用多乙烯多胺掩蔽镍测定酸铜镀液中锌杂质的方法
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摘要
以硫脲掩蔽酸铜镀液中的二价铜离子,以多乙烯多胺掩蔽可能残留的二价铜离子以及镍杂质,以抗坏血酸和氟化钠分别掩蔽铁杂质和铝杂质,加醋酸钠与镀液中的硫酸反应形成醋酸-醋酸钠缓冲体系,使试液的p H为5.2～5.5。然后以二甲酚橙作指示剂,用EDTA标准溶液滴定锌离子。测定结果的相对平均偏差为0.35%,回收率为99.0%。
The copper(Ⅱ) ions in an acid copper electroplating bath are masked by thiourea. The residual copper(Ⅱ) ions and nickel impurities are masked by polyethylene polyamine. The iron and aluminum impurities are masked by ascorbic acid and sodium fluoride, respectively. Sodium acetate is added to the test solution and react with the sulfuric acid previously in it, forming an acetic acid–sodium acetate buffer with a pH ranging from 5.2 to 5.5. Zinc ions are then titrated by EDTA(ethylenediaminetetraacetic acid) standard solution with xylenol orange as indicator. The method features a relative average deviation of 0.35% and a recovery of 99.0%.
The copper(Ⅱ) ions in an acid copper electroplating bath are masked by thiourea. The residual copper(Ⅱ) ions and nickel impurities are masked by polyethylene polyamine. The iron and aluminum impurities are masked by ascorbic acid and sodium fluoride, respectively. Sodium acetate is added to the test solution and react with the sulfuric acid previously in it, forming an acetic acid–sodium acetate buffer with a pH ranging from 5.2 to 5.5. Zinc ions are then titrated by EDTA(ethylenediaminetetraacetic acid) standard solution with xylenol orange as indicator. The method features a relative average deviation of 0.35% and a recovery of 99.0%.
引文
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[5]郭崇武.酸性镀铜溶液中锌杂质的分析方法[J].电镀与精饰,2012,34(4):37-38.
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[9]黎小阳,郭崇武.焦磷酸盐铜-镍合金镀液中硫酸镍的分析[J].电镀与精饰,2016,38(6):36-38.
[2]郭崇武,王小琴.分析氯化钾无氰镀镉溶液中氯化镉的新方法[J].电镀与涂饰,2017,36(19):1064-1066.
[3]郭崇武.酸性镀锌溶液中氯化锌的分析方法[J].电镀与精饰,2016,38(1):42-43,46.
[4]王小琴,郭崇武.返滴定法测定氯化钾无氰镀镉溶液中氯化镉[J].电镀与精饰,2018,40(3):44-46.
[5]郭崇武.酸性镀铜溶液中锌杂质的分析方法[J].电镀与精饰,2012,34(4):37-38.
[6]董荟文,郭崇武.EDTA容量法直接测定酸铜镀液中的锌杂质[J].电镀与环保,2014,34(3):38-39.
[7]郭崇武.测定酸铜镀液中锌杂质的新方法[J].电镀与涂饰,2016,35(5):265-267.
[8]武汉材料保护研究所.常用电镀溶液的分析[M].北京:机械工业出版社,1974:349.
[9]黎小阳,郭崇武.焦磷酸盐铜-镍合金镀液中硫酸镍的分析[J].电镀与精饰,2016,38(6):36-38.