新型碱性无氰镀镉工艺及其镀液与镀层性能
|
摘要
开发了碱性无氰镀镉新工艺。镀液中含氯化镉25～35 g/L、配位剂90～140 g/L、氯化钾140～180 g/L、光亮剂1.5～2.5 mL/L和辅助剂25～35 mL/L,pH为7.5～8.5,温度20～35°C。对于挂镀,阴极电流密度为0.5～1.5 A/dm~2;对于滚镀,槽电压为5～10 V,滚筒转速为4～8 r/min。在1.0 A/dm~2下电镀,镉的沉积速率约为0.35μm/min。该工艺的电流效率为70%左右,均镀能力为43%～59%,深镀能力为8.3,热震结合力合格。镉镀层经过低铬彩色钝化后进行中性盐雾试验1 000 h,无白锈生成。弯曲测试结果表明,厚度为36μm左右的镉镀层也具有良好的柔软性。
A novel alkaline cyanide-free cadmium plating process was developed. The bath is composed of cadmium chloride 25-35 g/L, complexing agent 90-140 g/L, KCl 140-180 g/L, brightening agent 1.5-2.5 mL/L, and auxiliary agent 25-35 mL/L with a pH of 7.5-8.5 and operated at 20-35 °C. For rack plating, the cathodic current density is 0.5-1.5 A/dm~2; for barrel plating, the bath voltage is 5-10 V and the barrel rotation rate is 4-8 r/min. The deposition rate of cadmium is ca. 0.35 μm/min at 1.0 A/dm~2. The bath features a current efficiency of ca.70.3%, a throwing power of 43%-59%, a covering power of 8.3, and a satisfactory adhesion strength(thermal shock resistance). The cadmium coatings treated by lowchromium iridescent passivation is able to endure a neutral salt spray test for 1 000 h without the formation of white rust. The blending test result showed that even a 36.3 μm-thick cadmium coating had good flexibility.
A novel alkaline cyanide-free cadmium plating process was developed. The bath is composed of cadmium chloride 25-35 g/L, complexing agent 90-140 g/L, KCl 140-180 g/L, brightening agent 1.5-2.5 mL/L, and auxiliary agent 25-35 mL/L with a pH of 7.5-8.5 and operated at 20-35 °C. For rack plating, the cathodic current density is 0.5-1.5 A/dm~2; for barrel plating, the bath voltage is 5-10 V and the barrel rotation rate is 4-8 r/min. The deposition rate of cadmium is ca. 0.35 μm/min at 1.0 A/dm~2. The bath features a current efficiency of ca.70.3%, a throwing power of 43%-59%, a covering power of 8.3, and a satisfactory adhesion strength(thermal shock resistance). The cadmium coatings treated by lowchromium iridescent passivation is able to endure a neutral salt spray test for 1 000 h without the formation of white rust. The blending test result showed that even a 36.3 μm-thick cadmium coating had good flexibility.
引文
[1]杨凤轩.以DPE-III为添加剂的无氰镀镉[J].防腐包装,1983,12(4):5-8.
[2]杨勤俭.无氰镀镉在我厂的应用[J].电镀与环保,1996,16(2):29-30.
[3]黄平,陈端杰.无氰镀镉工艺研究及应用[J].新技术新工艺,2008(11):17-18.
[4]万冰华,杨军,王福新,等.无氰镀镉工艺开发研究与应用[J].电镀与精饰,2014,36(3):22-25,46.
[5]杨乾方,封淑英,刘芳.无氰镀镉废水处理研究[J].四川环境,1982,4(1):36-39.
[6]郭崇武.新型酸性无氰镀镉工艺的开发研究[J].电镀与涂饰,2016,35(5):250-255.
[7]广州超邦化工有限公司.一种用于航空航天零部件的高耐腐蚀性镀镉层:201520672126.3[P].2015-12-30.
[8]广州超邦化工有限公司.酸性无氰镀镉添加剂、镀液制备及电镀工艺:201610785483.X[P].2018-06-29.
[9]代朋民,唐亓.新型无氰镀镉工艺的研究与应用[J].电镀与精饰,2017,39(2):35-38.
[10]陈康,郭崇武,代朋民.氯化钾无氰镀镉故障的处理措施[J].电镀与涂饰,2017,36(5):257-259.
[11]王小琴,郭崇武.返滴定法测定氯化钾无氰镀镉溶液中氯化镉[J].电镀与精饰,2018,40(3):44-46.
[12]郭崇武,王小琴.分析氯化钾无氰镀镉溶液中氯化镉的新方法[J].电镀与涂饰,2017,36(19):1064-1066.
[13]陈媚,郭崇武,黎小阳.氯化钾无氰镀镉溶液中铜杂质的分析[J].电镀与涂饰,2017,36(3):169-170.
[14]郭崇武,陈建锐,李小花.钛铁试剂分光光度法测定氯化钾无氰镀镉溶液中的铁杂质[J].电镀与涂饰,2017,36(24):1325-1326.
[15]罗小平,郭崇武,冼翠玲.原子吸收光谱法测定无氰镀镉溶液中的铅杂质[J].电镀与涂饰,2017,36(5):265-266.
[16]曾华梁,吴仲达,陈钧武,等.电镀工艺手册[M].北京:机械工业出版社,1989:821-823.
[17]郭崇武,代朋民.螯合沉淀法去除氯化钾无氰镀镉废水中的镉离子[J].电镀与涂饰,2018,37(4):190-192.
[2]杨勤俭.无氰镀镉在我厂的应用[J].电镀与环保,1996,16(2):29-30.
[3]黄平,陈端杰.无氰镀镉工艺研究及应用[J].新技术新工艺,2008(11):17-18.
[4]万冰华,杨军,王福新,等.无氰镀镉工艺开发研究与应用[J].电镀与精饰,2014,36(3):22-25,46.
[5]杨乾方,封淑英,刘芳.无氰镀镉废水处理研究[J].四川环境,1982,4(1):36-39.
[6]郭崇武.新型酸性无氰镀镉工艺的开发研究[J].电镀与涂饰,2016,35(5):250-255.
[7]广州超邦化工有限公司.一种用于航空航天零部件的高耐腐蚀性镀镉层:201520672126.3[P].2015-12-30.
[8]广州超邦化工有限公司.酸性无氰镀镉添加剂、镀液制备及电镀工艺:201610785483.X[P].2018-06-29.
[9]代朋民,唐亓.新型无氰镀镉工艺的研究与应用[J].电镀与精饰,2017,39(2):35-38.
[10]陈康,郭崇武,代朋民.氯化钾无氰镀镉故障的处理措施[J].电镀与涂饰,2017,36(5):257-259.
[11]王小琴,郭崇武.返滴定法测定氯化钾无氰镀镉溶液中氯化镉[J].电镀与精饰,2018,40(3):44-46.
[12]郭崇武,王小琴.分析氯化钾无氰镀镉溶液中氯化镉的新方法[J].电镀与涂饰,2017,36(19):1064-1066.
[13]陈媚,郭崇武,黎小阳.氯化钾无氰镀镉溶液中铜杂质的分析[J].电镀与涂饰,2017,36(3):169-170.
[14]郭崇武,陈建锐,李小花.钛铁试剂分光光度法测定氯化钾无氰镀镉溶液中的铁杂质[J].电镀与涂饰,2017,36(24):1325-1326.
[15]罗小平,郭崇武,冼翠玲.原子吸收光谱法测定无氰镀镉溶液中的铅杂质[J].电镀与涂饰,2017,36(5):265-266.
[16]曾华梁,吴仲达,陈钧武,等.电镀工艺手册[M].北京:机械工业出版社,1989:821-823.
[17]郭崇武,代朋民.螯合沉淀法去除氯化钾无氰镀镉废水中的镉离子[J].电镀与涂饰,2018,37(4):190-192.