超声波作用下Al/Zn-14Al/Cu钎焊接头的显微组织及力学性能
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摘要
采用Zn-14Al过共晶焊料并借助超声波振动对Al/Cu异质金属进行了无钎剂钎焊连接,研究了在420℃超声钎焊不同时间时接头显微结构及力学性能的影响。研究结果表明,随着超声振动时间的延长,钎缝层中的α-Al相减小,Zn-Al共晶相和CuZn_5相增多,Cu界面反应层由以CuZn_5相为主逐步转变为Al_(4.2)Cu_(3.2)Zn_(0.7)相。接头的剪切强度随钎焊时间的延长呈现先增加后减小趋势,钎焊时间为8 s时接头获得了最佳的剪切强度82.6 MPa。
Al/Cu dissimilar metals were jointed using an ultrasound-assisted fluxless brazing method with Zn-14 Al hypereutectic filler metal. The effect of ultrasonic brazing time at 420 ℃ on the microstructure and mechanical properties of the joint was investigated. The results show that with the increase of ultrasonic vibration time, the α-Al phase in the brazed seam layer decrease, and the Zn-Al eutectic phase and CuZn_5 phase increase. CuZn_5 phase changes into Al_(4.2)Cu_(3.2)Zn_(0.7) phase in the Cu interfacial layer. The shear strength of the joint increases firstly then decreases with prolonging ultrasonic brazing time,the highest shear strength is obtained with a value of 82.6 MPa when the joint is ultrasonic brazed for 8 s.
Al/Cu dissimilar metals were jointed using an ultrasound-assisted fluxless brazing method with Zn-14 Al hypereutectic filler metal. The effect of ultrasonic brazing time at 420 ℃ on the microstructure and mechanical properties of the joint was investigated. The results show that with the increase of ultrasonic vibration time, the α-Al phase in the brazed seam layer decrease, and the Zn-Al eutectic phase and CuZn_5 phase increase. CuZn_5 phase changes into Al_(4.2)Cu_(3.2)Zn_(0.7) phase in the Cu interfacial layer. The shear strength of the joint increases firstly then decreases with prolonging ultrasonic brazing time,the highest shear strength is obtained with a value of 82.6 MPa when the joint is ultrasonic brazed for 8 s.
引文
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[4] Chen X, Xie R, Lai Z, et al. Ultrasonic-assisted brazing of Al-Ti dissimilar alloy by a filler metal with a large semi-solid temperature range[J]. Materials&Design, 2016, 95:296-305.
[5] Guo W, Luan T, He J, et al. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloys using ZnAl filler metals[J].Materials&Design, 2017, 125:85-93.
[6] Zhang H, Wei C, He J, et al. Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering[J]. Journal of Materials Processing Technology, 2015, 223:1-7.
[7] Skorb E V, Shchukin D G, M?hwald H, et al.Ultrasound-driven design of metal surface nanofoams[J].Nanoscale, 2010, 2(5):722-727.
[8] Khosro Aghayani M,Niroumand B. Effects of ultrasonic treatment on microstructure and tensile strength of AZ91magnesium alloy[J]. Journal of Alloys and Compounds,2011, 509(1):114-122.
[9] Chinnam R K, Fauteux C, Neuenschwander J, et al. Evolution of the microstructure of the microstructrue of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification[J]. Acta Materialia, 2011,59(4):1474-1481.
[2] Xiao Y, Ji H J, Li M Y, et al. Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn-Al/Cu joint[J]. Materials Science and Engineering A,2014, 594:135-139.
[3] Mehta K P, Badheka V J. A review on dissimilar friction stir welding of copper to aluminum:process, properties, and variants[J]. Materials and Manufacturing Processes, 2016, 31(3):233-254.
[4] Chen X, Xie R, Lai Z, et al. Ultrasonic-assisted brazing of Al-Ti dissimilar alloy by a filler metal with a large semi-solid temperature range[J]. Materials&Design, 2016, 95:296-305.
[5] Guo W, Luan T, He J, et al. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloys using ZnAl filler metals[J].Materials&Design, 2017, 125:85-93.
[6] Zhang H, Wei C, He J, et al. Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering[J]. Journal of Materials Processing Technology, 2015, 223:1-7.
[7] Skorb E V, Shchukin D G, M?hwald H, et al.Ultrasound-driven design of metal surface nanofoams[J].Nanoscale, 2010, 2(5):722-727.
[8] Khosro Aghayani M,Niroumand B. Effects of ultrasonic treatment on microstructure and tensile strength of AZ91magnesium alloy[J]. Journal of Alloys and Compounds,2011, 509(1):114-122.
[9] Chinnam R K, Fauteux C, Neuenschwander J, et al. Evolution of the microstructure of the microstructrue of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification[J]. Acta Materialia, 2011,59(4):1474-1481.