mechanisms of laser etching and cracking of silica glass are analyzed.The results show that the mechanism of silica glass etched by a 248 nm nanosecond pulse excimer laser is the joint effects of photoionization and thermal ablation.The laser energy density threshold range for the crack-free etching of JGS1 silica glass is 16-30J·cm~(-2) and the etching rate can be up to 500 nm per pulse.With the increase of laser repetition frequency and scanning times,the micro-grooves are easily cracked because of the heat accumulation and plasma micro-explosion shocking.Based on the optimized laser processing parameters,when the width of microgrooves is less than 100μm,the processing of crack-free linear-type(the depth is less than or equal to 50μm)and circular-arc-type(the depth is less than or equal to 28.5μm)micro-grooves can be achieved.
引文
[1]Zheng Xiaolin,Yan Jiawen,Hu Ning,et al.Research progress of materials and fabrication methods of materials and fabrication methods of microfluidic chip[J].Transducer and Microsystem Technologies,2011,30(6):1-4,7.郑小林,鄢佳文,胡宁,等.微流控芯片的材料与加工方法研究进展[J].传感器与微系统,2011,30(6):1-4,7.
[2]Geng Lina,Quan Zongliang,Hou Ni,et al.Improvement of microfluidic chip fabrication for protein separation[J].Transactions of Beijing Institute of Technology,2013,33(4):436-440.耿利娜,全宗良,侯妮,等.蛋白质分离玻璃微流控芯片的制作方法[J].北京理工大学学报,2013,33(4):436-440.
[3]Cheng J Y,Yen M H,Wei C W,et al.Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip[J].Journal of Micromechanics&Microengineering,2005,15(6):1147-1156.
[4]Kawaguchi Y,Niino H,Sato T,et al.A deep micro-trench on silica glass fabricated by laser induced backside wet etching(LIBWE)[J].Journal of Physics:Conference Series,2007,59(1):380-383.
[5]He Fei,Cheng Ya.Femtosecond laser micromachining:Frontier in laser precision micromachining[J].Chinese JLasers,2007,34(5):595-622.何飞,程亚.飞秒激光微加工:激光精密加工领域的新前沿[J].中国激光,2007,34(5):595-622.
[6]Cai Hailong,Yan Xueliang,Wang Sumei,et al.Advances in femtosecond laser fabrication of microchannels[J].Transactions of Beijing Institute of Technology,2012,32(10):991-1003.蔡海龙,闫雪亮,王素梅,等.飞秒激光微通道加工研究进展[J].北京理工大学学报,2012,32(10):991-1003.
[7]He S G,Chen F.Fabrication of three-dimensional helical microchannels with arbitrary length and uniform diameter inside fused silica[J].Optics Letters,2012,37:3825-3827.
[8]Huang Yuanyuan,Qian Jing,Shao Chongyun,et al.Femtosecond laser induced defects in pure silica glass with different hydroxyl concentrations[J].Chinese J Lasers,2017,44(1):0102011.黄媛媛,钱静,邵冲云,等.飞秒激光在不同羟基浓度纯石英玻璃内部诱导缺陷研究[J].中国激光,2017,44(1):0102011.
[9]Hao Yanfei,Sun Mingying,Shi Shuang,et al.Research on rear surface damage in picosecond laser ablation of K9glass[J].Chinese J Lasers,2017,44(1):0102015.郝艳飞,孙明营,时双,等.皮秒激光烧蚀K9玻璃后表面损伤研究[J].中国激光,2017,44(1):0102015.
[10]Lan B,Hong M H,Ye K D.Laser precision engineering of glass substrates[J].Japanese Journal of Applied Physics,2004,43(10):7102-7106.
[11]Wang Shan.A study on laser etching and polishing quartz glasses technology[D].Wuhan:Huazhong University of Science&Technology,2012.王汕.激光刻蚀抛光石英玻璃工艺研究[D].武汉:华中科技大学,2012.
[12]Ihlemann J,Wolff B,Simon P.Nanosecond and femtosecond excimer laser ablation of fused silica[J].Applied Physics A,1992,54(4):363-368.
[13]Dai Yutang,Xu Gang,Cui Jianlei.3Dmicro ablation technique of transparent materials using deep ultraviolet laser[J].Applied Laser,2009,29(5):411-414.戴玉堂,徐刚,崔健磊.透明材料的深紫外激光三维微刻蚀工艺[J].应用激光,2009,29(5):411-414.
[14]Ihlemann J.UV-laser ablation of fused silica mediated by solid coating absorption[C].SPIE,2007,6458:64580E.
[15]Zhang J,Sugioka K,Takahashi T,et al.Dual-beam ablation of fused silica by multiwavelength excitation process using KrF excimer and F2lasers[J].Applied Physics A,2000,71(1):23-26.
[16]Liu Zhichao,Xu Qiao,Ouyang Sheng,et al.Morphology of UV laser initiated damage in fused silica[J].High Power Laser and Particle Beams,2009,21(7):1207-1211.刘志超,许乔,欧阳升,等.熔石英紫外激光初始损伤形态分析分析[J].强激光与离子束,2009,21(7):1207-1211.
[17]Wang Cong.First-principles calculations and their validations for ultrafast micro/nanofabrication based on electron dynamics control[D].Beijing:Beijing Institute of Technology,2014:19-26.王聪.基于电子动态调控的超快激光微纳制造新方法的第一性原理计算及其验证[D].北京:北京理工大学,2014:19-26.
[2]Geng Lina,Quan Zongliang,Hou Ni,et al.Improvement of microfluidic chip fabrication for protein separation[J].Transactions of Beijing Institute of Technology,2013,33(4):436-440.耿利娜,全宗良,侯妮,等.蛋白质分离玻璃微流控芯片的制作方法[J].北京理工大学学报,2013,33(4):436-440.
[3]Cheng J Y,Yen M H,Wei C W,et al.Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip[J].Journal of Micromechanics&Microengineering,2005,15(6):1147-1156.
[4]Kawaguchi Y,Niino H,Sato T,et al.A deep micro-trench on silica glass fabricated by laser induced backside wet etching(LIBWE)[J].Journal of Physics:Conference Series,2007,59(1):380-383.
[5]He Fei,Cheng Ya.Femtosecond laser micromachining:Frontier in laser precision micromachining[J].Chinese JLasers,2007,34(5):595-622.何飞,程亚.飞秒激光微加工:激光精密加工领域的新前沿[J].中国激光,2007,34(5):595-622.
[6]Cai Hailong,Yan Xueliang,Wang Sumei,et al.Advances in femtosecond laser fabrication of microchannels[J].Transactions of Beijing Institute of Technology,2012,32(10):991-1003.蔡海龙,闫雪亮,王素梅,等.飞秒激光微通道加工研究进展[J].北京理工大学学报,2012,32(10):991-1003.
[7]He S G,Chen F.Fabrication of three-dimensional helical microchannels with arbitrary length and uniform diameter inside fused silica[J].Optics Letters,2012,37:3825-3827.
[8]Huang Yuanyuan,Qian Jing,Shao Chongyun,et al.Femtosecond laser induced defects in pure silica glass with different hydroxyl concentrations[J].Chinese J Lasers,2017,44(1):0102011.黄媛媛,钱静,邵冲云,等.飞秒激光在不同羟基浓度纯石英玻璃内部诱导缺陷研究[J].中国激光,2017,44(1):0102011.
[9]Hao Yanfei,Sun Mingying,Shi Shuang,et al.Research on rear surface damage in picosecond laser ablation of K9glass[J].Chinese J Lasers,2017,44(1):0102015.郝艳飞,孙明营,时双,等.皮秒激光烧蚀K9玻璃后表面损伤研究[J].中国激光,2017,44(1):0102015.
[10]Lan B,Hong M H,Ye K D.Laser precision engineering of glass substrates[J].Japanese Journal of Applied Physics,2004,43(10):7102-7106.
[11]Wang Shan.A study on laser etching and polishing quartz glasses technology[D].Wuhan:Huazhong University of Science&Technology,2012.王汕.激光刻蚀抛光石英玻璃工艺研究[D].武汉:华中科技大学,2012.
[12]Ihlemann J,Wolff B,Simon P.Nanosecond and femtosecond excimer laser ablation of fused silica[J].Applied Physics A,1992,54(4):363-368.
[13]Dai Yutang,Xu Gang,Cui Jianlei.3Dmicro ablation technique of transparent materials using deep ultraviolet laser[J].Applied Laser,2009,29(5):411-414.戴玉堂,徐刚,崔健磊.透明材料的深紫外激光三维微刻蚀工艺[J].应用激光,2009,29(5):411-414.
[14]Ihlemann J.UV-laser ablation of fused silica mediated by solid coating absorption[C].SPIE,2007,6458:64580E.
[15]Zhang J,Sugioka K,Takahashi T,et al.Dual-beam ablation of fused silica by multiwavelength excitation process using KrF excimer and F2lasers[J].Applied Physics A,2000,71(1):23-26.
[16]Liu Zhichao,Xu Qiao,Ouyang Sheng,et al.Morphology of UV laser initiated damage in fused silica[J].High Power Laser and Particle Beams,2009,21(7):1207-1211.刘志超,许乔,欧阳升,等.熔石英紫外激光初始损伤形态分析分析[J].强激光与离子束,2009,21(7):1207-1211.
[17]Wang Cong.First-principles calculations and their validations for ultrafast micro/nanofabrication based on electron dynamics control[D].Beijing:Beijing Institute of Technology,2014:19-26.王聪.基于电子动态调控的超快激光微纳制造新方法的第一性原理计算及其验证[D].北京:北京理工大学,2014:19-26.