拉伸纳米掺杂三层复合PI薄膜的介电性能
|
摘要
对部分亚胺化的纳米Al/Si掺杂三层复合聚酰胺酸薄膜进行拉伸处理(拉伸比为:横向5%,纵向2.5%),然后经高温闭环,制得一系列不同厚度的拉伸和未拉伸三层复合PI薄膜.在相同的环境条件下测试电导电流、介电谱和耐电晕老化寿命,研究掺杂层厚度和拉伸比例对复合薄膜介电性能的影响.结果表明:对于未拉伸的薄膜,随着掺杂层厚度的增加,电老化阈值略有下降、耐电晕寿命明显的提高;在相同场强下,电导电流随着掺杂层厚度的增加而增大.对于相同厚度的薄膜,拉伸也会使电导电流增大、电老化阈值略有减小,拉伸也使得耐电晕寿命明显的提高.在本实验范围内,拉伸对复合薄膜介电性能的影响,类似于增加掺杂层厚度的作用.
The drawn composite films with different thickness were prepared by drawing nano-hybrid polyamide acid three-layer composite film and then through the ring closing reaction in the high temperature( draw ratio: 5 %transverse direction,2. 5 % longitudinal). In the same condition,the dielectric properties were measured by testing conduction current,dielectric spectroscopy,and corona resistant,to study the impact of tensile and thickness on the dielectric properties of nano-hybrid polyimide composite film. The results showed that: for the undrawn composite films,within the increase of doped layer thickness,the electrical degradation threshold showed a decreasing trend,the corona resistance was significantly improved,under the same electric field strength,the conduction current of composite films increased with doped layer thickness increasing. For the drawn composite films with the same doped thickness,the conduction current of composite films relative increased; the electrical degradation threshold was slightly decreased; While,the corona resistant were enhanced obviously. So effect on the dielectric properties of the films,tensile was equivalent to increase the thickness of the doping layer.
The drawn composite films with different thickness were prepared by drawing nano-hybrid polyamide acid three-layer composite film and then through the ring closing reaction in the high temperature( draw ratio: 5 %transverse direction,2. 5 % longitudinal). In the same condition,the dielectric properties were measured by testing conduction current,dielectric spectroscopy,and corona resistant,to study the impact of tensile and thickness on the dielectric properties of nano-hybrid polyimide composite film. The results showed that: for the undrawn composite films,within the increase of doped layer thickness,the electrical degradation threshold showed a decreasing trend,the corona resistance was significantly improved,under the same electric field strength,the conduction current of composite films increased with doped layer thickness increasing. For the drawn composite films with the same doped thickness,the conduction current of composite films relative increased; the electrical degradation threshold was slightly decreased; While,the corona resistant were enhanced obviously. So effect on the dielectric properties of the films,tensile was equivalent to increase the thickness of the doping layer.
引文
[1]李卫国,杨鑫,郭昱延,等.不同环境中三种聚合物薄膜拉伸状态下的交、直流绝缘强度研究[J].低温物理学报,2013,35(2):122-127.
[2]BOESE,HERMINGH D,YOON S,et al.Chain Orientation and Anisotropies in Optical and Dielectric Properties in Thin Films of Stiff Polyimides[J].Applied Polymer,1991(227):379-386.
[3]马鹏常,杨正华.单向拉伸聚酰亚胺薄膜[J].应用化学,2007,24(3):331-334.
[4]MENG SONG,KUN NANCAO.AC Dielectric Strength of Polymer Materials under Tensile Stress at 77K and Normal Temperature[J].Applied Superconductivity and Electromagnetic Devices,2013:476-477.
[5]TANAKA T,HOSOYAMA K.The Tensile Properties of Polyimide Film at Eryogenic Temperatures and Radiation Effects on Polyimide Films[J].Advances in Cryogenic Engineering Materials,1997,42:21-27.
[6]杨宝京,乙耀中,张和康,等.单轴拉伸聚酰亚胺薄膜的形态结构对电导和介质损耗的影响[J].绝缘材料通讯,1987(5):13.
[7]MASAKATSU K,HIROMCHI S,HIROTARO K.Molecular Aggregation and Mechanical Properties of Kapton H[J].Journal of Polymer Science:Polymer Physics Edition,1984,22(11):1979-1985.
[8]YUZHAN J,FENGTIAN G.Preparation of Polyimide Ba Ti O3/Ag Nano-composite Films via in situ Technique and Study of their Dielectric Behavior[J].Chinese Journal Polymer Science,2014,32(4):421-431.
[9]陈昊,范勇,周宏,等.耐电晕PI/无机纳米氧化物复合薄膜设计及性能[J],电机与控制学报,2012,16(5):81-85.
[10]范勇,谭及兰,谢艳红,等.纳米Zr-Ti-Al复合氧化物杂化PI薄膜的耐电晕性[J].哈尔滨理工大学学报,2014,19(4):59-62.
[11]丁孟贤.聚酰亚胺-化学、结构与性能的关系及材料[M].北京:科学出版社,2006.
[12]CHEN Dan,ZHU Hong,LIU Tianxi.In situ Thermal Preparation of Polyimide Nano-composite Films Containing Functionalized Graphene Sheets[J].ACS Applied Mater&Interfaces,2010,2(12):3702-3708.
[13]张沛红,李刚,盖凌云,等.聚酰亚胺薄膜的高场电导特性[J].材料研究学报,2006,20(5):465-468.
[14]雷清泉,石林爽,田付强,等.电晕老化前后100HN和100CR聚酰亚胺薄膜的电导电流特性实验研究[J].中国电机工程学报,2010,30(13):109-113.
[15]周力任,吴广宁,高波,等.聚酰亚胺薄膜中电荷输运机理和空间电荷特性[J].电工技术学报,2009,24(12):6-11.
[16]李景德,雷德明.电介质材料物理和应用[M].广洲:中山大学出版社,1992:173-175.
[17]高波,吴广宁,曹开江,等.聚酰亚胺纳米复合薄膜的耐电晕机理[J].高电压技术,2012,39(12):2882-2888.
[18]CHEN HAO,FAN YONG,ZHOU HONG,et al.The Impact of Corona Pretreatment on Corona Resistant Polyimide Films[J].2011 The 6th International Forum on Strategic Technology,2011(8):130-132.
[19]孙志,韩柏,张东,等.耐电晕聚酰亚胺薄膜表面电荷特性[J].纳米技术与精密工程,2010,8(6):532-536.
[20]冯宇,殷景华,陈明华,等.聚酰亚胺/Ti O2纳米杂化薄膜耐电晕性能的研究[J].中国电机工程学报,2013,33(22):142-147.
[21]陈昊,范勇,杨瑞宵,等.聚酰亚胺薄膜绝缘材料耐电晕机理研究[J].电机与控制学报,2013,5(17):28-31.
[2]BOESE,HERMINGH D,YOON S,et al.Chain Orientation and Anisotropies in Optical and Dielectric Properties in Thin Films of Stiff Polyimides[J].Applied Polymer,1991(227):379-386.
[3]马鹏常,杨正华.单向拉伸聚酰亚胺薄膜[J].应用化学,2007,24(3):331-334.
[4]MENG SONG,KUN NANCAO.AC Dielectric Strength of Polymer Materials under Tensile Stress at 77K and Normal Temperature[J].Applied Superconductivity and Electromagnetic Devices,2013:476-477.
[5]TANAKA T,HOSOYAMA K.The Tensile Properties of Polyimide Film at Eryogenic Temperatures and Radiation Effects on Polyimide Films[J].Advances in Cryogenic Engineering Materials,1997,42:21-27.
[6]杨宝京,乙耀中,张和康,等.单轴拉伸聚酰亚胺薄膜的形态结构对电导和介质损耗的影响[J].绝缘材料通讯,1987(5):13.
[7]MASAKATSU K,HIROMCHI S,HIROTARO K.Molecular Aggregation and Mechanical Properties of Kapton H[J].Journal of Polymer Science:Polymer Physics Edition,1984,22(11):1979-1985.
[8]YUZHAN J,FENGTIAN G.Preparation of Polyimide Ba Ti O3/Ag Nano-composite Films via in situ Technique and Study of their Dielectric Behavior[J].Chinese Journal Polymer Science,2014,32(4):421-431.
[9]陈昊,范勇,周宏,等.耐电晕PI/无机纳米氧化物复合薄膜设计及性能[J],电机与控制学报,2012,16(5):81-85.
[10]范勇,谭及兰,谢艳红,等.纳米Zr-Ti-Al复合氧化物杂化PI薄膜的耐电晕性[J].哈尔滨理工大学学报,2014,19(4):59-62.
[11]丁孟贤.聚酰亚胺-化学、结构与性能的关系及材料[M].北京:科学出版社,2006.
[12]CHEN Dan,ZHU Hong,LIU Tianxi.In situ Thermal Preparation of Polyimide Nano-composite Films Containing Functionalized Graphene Sheets[J].ACS Applied Mater&Interfaces,2010,2(12):3702-3708.
[13]张沛红,李刚,盖凌云,等.聚酰亚胺薄膜的高场电导特性[J].材料研究学报,2006,20(5):465-468.
[14]雷清泉,石林爽,田付强,等.电晕老化前后100HN和100CR聚酰亚胺薄膜的电导电流特性实验研究[J].中国电机工程学报,2010,30(13):109-113.
[15]周力任,吴广宁,高波,等.聚酰亚胺薄膜中电荷输运机理和空间电荷特性[J].电工技术学报,2009,24(12):6-11.
[16]李景德,雷德明.电介质材料物理和应用[M].广洲:中山大学出版社,1992:173-175.
[17]高波,吴广宁,曹开江,等.聚酰亚胺纳米复合薄膜的耐电晕机理[J].高电压技术,2012,39(12):2882-2888.
[18]CHEN HAO,FAN YONG,ZHOU HONG,et al.The Impact of Corona Pretreatment on Corona Resistant Polyimide Films[J].2011 The 6th International Forum on Strategic Technology,2011(8):130-132.
[19]孙志,韩柏,张东,等.耐电晕聚酰亚胺薄膜表面电荷特性[J].纳米技术与精密工程,2010,8(6):532-536.
[20]冯宇,殷景华,陈明华,等.聚酰亚胺/Ti O2纳米杂化薄膜耐电晕性能的研究[J].中国电机工程学报,2013,33(22):142-147.
[21]陈昊,范勇,杨瑞宵,等.聚酰亚胺薄膜绝缘材料耐电晕机理研究[J].电机与控制学报,2013,5(17):28-31.