摘要
采用PIT工艺制备了单芯Bi-2223/AgAu带材,系统地研究了第二次热处理阶段(HT2)降温速率对带材相组成、微观结构和传输性能的影响。结果表明:随着降温速率的减小,富铅相3321不断增加,CuO颗粒尺寸逐渐增大。当冷却速率从600℃/h减小到1℃/h时,临界电流密度Jc从7 kA/cm~2增加到11.5 kA/cm~2,增加了64%。由于晶间连接性能和磁通钉扎性能的提高,在较低的降温速率下,Bi-2223/AgAu带材在磁场下的临界电流密度也得到了提高。
Monofilament AgAu sheathed Bi-2223 tapes were fabricated by powder in tube(PIT)process.The influences of cooling rate during the second heat treatment process(HT2)on the phase composition,microstructures and transport properties of Bi-2223/Ag Au tapes were investigated.Results show that after the HT2 process,the content of Pb-rich Pb_3Sr_(2.5)Bi_(0.5)Ca_2Cu O_y(3321)phase increases with the decreasing cooling rate,while the size of Cu O phase particles becomes bigger.With the cooling rate decreasing from 600°C/h by 1°C/h,the critical current density J_(c )increases from 7 kA/cm~2 to the maximum value of 11.5 kA/cm~2,which increases by 64%.Meanwhile the current capacities in magnetic field of these Bi-2223/AgAu tapes have also been enhanced with slow cooling process,attributed to the improvements of both the intergrain connectivity and the flux pinning properties.
引文
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