降低氰酸酯树脂热膨胀系数的研究进展
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  • 英文篇名:Study Development of Lowing Thermal Expansion Coefficient of Cyanate Ester Resin
  • 作者:陈毓焘 ; 李文晓 ; 金世奇
  • 英文作者:CHEN Yu-tao;LI Wen-xiao;JIN Shi-qi;School of Aerospace Engineering and Applied Mechanics,Tongji University;
  • 关键词:氰酸酯树脂 ; 热膨胀系数 ; 分子结构 ; 填充改性
  • 英文关键词:Cyanate Ester Resin;;Thermal Expansion Coefficient;;Molecular Structure;;Filling Modification
  • 中文刊名:SLGY
  • 英文刊名:China Plastics Industry
  • 机构:同济大学航空航天与力学学院;
  • 出版日期:2017-05-20
  • 出版单位:塑料工业
  • 年:2017
  • 期:v.45;No.360
  • 语种:中文;
  • 页:SLGY201705002
  • 页数:5
  • CN:05
  • ISSN:51-1270/TQ
  • 分类号:12-16
摘要
综述了国内外关于降低氰酸酯(CE)树脂热膨胀系数的两大类主要方法:改善分子结构和加入低热膨胀系数添加物。而后者按添加物的种类进一步分为:纳米粒子填充改性、负热膨胀系数材料改性、空心玻璃微珠填充改性、石墨烯填充改性以及液晶环氧树脂改性等。对未来降低氰酸酯树脂热膨胀系数的发展方向进行了展望。
        Main methods of decreasing the thermal expansion coefficient of cyanate ester( CE) resin at home and abroad were summarized,including the research on molecular structure and the addition of the additives with low thermal expansion coefficient. According to the types of additives, the latter could be divided into the following categories: nano-particles filling modification, materials with negative thermal expansion coefficient filling modification, hollow glass bead filling modification, graphene filling modification,liquid crystalline epoxy resin modification and so on. The future development trend of lowing the thermal expansion coefficient of cyanate ester resin was prospected.
引文
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