基于3D打印的聚酰亚胺介质层制备工艺研究
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  • 英文篇名:Preparation Process of Polyimide Dielectric Layer Based on 3D Printing
  • 作者:李超 ; 尹恩怀 ; 周苓
  • 英文作者:LI Chao;YIN Enhuai;ZHOU Ling;China Electronics Technology Group Corporation No.20 Research Institute;Xi'an Ruite 3D Technology Co., Ltd.;
  • 关键词:3D打印 ; 制备 ; 聚酰亚胺 ; 热固化 ; 薄膜
  • 英文关键词:3D printing;;preparation;;polyamide;;thermal curing;;film
  • 中文刊名:JYCT
  • 英文刊名:Insulating Materials
  • 机构:中国电子科技集团公司第二十研究所;西安瑞特三维科技有限公司;
  • 出版日期:2019-06-14 16:59
  • 出版单位:绝缘材料
  • 年:2019
  • 期:v.52
  • 基金:中国电子科技集团装备预研资助项目(6141B08120301)
  • 语种:中文;
  • 页:JYCT201906007
  • 页数:5
  • CN:06
  • ISSN:45-1287/TM
  • 分类号:36-40
摘要
采用二酐和二胺为原料,通过二步法合成聚酰胺酸(PAA)溶液。依据溶液黏度及流动性筛选配制浓度为0.3 g/mL的PAA溶液,以3D打印成型的方式辅助热固化工艺在喷砂5A06型铝合金基板上制备聚酰亚胺薄膜,并对其性能进行测试。结果表明:3D打印聚酰亚胺薄膜的粘附力等级为0级,其在15~30 GHz下的介电常数为2.9~3.2。通过红外光谱确认了该薄膜的红外特征峰与成品聚酰亚胺薄膜的红外特征峰相符,表明本研究成功通过3D打印方法制备了聚酰亚胺薄膜。
        A polyamide acid(PAA) solution was synthesized by two-step method using dianhydride and diamine as raw materials. According to the viscosity and fluidity of solution, a PAA solution with the concentration of 0.3 g/mL was prepared, and a polyimide film was prepared on the sandblasting 5A06 aluminum alloy substrate by 3D printing forming method assisted with thermal curing process, and its performance was tested. The results show that the adhesion grade of 3D printed polyimide film is grade 3,and its dielectric constant is 2.9~3.2 under 15~30 GHz. The infrared characteristic peaks of the 3D printed film is consistent with the finished polyimide film product, which indicates that the polyimide film is prepared successfully by 3D printing method.
引文
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