单向复合材料C/SiC纳米刻划实验研究
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摘要
为了进一步研究纤维增韧陶瓷基复合材料的磨削机理,设计制备了单向C/SiC模型复合材料,然后将复合材料在3个典型方向进行刻划。通过刻划实验研究分析了单颗金刚石磨粒作用下复合材料的界面失效机制及微观材料去除机理。结果表明:在单颗金刚石磨粒刻划作用下,脆性断裂是C/SiC复合材料的主要去除方式,复合材料的破坏形式主要是基体开裂、界面失效、纤维断裂的综合模式。其材料去除难易程度符合规律:法向<纵向<横向。此外,研究结果为C/SiC刻划材料去除机理研究提供了实验提导,并为陶瓷基复合材料磨削机理的揭示提供了实验基础。
In order to further study the grinding mechanism of the fiber-toughened ceramic matrix composites, the unidirectional C/SiC model composites were designed and fabricated, and then the composites were scored in three typical directions. The mechanism of interface failure and the removal mechanism of the microstructure of the composites under the action of a single diamond abrasive were analyzed by the scratch experiment. The results show that, the brittle fracture is the main way to remove C/SiC composites under the single diamond abrasive grain characterization. The failure modes of the composites mainly include the matrix cracking, interface failure and fiber fracture. Its material removal difficulty degree accords with the law: normal
In order to further study the grinding mechanism of the fiber-toughened ceramic matrix composites, the unidirectional C/SiC model composites were designed and fabricated, and then the composites were scored in three typical directions. The mechanism of interface failure and the removal mechanism of the microstructure of the composites under the action of a single diamond abrasive were analyzed by the scratch experiment. The results show that, the brittle fracture is the main way to remove C/SiC composites under the single diamond abrasive grain characterization. The failure modes of the composites mainly include the matrix cracking, interface failure and fiber fracture. Its material removal difficulty degree accords with the law: normal
引文
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[3]李言,孔祥健,郭伟超,等.纳米压痕技术研究现状与发展趋势[J].机械科学与技术,2017,36(3):470-472.
[4]Atul T,Hihara L H.Effect of inorganic constituent on nanomechanical and tribological properties of polymer,quasi-ceramic and hybrid coatings[J].Surface and Coatings Technology,2012,206:4607-4618.
[5]Zhou H X,Qiu S,Zhang X Z et al.Mechanical characteristics of soft-brittle Hg Cd Te single crystals investigated using nanoindentation and nanoscratching[J].Applied Surface Science,2012,258:9756-9761.
[6]Wu M H,Wen H C,Chang T Y,et al.Thermal reliability of thin SiGe epilayers[J].Applied Surface Science,2012,258:5001-5004.
[7]Huang Y J,Chu Y L,Shen J,et al.Mechanical performance of metallic glasses during nanoscratch tests[J].Intermetallics,2010,18:1056-1061.
[8]Sumaiya I,Raafat I.Investigation of deformation behaviour and abrasive wear mechanism in nanomachining[J].Int.J.Surface Science and Engineering,2011,5(1):38-48.
[9]罗茂良,李维火,孙晓林.Ce基非晶合金制备及室温变形行为的研究[J].热加工工艺,2010,39(10):102-104.
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