单层与双层微通道内流体流动及传热特性研究
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摘要
为了应对集成电路中日益严峻的热问题,本文实验研究了矩形单层微通道(S-R)、锯齿单层微通道(S-Z)、矩形双层微通道(D-R)以及下层矩形上层锯齿微通道(D-R-Z)四种结构内流体的流动及换热特性,实验结果表明:相同流量下这四种结构的压降逐渐增加,双层结构的换热特性好于单层结构.在D-R结构中,将上层吸热量较多的矩形通道换为锯齿形通道后,整体性能得到提升.
To deal with the increasingly severe thermal issues in integrated circuits, the flow and heat transfer characteristics of the fluid in S-R, S-Z, D-R and D-R-Z are experimentally investigated.The results indicate that: the pressure drop of these four structures increases gradually under the same flow rate, the heat transfer characteristics of double-layer channels is better than single-layer channel. In the D-R structure, when the rectangular channel with more heat absorption replaced by zigzag channel, the overall performance is improved.
To deal with the increasingly severe thermal issues in integrated circuits, the flow and heat transfer characteristics of the fluid in S-R, S-Z, D-R and D-R-Z are experimentally investigated.The results indicate that: the pressure drop of these four structures increases gradually under the same flow rate, the heat transfer characteristics of double-layer channels is better than single-layer channel. In the D-R structure, when the rectangular channel with more heat absorption replaced by zigzag channel, the overall performance is improved.
引文
[1] SHI Bing, Srivastava A. Optimized Micro-channel Design for Stacked 3-D-ICs[J]. IEEE Transactions on ComputerAided Design of Integrated Circuits and Systems, 2014,33(1):90-100
[2] Im S, Banerjee K. Full Chip Thermal Analysis of Planar(2-D)and Vertically Integrated(3-D)High Performance ICs[C]//Electron Devices Meeting, 2000. IEDM'00.Technical Digest. International. Piscataway:IEEE, 2000:727-730
[3] LU Tianjian, ZHANG Feini, JIN Jianming. Multiphysics Simulation of 3-D ICs With Integrated Microchannel Cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 06(11):1620-1629
[4] Tucker man D B, Pease R F W. High-Performance Heat Sinking for VLSI[J]. IEEE Electron device letters, 1981,2(5):126-129
[5] Wu H Y, CHENG Ping. Friction Factors in Smooth Trapezoidal Silicon Microchannels with Different Aspect Ratios[J]. International Journal of Heat and Mass Transfer, 2003, 46(14):2519-2525
[6] XIA Guodong, CHAI Lei, WANG Haiyan, et al. Optimum Thermal Design of Microchannel Heat Sink With Triangular Reentrant Cavities[J]. Applied Thermal Engineering, 2011, 31(6):1208-1219
[7] Guzmdn A M, Cárdenas M J, Urzúa F A, et al. Heat Transfer Enhancement by Flow Bifurcations in Asymmetric Wavy Wall Channels[J]. International Journal of Heat and Mass Transfer, 2009, 52(15):3778-3789
[8] Croce G, D'agaro P, Nonino C. Three-Dimensional Roughness Effect on Microchannel Heat Transfer and Pressure Drop[J]. International Journal of Heat and Mass Transfer, 2007, 50(25):5249-5259
[9] Koo J M, Im S, JIANG Linan, et al. Integrated Microchannel Cooling for Three-Dimensional Electronic Cir-cuit Architectures[J]. Journal of Heat Transfer, 2005,127(1):49-58
[10] King C R, Sekar D, Bakir M S, et al. 3D Stacking of Chips with Electrical and Microfluidic I/O Interconnects[C]//58th Electronic Components and Technology Conference,Piscataway:IEEE, 2008:1-7
[11] Brunschwiler T, Michel B, Rothuizen H, et al. Forced Convective Interlayer Cooling in Vertically Integrated Packages[C]//11th Intersociety Conference, Thermal and Thermomechanical Phenomena in Electronic Systems, Piscataway:IEEE, 2008:1114-1125
[12] Sarvey T E, ZHANG Yang, ZHANG Yue, et al. Thermal and Electrical Effects of Staggered Micropin-Fin Dimensions for Cooling of 3D Microsystems[C]//IEEE Intersociety Conference, Thermal and Thermomechanical Phenomena in Electronic Systems, Piscataway:IEEE, 2014:205-212
[2] Im S, Banerjee K. Full Chip Thermal Analysis of Planar(2-D)and Vertically Integrated(3-D)High Performance ICs[C]//Electron Devices Meeting, 2000. IEDM'00.Technical Digest. International. Piscataway:IEEE, 2000:727-730
[3] LU Tianjian, ZHANG Feini, JIN Jianming. Multiphysics Simulation of 3-D ICs With Integrated Microchannel Cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 06(11):1620-1629
[4] Tucker man D B, Pease R F W. High-Performance Heat Sinking for VLSI[J]. IEEE Electron device letters, 1981,2(5):126-129
[5] Wu H Y, CHENG Ping. Friction Factors in Smooth Trapezoidal Silicon Microchannels with Different Aspect Ratios[J]. International Journal of Heat and Mass Transfer, 2003, 46(14):2519-2525
[6] XIA Guodong, CHAI Lei, WANG Haiyan, et al. Optimum Thermal Design of Microchannel Heat Sink With Triangular Reentrant Cavities[J]. Applied Thermal Engineering, 2011, 31(6):1208-1219
[7] Guzmdn A M, Cárdenas M J, Urzúa F A, et al. Heat Transfer Enhancement by Flow Bifurcations in Asymmetric Wavy Wall Channels[J]. International Journal of Heat and Mass Transfer, 2009, 52(15):3778-3789
[8] Croce G, D'agaro P, Nonino C. Three-Dimensional Roughness Effect on Microchannel Heat Transfer and Pressure Drop[J]. International Journal of Heat and Mass Transfer, 2007, 50(25):5249-5259
[9] Koo J M, Im S, JIANG Linan, et al. Integrated Microchannel Cooling for Three-Dimensional Electronic Cir-cuit Architectures[J]. Journal of Heat Transfer, 2005,127(1):49-58
[10] King C R, Sekar D, Bakir M S, et al. 3D Stacking of Chips with Electrical and Microfluidic I/O Interconnects[C]//58th Electronic Components and Technology Conference,Piscataway:IEEE, 2008:1-7
[11] Brunschwiler T, Michel B, Rothuizen H, et al. Forced Convective Interlayer Cooling in Vertically Integrated Packages[C]//11th Intersociety Conference, Thermal and Thermomechanical Phenomena in Electronic Systems, Piscataway:IEEE, 2008:1114-1125
[12] Sarvey T E, ZHANG Yang, ZHANG Yue, et al. Thermal and Electrical Effects of Staggered Micropin-Fin Dimensions for Cooling of 3D Microsystems[C]//IEEE Intersociety Conference, Thermal and Thermomechanical Phenomena in Electronic Systems, Piscataway:IEEE, 2014:205-212