钎焊温度对纳米银焊膏真空钎焊Ni200合金接头组织与性能的影响
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摘要
采用改进的多元醇法制备纳米银线焊膏,制得的银焊膏性质稳定,微观形貌多呈线状,通过XRD和DSC对其成分和熔点进行了测试分析。随后采用制得的银焊膏对镍合金片(Ni200)进行真空钎焊试验,分析钎焊温度对钎焊接头显微组织和力学性能的影响规律。结果表明,增加钎焊温度可以提高钎焊接头内烧结组织的致密度,促进界面处原子间的互扩散作用,从而提高钎焊接头的抗剪强度。但温度过高时,接头性能略有下降。钎焊接头的抗剪强度在850℃时达到最大值42.5 MPa,较300℃时的抗剪强度增加了约912%。
The nanosilver solder pastes prepared by improved polyol method exhibited favorable stability and linear micro-morphology mostly. The composition and melting point of the prepared nanosilver pastes were measured by XRD and DSC,respectively. Subsequently,nickel( Ni200)alloys were brazed in vacuum with the prepared nanosliver paste,and the impact of brazing temperature on the microstructure and properties of brazed joint were investigated. It can be found in the results that the sintering temperature increase is beneficial to the density improving of the sintered structure in the joint and the interdiffusion between the atoms at the interface,thus enhances the shear strength of the brazed joints. However,excessively high temperature will lead to a slight drop in the property of joints. The brazed joints present a maximum shear strength of 42.5 MPa at 850 ℃,which is about 912% higher than that at 300 ℃.
The nanosilver solder pastes prepared by improved polyol method exhibited favorable stability and linear micro-morphology mostly. The composition and melting point of the prepared nanosilver pastes were measured by XRD and DSC,respectively. Subsequently,nickel( Ni200)alloys were brazed in vacuum with the prepared nanosliver paste,and the impact of brazing temperature on the microstructure and properties of brazed joint were investigated. It can be found in the results that the sintering temperature increase is beneficial to the density improving of the sintered structure in the joint and the interdiffusion between the atoms at the interface,thus enhances the shear strength of the brazed joints. However,excessively high temperature will lead to a slight drop in the property of joints. The brazed joints present a maximum shear strength of 42.5 MPa at 850 ℃,which is about 912% higher than that at 300 ℃.
引文
1 Li Y J,Xia C Z,Shi L.Modern Welding Technology,2010,7(28),1(in Chinese).李亚江,夏春智,石磊.现代焊接,2010,7(28),1.
2 Tang Z J,Guo T M,Fu Y,et al.Metal World,2014(1),36(in Chinese).唐中杰,郭铁明,付迎,等.金属世界,2014(1),36.
3 Wang G,Zhang B G,He J S,et al.Transactions of the China Welding Institution,2008,29(7),89(in Chinese).王刚,张秉刚,何景山,等.焊接学报,2008,29(7),89.
4 Tang Z Z,Chen P Y,Wu W.Transactions of the China Welding Institution,2008,29(1),109(in Chinese).唐正柱,陈佩寅,吴伟.焊接学报,2008,29(1),109.
5 Cox D C,Roebuck B,Rae C M F,et al.Materials Science&Technology,2003,19(4),440.
6 Herring C.Journal of Applied Physics,1950,21(4),301.
7 Akada Y,Tatsumi H,Yamaguchi T,et al.Materials Transactions,2008,49(7),1537.
8 Yang X.Study on preparation and performance of low temperature sintered silver nanoparticle paste.Master’s thesis,Harbin Institute of Technology,China,2016(in Chinese).杨雪.低温烧结纳米银膏的制备及其性能研究.硕士学位论文,哈尔滨工业大学,2016.
9 Xiang H Y,Gao G M,Huang P D,et al.Materials Reviews,2016,30(z1),64(in Chinese).向红印,高官明,黄培德,等.材料导报,2016,30(z1),64.
10 Yang C X,Li X,Kong Y F,et al.Chinese Journal of Luminescence,2016(1),94(in Chinese).杨呈祥,李欣,孔亚飞,等.发光学报,2016(1),94.
11 Paknejad S A,Mannan S H.Microelectronics Reliability,2017,70,1.
12 Alarifi H,Hu A,Yavuz M,et al.Journal of Electronic Materials,2011,40(6),1394.
13 Hausner S,Weis S,Wagner G.DVS-Berichte,2016,325,278.
14 Coskun S,Aksoy B,Unalan H E.Crystal Growth&Design,2011,11(11),4963.
2 Tang Z J,Guo T M,Fu Y,et al.Metal World,2014(1),36(in Chinese).唐中杰,郭铁明,付迎,等.金属世界,2014(1),36.
3 Wang G,Zhang B G,He J S,et al.Transactions of the China Welding Institution,2008,29(7),89(in Chinese).王刚,张秉刚,何景山,等.焊接学报,2008,29(7),89.
4 Tang Z Z,Chen P Y,Wu W.Transactions of the China Welding Institution,2008,29(1),109(in Chinese).唐正柱,陈佩寅,吴伟.焊接学报,2008,29(1),109.
5 Cox D C,Roebuck B,Rae C M F,et al.Materials Science&Technology,2003,19(4),440.
6 Herring C.Journal of Applied Physics,1950,21(4),301.
7 Akada Y,Tatsumi H,Yamaguchi T,et al.Materials Transactions,2008,49(7),1537.
8 Yang X.Study on preparation and performance of low temperature sintered silver nanoparticle paste.Master’s thesis,Harbin Institute of Technology,China,2016(in Chinese).杨雪.低温烧结纳米银膏的制备及其性能研究.硕士学位论文,哈尔滨工业大学,2016.
9 Xiang H Y,Gao G M,Huang P D,et al.Materials Reviews,2016,30(z1),64(in Chinese).向红印,高官明,黄培德,等.材料导报,2016,30(z1),64.
10 Yang C X,Li X,Kong Y F,et al.Chinese Journal of Luminescence,2016(1),94(in Chinese).杨呈祥,李欣,孔亚飞,等.发光学报,2016(1),94.
11 Paknejad S A,Mannan S H.Microelectronics Reliability,2017,70,1.
12 Alarifi H,Hu A,Yavuz M,et al.Journal of Electronic Materials,2011,40(6),1394.
13 Hausner S,Weis S,Wagner G.DVS-Berichte,2016,325,278.
14 Coskun S,Aksoy B,Unalan H E.Crystal Growth&Design,2011,11(11),4963.