Sn-Ni-Mn合金的电沉积行为及成核机制
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摘要
研究了Sn-Ni-Mn合金在玻碳电极上的电沉积行为及成核机制。采用阴极极化、循环伏安、电化学阻抗及恒电位阶跃等电化学方法研究镀液成分、温度、pH对Sn-Ni-Mn合金电沉积阴极极化行为的影响,以及不同扫描速率和阴极电位下Sn-Ni-Mn合金电沉积机制。试验结果表明:降低主盐浓度、提高络合剂(Na_3C_6H_5O_7·2H_2O)和添加剂(糖精钠)浓度、降低镀液温度、提高镀液pH均会使阴极极化曲线负移,极化作用增强,有利于电极电位较负的Mn~(2+)还原沉积;Sn-Ni-Mn合金电沉积过程主要受扩散控制,非可逆;随阴极过电位升高,Sn-Ni-Mn合金电沉积电荷转移电阻减小,沉积速率加快;Sn-Ni-Mn合金电结晶过程遵循扩散控制下的三维瞬时成核机制。
The electrodeposition behavior and nucleation mechanism of Sn-Ni-Mn alloy on glassy carbon electrode were investigated.The effects of bath composition,temperatures and pH on cathodic polarization behavior and electrodeposition mechanism of Sn-Ni-Mn alloy at various scan rate and cathode potential were studied by cathodic polarization curve,cyclic voltammetry curve,electrochemical impedance spectroscopy,and potential step.The results show that reducing the main salts concentrations,increasing the concentrations of complexing agent(Na_3C_6H_5O_7·2H_2O)and additive(saccharin sodium),lowering bath temperature,and increasing pH,the cathode polarization curve shifts negatively,the cathode polarization increases,and it is favorable for deposition of Mn~(2+) with lower electrode potential.The electrodeposition process of Sn-Ni-Mn alloy is an irreversible process controlled mainly by diffusion.With the increasing of cathodic overpotential,the charge transfer resistance of Sn-Ni-Mn alloy decreases and the deposition rate increases.The electrocrystallization process of Ni-Sn-Mn alloy follows the mechanism of three dimensional instantaneous nucleation controlled by diffusion.
The electrodeposition behavior and nucleation mechanism of Sn-Ni-Mn alloy on glassy carbon electrode were investigated.The effects of bath composition,temperatures and pH on cathodic polarization behavior and electrodeposition mechanism of Sn-Ni-Mn alloy at various scan rate and cathode potential were studied by cathodic polarization curve,cyclic voltammetry curve,electrochemical impedance spectroscopy,and potential step.The results show that reducing the main salts concentrations,increasing the concentrations of complexing agent(Na_3C_6H_5O_7·2H_2O)and additive(saccharin sodium),lowering bath temperature,and increasing pH,the cathode polarization curve shifts negatively,the cathode polarization increases,and it is favorable for deposition of Mn~(2+) with lower electrode potential.The electrodeposition process of Sn-Ni-Mn alloy is an irreversible process controlled mainly by diffusion.With the increasing of cathodic overpotential,the charge transfer resistance of Sn-Ni-Mn alloy decreases and the deposition rate increases.The electrocrystallization process of Ni-Sn-Mn alloy follows the mechanism of three dimensional instantaneous nucleation controlled by diffusion.
引文
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[15]夏熙,刘洪涛,刘洋.Ce4+/Ce3+氧化还原体系线性极化与交流阻抗研究[J].化学学报,2002,60(9):1630-1636.
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