百微米级微流道模具掩膜电解加工试验
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摘要
为在304不锈钢上加工出符合技术要求的百微米级微流道图案,减小掩膜电解加工的杂散腐蚀现象,利用间隙可调的电解装置进行了系列试验研究。基于法拉第电解定律和静电场数学模型,应用Comsol软件静电场和动网格模块,模拟得到微流道沟槽的成型规律,并为电流密度、电解液浓度和加工时间的参数选取提供依据。通过实验,研究了微流道沟槽的几何形貌及杂散腐蚀程度的影响因素,进而优化了微流道沟槽的形状并提高了尺寸精度。试验结果表明:电流密度是影响杂散腐蚀的主要参数,采用9A/cm~2电流密度时杂散腐蚀小,侧向腐蚀系数EF为3.77;组合各参数,可以电解加工出平均尺寸为498.48μm,208.92μm的微流道沟槽,深度方向加工速度可达83.57μm/min,侧壁垂直且表面平整,将模具宽度和深度控制在(500±10)μm、(200±10)μm之间。满足微流道模具的技术要求。
In order to obtain good hundred-micro-level channel pattern on 304 stainless steel,and control stray etching during electrochemical machining(ECM)with mask,series of experiments were conducted. Based on Faraday's electrolytic law and mathematical model of electrostatic field,with the application of electrostatic field and dynamic grid module in Comsol software, the forming process of the micro-channel groove was simulated,which provides the basis for parameter's select of current density,electrolyte concentration and processing time. The influencing factors of geometric morphology and stray corrosion degree were studied by experiments. The shape of the microchannel groove was optimized and the dimensional accuracy was improved. The experiments illustrate that:The current density is the main factor that effect the stray etching.When the current density is 9A/cm~2,the stray etching is light and the side etching coefficient EF is 3.77. An average size of498.48μm,208.92μm microchannel can be electrochemical machined by optimized experiments,with 83.57μm/min machining speed in depth direction,vertical and smooth sidewall. The width and depth of the mold is controlled within(500±10)μm,(200±10)μm,which satisfies the technical requirements of microchannel mold.
In order to obtain good hundred-micro-level channel pattern on 304 stainless steel,and control stray etching during electrochemical machining(ECM)with mask,series of experiments were conducted. Based on Faraday's electrolytic law and mathematical model of electrostatic field,with the application of electrostatic field and dynamic grid module in Comsol software, the forming process of the micro-channel groove was simulated,which provides the basis for parameter's select of current density,electrolyte concentration and processing time. The influencing factors of geometric morphology and stray corrosion degree were studied by experiments. The shape of the microchannel groove was optimized and the dimensional accuracy was improved. The experiments illustrate that:The current density is the main factor that effect the stray etching.When the current density is 9A/cm~2,the stray etching is light and the side etching coefficient EF is 3.77. An average size of498.48μm,208.92μm microchannel can be electrochemical machined by optimized experiments,with 83.57μm/min machining speed in depth direction,vertical and smooth sidewall. The width and depth of the mold is controlled within(500±10)μm,(200±10)μm,which satisfies the technical requirements of microchannel mold.
引文
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[2]王钧,王晓东,刘冲.塑料微流控芯片热压及键合设备结构设计研究[J].机械设计与制造,2004,8(4):93-95.(Wang Jun,Wang Xiao-dong,Liu Chong.The mechanism design of hot embossing and bonding machine for polymer micro-fludic chips fabrication[J].Machinery Design&Manufacture,2004,8(4):93-95.)
[3]王亚坤,郭钟宁,郑文书.微流控芯片模具化学蚀刻制造工艺研究[J].机械设计与制造,2015,12(12):250-253.(Wang Ya-kun,Guo Zhong-ning,Zheng Wen-shu.Research on chemical etching manufacturing process for microfluidic chip mold[J].Machinery Desigh&Manufacture,2015,12(12):250-253.)
[4]宋满仓,李文明,刘莹等.多工位组合电极电火花成形微凹槽结构[J].光学精密工程,2015,23(12):3371-3377.(Song Man-cang,Li Wen-ming,Liu Ying.Micro groove structure with multi-station combination electrode by EDM[J].Optics and Precision Engineering,2015,23(12):3371-3377.)
[5]Schonenberger,S. Roy.Microscale pattern transfer without photolithography of substrates[J].Electrochimica Acta,51(2005):809-819.
[6]Landolt D,Chauvy P F,Zinger O.Electrochemical micromachining,polishing and surface structuring of metals:fundamental aspects and new developments[J]. Electrochimica Acta,2003,48(20):3185-3201.
[7]钱双庆,朱荻,曲宁松.活塞环表面微坑电解加工技术的基础研究[J].内燃机学报,2010(2):173-179.(Qian Shuang-qing,Zhu Di,Qu Ning-song.Foundational investigation on the surface of the piston ring with micro-dimples array generating by electrochemical micromachining[J].Transactions of CSICE,2010,28(2):173-179.)
[8]李冬林,朱荻,李寒松.辅助阳极掩模板电解加工技术[J].南京航空航天大学学报,2010(4):40-406.(Li Dong-lin,Zhu Di,Li Han-song.Electrochemical machining with mask by auxiliary anode[J].2010(4):40-406.)
[9]Vigay K.Jain,Dileep Gehlot.Anode shape prediction in through maskecmm using fem[J].Machining Science and Technology,2015(5):286-312.
[10]Wei Ze-fei,Zheng Xing-hua,Ma Ning.Characteristics of electrochemical machining passive films on stainless steel S304[J].Advance Materials Research,2013.705:197-202.