热熔处理聚合物光互连波导传输损耗特性
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摘要
印刷光互连背板技术是解决未来大尺寸、高速板上数据互连的重要方案,在超宽带光通信、大型数据中心和超级计算机等领域具有广阔应用前景。针对互连背板上聚合物光波导低损耗传输的关键问题,提出基于热熔工艺的光波导处理技术以降低其光传输损耗。实验研究表明:在160℃热熔处理温度条件下,实现了光波导传输损耗的降低。基于该技术有望在现有工艺基础上实现光波导传输性能的提升,因此具有重要的实际应用价值。
Optical waveguide on the printed circuit board is the most important solution for solving the problem in the future large size and high speed data interconnection, which has a lot of applications in broadband optical communication, big data center and supercomputer. In this paper, based on thermal reflow technique, the reduction of transmission loss of polymer optical waveguide on the printed circuit board is proposed. The experimental results demonstrate that the transmission loss of the waveguide is decreased after the optical waveguide experiences thermal reflow at 160℃. The proposed thermal reflow technique will be expected to adopt to improve the transmission performance of the optical waveguide on the printed circuit board showing important practical applications.
Optical waveguide on the printed circuit board is the most important solution for solving the problem in the future large size and high speed data interconnection, which has a lot of applications in broadband optical communication, big data center and supercomputer. In this paper, based on thermal reflow technique, the reduction of transmission loss of polymer optical waveguide on the printed circuit board is proposed. The experimental results demonstrate that the transmission loss of the waveguide is decreased after the optical waveguide experiences thermal reflow at 160℃. The proposed thermal reflow technique will be expected to adopt to improve the transmission performance of the optical waveguide on the printed circuit board showing important practical applications.
引文
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[2]JOU J,SHIH T,CHIU C.400Gb/s optical transmitter and receiver modules for on-board interconnects using polymer waveguide arrays[J].OSAContinuum,2018,1(2):658-667.
[3]HAURYLAU M,CHEN G,CHEN H,et al.On-Chip Optical Interconnect Roadmap:Challenges and Critical Directions[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(6):1699-1705.
[4]DANGEL R,BERGER C,BEYELER R,et al.Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications[J].IEEE Transactions on Advanced Packaging,2008,31(4):759-767.
[5]SCHARES L,KASH J,DOANY F,et al.Terabus:Terabit/Second-Class Card-Level Optical Interconnect Technologies[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(5):1032-1044.
[6]CHAO C,GUO L.Reduction of Surface Scattering Loss in Polymer Microrings Using Thermal-Reflow Technique[J].IEEE Photonics Technology Letters,2004,16(6):1498-1500.
[7]CHAO C,GUO L.Polymer Microring Resonators for Biochemical Sensing Applications[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(1):134-142.
[8]HU J,FENG N,CARLIE N,et al.Optical loss reduction in high-index-contrast chalcogenide glass waveguides via thermal reflow[J].Optics Express,2010,18(2):1469-1478.
[9]MARININS A,OZOLINS O,PANG X,et al.Thermal Reflow Engineered Cylindrical Polymer Waveguides for Optical Interconnects[J].IEEEPhotonics Technology Letters,2018,30(5):447-450.
[10]ELDADA L,SHACKLETTE L W.Advances in Polymer Integrated Optics[J].IEEE Journal of Selected Topics in Quantum Electronics,2000,6(1):54-68.