蜂窝状结构半固结磨料研磨盘的制备及应用
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摘要
针对传统半固结研磨盘由于盘面较软使得加工衬底面形精度难以保证的问题,提出一种蜂窝状结构的半固结磨料研磨盘的设计与制备方法。该研磨盘采用环氧树脂蜂窝结构作为支撑"骨架",减小研磨盘的变形,以保证研磨衬底的面形精度,同时采用含有金刚石磨粒的凝胶体作为半固结研磨介质实现对衬底的研磨加工,获得了较好的衬底表面质量。基于该原理制备了一套新型研磨盘,并用于蓝宝石衬底的双面研磨加工。试验结果表明,研磨后衬底表面粗糙度较小,表面划痕和裂纹少,能够获得较好的表面质量;相应地,研磨后蓝宝石衬底的面形精度不仅没有变差,反而得到很大的改善,研磨后衬底的翘曲度、弯曲度和总厚度偏差均大幅减小。另外,研磨效率也相对较高,材料去除率可达0.3～0.4μm/min。试验结果证明了该新型结构研磨盘不仅可以获得较好的表面质量和较高的研磨效率,同时还可提高衬底的面形精度,可用于面形精度要求较高的薄片衬底零件的精密研磨加工。
In addition to a good surface quality,surface shape accuracy is also necessary.However,it is difficult to guarantee the surface shape accuracy of the substrate during lapping with the general semi-fixed lapping owing to the lapping plate's soft surface.Therefore,we propose a new design and preparation method of semi-fixed lapping plate with cellular structure.The cellular structure made of epoxy resin is designed to play a supporting role,which can reduce the deformation of the lapping plate and improve the surface shape accuracy.The cellular structure is filled with a soft gel with diamond abrasives,which play a role in semi-fixed lapping.Based on this principle,a new structure semi-fixed abrasive lapping plate is prepared and used to lap sapphire substrates.Experimental resultsshow that good surface quality can be obtained with a low surface roughness and a flatter surface with fewer scratches and cracks.Accordingly,the surface shape accuracy of the sapphire substrate has been improved in lapping process.After lapping,the Bow,Warp,and TTV of the substrate are greatly reduced.The lapping efficiency is relatively high,and the material removal rate is 0.3～0.4μm/min.The experimental results indicate not only good surface quality,but an improved surface shape accuracy of the substrate can be obtained by lapping with the new structure semi-fixed abrasive lapping plate.Therefore,this new lapping plate can be used to process the conductor substrates that have a high requirement for both surface quality and surface shape accuracy.
In addition to a good surface quality,surface shape accuracy is also necessary.However,it is difficult to guarantee the surface shape accuracy of the substrate during lapping with the general semi-fixed lapping owing to the lapping plate's soft surface.Therefore,we propose a new design and preparation method of semi-fixed lapping plate with cellular structure.The cellular structure made of epoxy resin is designed to play a supporting role,which can reduce the deformation of the lapping plate and improve the surface shape accuracy.The cellular structure is filled with a soft gel with diamond abrasives,which play a role in semi-fixed lapping.Based on this principle,a new structure semi-fixed abrasive lapping plate is prepared and used to lap sapphire substrates.Experimental resultsshow that good surface quality can be obtained with a low surface roughness and a flatter surface with fewer scratches and cracks.Accordingly,the surface shape accuracy of the sapphire substrate has been improved in lapping process.After lapping,the Bow,Warp,and TTV of the substrate are greatly reduced.The lapping efficiency is relatively high,and the material removal rate is 0.3～0.4μm/min.The experimental results indicate not only good surface quality,but an improved surface shape accuracy of the substrate can be obtained by lapping with the new structure semi-fixed abrasive lapping plate.Therefore,this new lapping plate can be used to process the conductor substrates that have a high requirement for both surface quality and surface shape accuracy.
引文
[1]庄敏杰.蓝宝石衬底面形特征对退火工艺的影响研究[D].厦门:华侨大学,2016.ZHUANG M J.Sapphire Substrate Surface Shape Features to the Influence of Annealing Process[D].Xiamen:Huaqiao University,2016.(in Chinese)
[2]邵铭剑,胡中伟,张志斌,等.双面研磨蓝宝石衬底面形及表面粗糙度变化过程的试验研究[J].现代制造工程,2017(9):8-12.SHAO M J,HU ZH W,ZHANG ZH B,et al..Experimental research on the changing process of sapphire substrate surface shape and surface roughness in double-sided lapping[J].Modern Manufacturing Engineering,2017(9):8-12.(in Chinese)
[3]周海.衬底基片超精密加工技术[M].北京:科学出版社,2014.ZHOU H.Substrate Ultra-precision Processing Technology[M].Beijing:Science Press,2014.(in Chinese)
[4]苏建修,张学铭,万秀颖,等.固结磨料研磨SiC单晶基片(0001)C面研究[J].纳米技术与精密工程,2014,12(6):417-423.SU J X,ZHANG X M,WAN X Y,et al..Study on fixed abrasive lapping SiC single crystal substrate(0001)C surface[J].Nanotechnology and Precision Engineering,2014,12(6):417-423.(in Chinese)
[5] YUAN J,WANG Z,HONG T,et al..A semifixed abrasive machining technique[J].Journal of Micromechanics&Microengineering,2009,19(19):054006.
[6]袁巨龙,王志伟,钱苗,等.半固着磨具“陷阱”效应的磨粒流模拟[J].中国机械工程,2009,20(6):630-635.YUAN J L,WANG ZH W,QIAN M,et al..Particle flow simulation on the"trap"effect of semifixed abrasive plate[J].China Mechanical Engineering,2009,20(6):630-635.(in Chinese)
[7] ZHAO P,TANG K F,WANG Z W,et al..On the characteristic parameters of the semi-fixed abrasive plate[J].Advanced Materials Research,2009,69-70:291-295.
[8] LV B H,YUAN J L,WANG Z W.Simulation of compacting process for semi-fixed abrasive wheel[J].Key Engineering Materials,2009,416:87-92.
[9]林旺票.基于固相反应的半固着磨具及其对蓝宝石抛光的探索研究[D].杭州:浙江工业大学,2015.LIN W P.Dissertation Submitted to Zhejiang University of Technology for the Degree of Master[D].Hangzhou:Zhejiang University of Technology,2015.(in Chinese)
[10] NAKAMURA H,YAN J W,SYOJI K,et al..Development of a polishing disc containing granulated fine abrasives[J].Key Engineering Materials,2003,238-239(6):257-262.
[11]徐西鹏,刘娟,于怡青,等.凝胶结合剂磨粒工具制备及其磨抛性能研究[J].机械工程学报,2013,49(19):156-162.XU X P,LIU J,YU Y Q,et al..Fabrication and application of gel-bonded abrasive tools for grinding and polishing tools[J].Journal of Mechanical Engineering,2013,49(19):156-162.(in Chinese)
[12] LIU J,XU X.Fabrication of ultra-fine diamond abrasive tools by sol-gel[J].Materials Science Forum,2004,471-472:426-430.
[13] LUO Q F,LU J,XU X P.A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools[J].Wear,2016,s 350-351:99-106.
[14] LUO Q,LU J,XU X.Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools[J].Tribology International,2016,104:191-203.
[15] LU J,LI Y,XU X.The effects of abrasive yielding on the polishing of SiC wafers using a semifixed flexible pad[J].Journal of Engineering Manufacture,2015,229(s1):170-177.
[16]杨翊.半固着磨具物理特性及加工性能的试验研究[D].杭州:浙江工业大学,2009.YANG Y.Research on the Characteristic and the Process Performance of Semi-fixed Abrasive Plate[D]. Hangzhou:Zhejiang University of Technology,2009.(in Chinese)
[17]刘文涛.半固着磨粒磨具加工性能研究[D].杭州:浙江工业大学,2007.LIU W T.Research on the Process Performance of Semi-fixed Abrasive Tool[D].Hangzhou:Zhejiang University of Technology,2007.(in Chinese)
[2]邵铭剑,胡中伟,张志斌,等.双面研磨蓝宝石衬底面形及表面粗糙度变化过程的试验研究[J].现代制造工程,2017(9):8-12.SHAO M J,HU ZH W,ZHANG ZH B,et al..Experimental research on the changing process of sapphire substrate surface shape and surface roughness in double-sided lapping[J].Modern Manufacturing Engineering,2017(9):8-12.(in Chinese)
[3]周海.衬底基片超精密加工技术[M].北京:科学出版社,2014.ZHOU H.Substrate Ultra-precision Processing Technology[M].Beijing:Science Press,2014.(in Chinese)
[4]苏建修,张学铭,万秀颖,等.固结磨料研磨SiC单晶基片(0001)C面研究[J].纳米技术与精密工程,2014,12(6):417-423.SU J X,ZHANG X M,WAN X Y,et al..Study on fixed abrasive lapping SiC single crystal substrate(0001)C surface[J].Nanotechnology and Precision Engineering,2014,12(6):417-423.(in Chinese)
[5] YUAN J,WANG Z,HONG T,et al..A semifixed abrasive machining technique[J].Journal of Micromechanics&Microengineering,2009,19(19):054006.
[6]袁巨龙,王志伟,钱苗,等.半固着磨具“陷阱”效应的磨粒流模拟[J].中国机械工程,2009,20(6):630-635.YUAN J L,WANG ZH W,QIAN M,et al..Particle flow simulation on the"trap"effect of semifixed abrasive plate[J].China Mechanical Engineering,2009,20(6):630-635.(in Chinese)
[7] ZHAO P,TANG K F,WANG Z W,et al..On the characteristic parameters of the semi-fixed abrasive plate[J].Advanced Materials Research,2009,69-70:291-295.
[8] LV B H,YUAN J L,WANG Z W.Simulation of compacting process for semi-fixed abrasive wheel[J].Key Engineering Materials,2009,416:87-92.
[9]林旺票.基于固相反应的半固着磨具及其对蓝宝石抛光的探索研究[D].杭州:浙江工业大学,2015.LIN W P.Dissertation Submitted to Zhejiang University of Technology for the Degree of Master[D].Hangzhou:Zhejiang University of Technology,2015.(in Chinese)
[10] NAKAMURA H,YAN J W,SYOJI K,et al..Development of a polishing disc containing granulated fine abrasives[J].Key Engineering Materials,2003,238-239(6):257-262.
[11]徐西鹏,刘娟,于怡青,等.凝胶结合剂磨粒工具制备及其磨抛性能研究[J].机械工程学报,2013,49(19):156-162.XU X P,LIU J,YU Y Q,et al..Fabrication and application of gel-bonded abrasive tools for grinding and polishing tools[J].Journal of Mechanical Engineering,2013,49(19):156-162.(in Chinese)
[12] LIU J,XU X.Fabrication of ultra-fine diamond abrasive tools by sol-gel[J].Materials Science Forum,2004,471-472:426-430.
[13] LUO Q F,LU J,XU X P.A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools[J].Wear,2016,s 350-351:99-106.
[14] LUO Q,LU J,XU X.Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools[J].Tribology International,2016,104:191-203.
[15] LU J,LI Y,XU X.The effects of abrasive yielding on the polishing of SiC wafers using a semifixed flexible pad[J].Journal of Engineering Manufacture,2015,229(s1):170-177.
[16]杨翊.半固着磨具物理特性及加工性能的试验研究[D].杭州:浙江工业大学,2009.YANG Y.Research on the Characteristic and the Process Performance of Semi-fixed Abrasive Plate[D]. Hangzhou:Zhejiang University of Technology,2009.(in Chinese)
[17]刘文涛.半固着磨粒磨具加工性能研究[D].杭州:浙江工业大学,2007.LIU W T.Research on the Process Performance of Semi-fixed Abrasive Tool[D].Hangzhou:Zhejiang University of Technology,2007.(in Chinese)