调制比对磁控溅射Ti/TiN多层膜组织结构和结合力的影响
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摘要
通过固定薄膜厚度与调制周期,改变Ti与TiN调制比(分别为1∶3、1∶5、1∶9和1∶11),采用反应磁控溅射法在硅片上制备Ti/TiN多层膜,研究调制比对薄膜微观组织结构及薄膜与基体结合力的影响。用X射线衍射仪(XRD)分析薄膜的晶体结构,用扫描电镜(SEM)观察薄膜的形貌,用纳米压痕仪测试薄膜的硬度,用纳米划痕仪测试薄膜与基体之间的结合力。结果表明:多层膜中TiN出现(220)晶面择优取向,Ti/TiN薄膜为柱状晶方式生长。柱状晶的细化程度随调制比的变化而发生周期性变化,柱状晶组织细化程度高的样品具有更高的硬度,但结合力更低。
Some alternating Ti/TiN multilayer films were deposited on Si substrates by reactive magnetron sputtering with constant modulation period and film thickness but varying modulation ratio(1:3, 1:5, 1:9, and 1:11) to explore the effect of modulation ratio on microstructure of film and its adhesion strength to the substrate. The crystal structure, micromorphology, hardness, and adhesion strength of the multilayer films were examined using X-ray diffractometer(XRD), scanning electron microscope(SEM), nanoindentation tester, and nanoscratch tester, respectively. The results showed that the Ti N phase exhibited a preferred orientation at (220) plane. The multilayer film had a columnar microstructure, and its fineness was changed periodically with modulation ratio. The films with finer columnar microstructure had higher hardness but lower adhesion strength.
Some alternating Ti/TiN multilayer films were deposited on Si substrates by reactive magnetron sputtering with constant modulation period and film thickness but varying modulation ratio(1:3, 1:5, 1:9, and 1:11) to explore the effect of modulation ratio on microstructure of film and its adhesion strength to the substrate. The crystal structure, micromorphology, hardness, and adhesion strength of the multilayer films were examined using X-ray diffractometer(XRD), scanning electron microscope(SEM), nanoindentation tester, and nanoscratch tester, respectively. The results showed that the Ti N phase exhibited a preferred orientation at (220) plane. The multilayer film had a columnar microstructure, and its fineness was changed periodically with modulation ratio. The films with finer columnar microstructure had higher hardness but lower adhesion strength.
引文
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[16]GHOSH S K,LIMAYE P K,SWAIN B P,et al.Tribological behavior and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate[J].Surface and Coatings Technology,2007,201(8):4639-4618.
[17]LEWIS D B,DONOHUE L A,LEMBKE M,et al.The influence of the yttrium content on the structure and properties of Ti1-x-y-zAlxCryYzN PVD hard coatings[J].Surface and Coatings Technology,1999,114(2/3):187-199.
[2]VANDONI L,DEMIR A G,PREVITALI B,et al.Wear behavior of fiber laser textured TiN coatings in a heavy loaded sliding regime[J].Materials,2012,5(11):2360-2382.
[3]GHASEMI S,SHANAGHI A,CHU P K.Nano mechanical and wear properties of multi-layer Ti/TiN coatings deposited on Al 7075 by high-vacuum magnetron sputtering[J].Thin Solid Films,2017,638:96-104.
[4]LEI S,HUANG J H,CHEN H.Measurement of residual stress on TiN/Ti bilayer thin films using average X-ray strain combined with laser curvature and nanoindentation methods[J].Materials Chemistry and Physics,2017,199:185-192.
[5]MIAN M S,OKIMURA K,KOHZAKI M.Comparative study of TiN and TiN/Ti as bottom electrodes for layered type devices with phase transition VO2films[J].Thin Solid Films,2017,636:63-39.
[6]FLORES M,HUERTA L,ESCAMILLA R,et al.Effect of substrate bias voltage on corrosion of TiN/Ti multilayers deposited by magnetron sputtering[J].Applied Surface Science,2007,253(17):7192-7196.
[7]YIN A Y,YAN J W,CHEN L,et al.Experimental and numerical investigation of buckling and delamination of Ti/TiN coatings on depleted uranium under compression[J].Applied Surface Science,2017,422:997-1006.
[8]MATTHEWS A,JONES R,DOWEY S.Modelling the deformation behavior of multilayer coatings[J].Tribology Letters,2001,11(2):103-106.
[9]KIM G S,LEE S Y,HAHN J H,et al.Effect of the thickness of Ti buffer layer on the mechanical properties of TiN coatings[J].Surface and Coatings Technology,2002,171(1/2/3):83-90.
[10]SHUKLA K,RANE R,ALPHONSA J,et al.Structural,mechanical and corrosion resistance properties of Ti/TiN bilayers deposited by magnetron sputtering on AISI 316L[J].Surface and Coatings Technology,2017,324:167-174.
[11]LI T S,LI H,PAN F.Microstructure and nanoindentation hardness of Ti/TiN multilayered films[J].Surface and Coatings Technology.2001,137(2/3):225-229.
[12]杨方亮,王彦峰.钛合金表面百微米级Ti/TiN多层复合涂层性能研究[J].表面技术,2017,46(3):96-100.
[13]崔文芳,曹栋,秦高悟.磁控溅射沉积Ti/TiN多层膜的组织特征及耐磨损性能[J].金属学报,2015,51(12):1531-1537.
[14]肖娜,杜菲菲,杨波.调制周期对TiN/Ti多层膜组织结构和结合力的影响[J].中国表面工程.2015,28(2):65-69.
[15]龚海飞,邵天敏,张晨辉,等.TiN/Ti多层膜调制比对摩擦磨损行为影响的研究[J].无机材料学报.2008,23(4):758-762.
[16]GHOSH S K,LIMAYE P K,SWAIN B P,et al.Tribological behavior and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate[J].Surface and Coatings Technology,2007,201(8):4639-4618.
[17]LEWIS D B,DONOHUE L A,LEMBKE M,et al.The influence of the yttrium content on the structure and properties of Ti1-x-y-zAlxCryYzN PVD hard coatings[J].Surface and Coatings Technology,1999,114(2/3):187-199.