印刷电路板双向脉冲镀铜可编程开关电源研制
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摘要
为降低开关损耗对双向脉冲镀铜质量的影响,输出满足印刷电路板封孔镀铜需求的脉冲波形,通过研究封孔镀铜工艺及其技术指标,应用软开关与DSP2812详细设计了支持电镀参数设置和脉冲波形可编程控制的大容量双向脉冲电源。主电路利用软开关降低高频镀铜的开关损耗,由控制电路的DSP2812为封孔镀铜提供触发信号,控制主电路周期性输出15 V/800 A正向、24 V/2000 A反向可调的脉冲镀铜激励。利用研制的双向脉冲电源对φ20μm×80μm盲孔进行封孔镀铜试验,镀铜凹陷均值为11.34～13.28μm,双向脉冲输出稳定,盲孔均镀性良好。
To reduce the influence of switching loss on the quality of pulse reverse plating,and output pulse waveforms which can satisfy the requirements of copper via filling plating in printed circuit boards,the high-power programmable switching power was designed in detail with soft switching and DSP2812 which can support plating parameter and programmable pulse waveform setting by copper plating process and its technical indicators. A soft switching was used by main circuit to reduce the switching loss of high-frequency copper plating. A trigger signal was provided by DSP2812 in control circuit for the copper plating of blind hole. And the 15 V/800 A forward and 24 V/2000 A reverse pulse were periodically output. The blind hole of φ20 μm×80 μm was tested by the developed pulse power,average copper plating depression was 11.34-13.28 μm,the output was stable and copper via filling plating had better uniform coverage ability.
To reduce the influence of switching loss on the quality of pulse reverse plating,and output pulse waveforms which can satisfy the requirements of copper via filling plating in printed circuit boards,the high-power programmable switching power was designed in detail with soft switching and DSP2812 which can support plating parameter and programmable pulse waveform setting by copper plating process and its technical indicators. A soft switching was used by main circuit to reduce the switching loss of high-frequency copper plating. A trigger signal was provided by DSP2812 in control circuit for the copper plating of blind hole. And the 15 V/800 A forward and 24 V/2000 A reverse pulse were periodically output. The blind hole of φ20 μm×80 μm was tested by the developed pulse power,average copper plating depression was 11.34-13.28 μm,the output was stable and copper via filling plating had better uniform coverage ability.
引文
[1]林金堵,吴梅珠. PCB电镀铜技术与发展[J].印制电路信息,2009,(12):27-32.
[2]王双民.脉冲电镀对铜层空隙率的改善[J].腐蚀与防护,2005,26(3):123-123.
[3]侯进.脉冲电镀及其电源[J].电镀与环保,2011,31(4):4-9.
[4]李远波,张永俊,周慧峰,等.基于DSP的软开关逆变式脉冲电源[J].电力电子技术,2009,43(11):59-60.
[5] Jiang H Y,Liu Z J,Wang X W,et al. Effect of triethanolamine on deposition rate of electroless copper plating[J].Transactions of the Institute of Measurement and Control,2007,85(2):103-106.
[6]李亚冰,王双元,王为.印制线路板微孔镀铜研究现状[J].电镀与精饰,2007,29(1):32-35.
[7] Lefebvre M,Allardyce G,Seita M,et al. Copper electroplating technology for microvia filling[J]. Printed Circuit Information,2004,29(2):9-14.
[8]张虹,石彩燕,肖心萍.采用Minitab软件优化印刷线路板电镀盲孔的参数[J].电镀与涂饰,2012,31(3):4-7.
[2]王双民.脉冲电镀对铜层空隙率的改善[J].腐蚀与防护,2005,26(3):123-123.
[3]侯进.脉冲电镀及其电源[J].电镀与环保,2011,31(4):4-9.
[4]李远波,张永俊,周慧峰,等.基于DSP的软开关逆变式脉冲电源[J].电力电子技术,2009,43(11):59-60.
[5] Jiang H Y,Liu Z J,Wang X W,et al. Effect of triethanolamine on deposition rate of electroless copper plating[J].Transactions of the Institute of Measurement and Control,2007,85(2):103-106.
[6]李亚冰,王双元,王为.印制线路板微孔镀铜研究现状[J].电镀与精饰,2007,29(1):32-35.
[7] Lefebvre M,Allardyce G,Seita M,et al. Copper electroplating technology for microvia filling[J]. Printed Circuit Information,2004,29(2):9-14.
[8]张虹,石彩燕,肖心萍.采用Minitab软件优化印刷线路板电镀盲孔的参数[J].电镀与涂饰,2012,31(3):4-7.