高性能钌系玻璃釉电阻浆料的研制
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摘要
描述了钌系玻璃釉电阻浆料的研制过程,优化了钌系电阻浆料体系构成。在大量实验的基础上,优选出软化点合适、附着力好、表观性能优良的玻璃粉作为粘结相。对于不同阻段的电阻浆料,选用二氧化钌粉搭配银/钯粉和钌酸铅粉作为导电相。分析了改性剂的种类及含量对电性能的影响,得到了阻值和电阻温度系数同时满足要求的电阻浆料产品。项目研制的PR-Ru系列玻璃釉电阻浆料,其阻值稳定、范围宽、具有优良的工艺适应性,完全适用于玻璃釉电阻元器件的生产。
The paper describes the development and research process of the ruthenium glass-glaze resistor paste, then the ruthenium resistor paste material system is optimized. On the basis of a large number of experiments, the glass powders with suitable softening point, high adhesion and excellent apparent performance are selected as the binder phase. The Ag/Pd powder, Ru O2 powder and Pb2Ru2O6.5 are selected as the conductive phase for different resistances. The effect of modifier types and component is analyzed, while the glass-glaze resistor paste is prepared with the wide range of sheet resistance, low TCR, well stability and adaptability. The resistor paste is suitable for the manufacture of glass-glaze resistance component.
The paper describes the development and research process of the ruthenium glass-glaze resistor paste, then the ruthenium resistor paste material system is optimized. On the basis of a large number of experiments, the glass powders with suitable softening point, high adhesion and excellent apparent performance are selected as the binder phase. The Ag/Pd powder, Ru O2 powder and Pb2Ru2O6.5 are selected as the conductive phase for different resistances. The effect of modifier types and component is analyzed, while the glass-glaze resistor paste is prepared with the wide range of sheet resistance, low TCR, well stability and adaptability. The resistor paste is suitable for the manufacture of glass-glaze resistance component.
引文
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[4]李著,肖爱武.国内厚膜电子浆料的发展与应用[J].电子元件与材料,1999,18(2):25-31.
[5]郝武昌,刘敏霞,孙社稷,陆冬梅.厚膜电路用高性能电阻浆料的研制[J].电子工艺技术,2014,35(3):131-136.
[6]王恩信,侯正则.Ru O2厚膜电阻体的阻值与TCR的关系[J].电子元件与材料,1994,13(3):32-34.
[7]张晓明,李同泉,杨雯等.钌系厚膜电阻器电阻温度系数及变化规律[J].有色金属,2002,54(7):91-93.
[8]高官明.玻璃基板用电子浆料[J].电子元件与材料,2000,19(2):3-4.
[9]李同泉,张代瑛.钌酸盐低阻浆料成分对电性能的影响[J].电子元件与材料,1991,10(2):29-32.
[2]虎轩东.厚膜微电子技术[M].成都:电子元件与材料出版社,1989:61-62.
[3]牛淑蓉,陆冬梅,周蓉.厚膜电阻浆料发展现状[J].中国电子商情-元器件,2001,9(1):11-13.
[4]李著,肖爱武.国内厚膜电子浆料的发展与应用[J].电子元件与材料,1999,18(2):25-31.
[5]郝武昌,刘敏霞,孙社稷,陆冬梅.厚膜电路用高性能电阻浆料的研制[J].电子工艺技术,2014,35(3):131-136.
[6]王恩信,侯正则.Ru O2厚膜电阻体的阻值与TCR的关系[J].电子元件与材料,1994,13(3):32-34.
[7]张晓明,李同泉,杨雯等.钌系厚膜电阻器电阻温度系数及变化规律[J].有色金属,2002,54(7):91-93.
[8]高官明.玻璃基板用电子浆料[J].电子元件与材料,2000,19(2):3-4.
[9]李同泉,张代瑛.钌酸盐低阻浆料成分对电性能的影响[J].电子元件与材料,1991,10(2):29-32.