新型化学镀钯工艺研究
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摘要
研究了一种新型化学镀钯工艺,使用新型络合型钯盐作为钯源,采用L16(45)的正交试验和单一因素实验,研究得到了性能最佳的镀液配方及工艺条件。镀层性能测试结果表明,所制备的镍钯金镀层镀层结合力强,金属光泽性高,具有良好的耐腐蚀性和可焊性。
This study used a novel palladium complex as the palladium source to present a new electroless palladium plating process. By using L16(45) orthogonal test and single factor test, the optimum bath formulation and process conditions were obtained. The coating performance tests show strong adhesion, high metallic luster,good corrosion resistance and solderability.
This study used a novel palladium complex as the palladium source to present a new electroless palladium plating process. By using L16(45) orthogonal test and single factor test, the optimum bath formulation and process conditions were obtained. The coating performance tests show strong adhesion, high metallic luster,good corrosion resistance and solderability.
引文
[1]杜鸣,郝跃.超深亚微米集成电路的铜互连技术布线工艺与可靠性[J].西安电子科技大学学报(自然科学版),2005, 32(1):61-64.
[2] Chung C K,Chen Y J,Li C C,et al. The critical oxide thickness for Pb-free reflow soldering on Cu substrate[J]. Thin Solid Films,2012,520(16):5346-5352.
[3] Hannigan K, Reid M, Collins M N, et al.Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments[J]. Journal of Electronic Materials,2012,41(3):611-623.
[4]朱立群,丁学谊.化学铍非晶态镍磷合金镀层抗氧化性能研究[J].电镀与涂饰,1999,18(3):22-26.
[5] Choi W K, Lee H M. Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate[J]. Journal of Electronic Materials, 1999, 28(11):1251-1255.
[6] Kumar A, Chen Z, Mhaisalkar S G, et al. Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless NiP metallization on Cu substrate[J]. Thin Solid Films, 2006, 504(1):410-415.
[7] Kejun Zeng, Stierman, Roger, Tz-Cheng Chiu,et al. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability[J]. Journal of Applied Physics, 2005,97(2):750-39.
[8] Ahat S,Du L,Sheng M,et al. Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints[J]. Journal of Electronic Materials, 2000,29(9):1105-1109.
[9]刘海萍.化学镀镍/置换镀金工艺及其沉积机制研究[D].哈尔滨工业大学,2008.
[10]林金堵,吴梅珠.化学镀镍/化学镀钯/浸金表面涂覆层的再提出[J].印制电路信息,2011(3):29-32.
[11] Wang Y, Li W, Wang W, et al. Thick pure palladium film with varied crystal structure electroless deposited from choline chloridepalladium chloride solution without the addition of reductant[J]. Thin Solid Films, 2015, 586:35-40.
[12]王欢,贺小塘,吴喜龙等.离子交换法合成硫酸四氨钯(Ⅱ)[J].有色金属(冶炼部分),2016(3):59-61.
[13]张林,王炜,吴茜臻.溶胶-凝胶技术在织物化学镀活化预处理中的应用[J].电化学,2010,16(1):112-115.
[2] Chung C K,Chen Y J,Li C C,et al. The critical oxide thickness for Pb-free reflow soldering on Cu substrate[J]. Thin Solid Films,2012,520(16):5346-5352.
[3] Hannigan K, Reid M, Collins M N, et al.Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments[J]. Journal of Electronic Materials,2012,41(3):611-623.
[4]朱立群,丁学谊.化学铍非晶态镍磷合金镀层抗氧化性能研究[J].电镀与涂饰,1999,18(3):22-26.
[5] Choi W K, Lee H M. Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate[J]. Journal of Electronic Materials, 1999, 28(11):1251-1255.
[6] Kumar A, Chen Z, Mhaisalkar S G, et al. Effect of Ni-P thickness on solid-state interfacial reactions between Sn-3.5Ag solder and electroless NiP metallization on Cu substrate[J]. Thin Solid Films, 2006, 504(1):410-415.
[7] Kejun Zeng, Stierman, Roger, Tz-Cheng Chiu,et al. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability[J]. Journal of Applied Physics, 2005,97(2):750-39.
[8] Ahat S,Du L,Sheng M,et al. Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints[J]. Journal of Electronic Materials, 2000,29(9):1105-1109.
[9]刘海萍.化学镀镍/置换镀金工艺及其沉积机制研究[D].哈尔滨工业大学,2008.
[10]林金堵,吴梅珠.化学镀镍/化学镀钯/浸金表面涂覆层的再提出[J].印制电路信息,2011(3):29-32.
[11] Wang Y, Li W, Wang W, et al. Thick pure palladium film with varied crystal structure electroless deposited from choline chloridepalladium chloride solution without the addition of reductant[J]. Thin Solid Films, 2015, 586:35-40.
[12]王欢,贺小塘,吴喜龙等.离子交换法合成硫酸四氨钯(Ⅱ)[J].有色金属(冶炼部分),2016(3):59-61.
[13]张林,王炜,吴茜臻.溶胶-凝胶技术在织物化学镀活化预处理中的应用[J].电化学,2010,16(1):112-115.