Integrated optoelectronic chip pair for transmitting and receiving optical signals simultaneously

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英文篇名：Integrated optoelectronic chip pair for transmitting and receiving optical signals simultaneously 作者：刘凯 ; 位祺 ; 黄永清 ; 段晓峰 ; 王琦 ; 任晓敏 ; 蔡世伟 英文作者：Kai Liu;Qi Wei;Yongqing Huang;Xiaofeng Duan;Qi Wang;Xiaomin Ren;Shiwei Cai;State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications; 中文刊名：GXKB 英文刊名：中国光学快报(英文版) 机构：State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications; 出版日期：2019-04-25 出版单位：Chinese Optics Letters 年：2019 期：v.17 基金：supported by the National Natural Science Foundation of China(Nos.61874147,61574019,61674020,and 61674018);; the Fund of State Key Laboratory of Information Photonics and Optical Communications(No.IPOC2016ZT10);; the Specialized Research Fund for the Doctoral Program of Higher Education of China(No.20130005130001);; the 111 Project(No.B07005) 语种：英文; 页：GXKB201904010 页数：5 CN：04 ISSN：31-1890/O4 分类号：56-60

摘要

An integrated optoelectronic chip pair, which can transmit and receive optical signals simultaneously, is proposed in this Letter. The design and optimization of its key structure, the vertical cavity surface emitting laser's distributed Bragg reflector, are presented. Analysis is also done for its influence on the integrated chip's performance. Moreover, the chip pair's performance under dynamic conditions is analyzed. Their 3 dB modulation bandwidths are higher than 10 GHz, and their 3 dB photo-response bandwidths are around 23 GHz. Their applications will further improve the performances of the optical interconnects.
        An integrated optoelectronic chip pair, which can transmit and receive optical signals simultaneously, is proposed in this Letter. The design and optimization of its key structure, the vertical cavity surface emitting laser's distributed Bragg reflector, are presented. Analysis is also done for its influence on the integrated chip's performance. Moreover, the chip pair's performance under dynamic conditions is analyzed. Their 3 dB modulation bandwidths are higher than 10 GHz, and their 3 dB photo-response bandwidths are around 23 GHz. Their applications will further improve the performances of the optical interconnects.

引文

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