Ti_3SiC_2陶瓷/Fe扩散连接接头强度及断裂行为
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摘要
在连接温度850～1050℃、保温时间60～120 min、压力10～20 MPa的条件下对Ti_3SiC_2陶瓷和Fe进行真空扩散连接。用剪切实验评价Ti_3SiC_2陶瓷与Fe扩散连接接头强度,并利用扫描电子显微镜(SEM)、能谱仪(EDS)观察分析断口形貌和成分,分析连接工艺参数对接头剪切强度和反应层厚度的影响。结果表明:随着连接温度的升高和保温时间的增加,接头的剪切强度先增加后降低。
Vacuum diffusion bonding of Ti_3SiC_2 and Fe was conducted under the condition of bonding temperature of 850-1050℃, holding time of 60-120 min and pressure of 10-20 MPa. The strength of the diffusion bonding joint of Ti_3SiC_2 ceramics and Fe was evaluated by shear test, and scanning electron microscope(SEM) and energy dispersive spectrometer(EDS) were used to observe and analyze the fracture morphology and composition. The effects of the diffusion bonding parameters on strength and thickness of reaction layer of the joint were investigated. The results show that the shear strength of the joint increases first and then decreases gradually with the increase of bonding temperature and holding time.
Vacuum diffusion bonding of Ti_3SiC_2 and Fe was conducted under the condition of bonding temperature of 850-1050℃, holding time of 60-120 min and pressure of 10-20 MPa. The strength of the diffusion bonding joint of Ti_3SiC_2 ceramics and Fe was evaluated by shear test, and scanning electron microscope(SEM) and energy dispersive spectrometer(EDS) were used to observe and analyze the fracture morphology and composition. The effects of the diffusion bonding parameters on strength and thickness of reaction layer of the joint were investigated. The results show that the shear strength of the joint increases first and then decreases gradually with the increase of bonding temperature and holding time.
引文
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