缓蚀剂在镁合金化学机械抛光过程中的作用
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摘要
利用碱性体系抛光液研究了十二烷基苯磺酸钠(SDBS)缓蚀剂对镁合金化学机械抛光过程和抛光效果的影响。采用能谱仪XPS分析缓蚀剂在镁合金表面形成的膜层成分,并通过腐蚀试验、电化学分析和磨粒粒径测试的手段分析了抛光液中SDBS在镁合金化学机械抛光过程中的作用机理。结果表明:当SDBS含量为1.0%时,抛光液中SDBS可有效抑制镁合金在抛光过程中的腐蚀,缓释效果可达91%。SDBS与镁合金通过缩合反应生成保护膜,减小抛光后的表面粗糙度以及点蚀的出现,提高表面质量;另外,SDBS对Al2O3抛光磨粒具有一定的吸附作用。当SDBS含量为1.0%时,能有效抑制Al2O3磨粒团聚,进而对抛光效果产生一定的影响,减少抛光过程中划痕的产生。
A series of alkaline polishing slurry were used to investigate the effects of corrosion inhibitor,sodium dodecyl benzene sulfonate(SDBS),on Mg alloy.Corrosion test,electrochemical analysis and abrasive article size test were used to study the inhibiting-mechanism of SDBS.The results showed that,SDBS strongly inhibited the corrosion of Mg alloy in polishing slurry.The inhibition efficiency of 1.0% SDBS was more than 91%.SDBS was absorbed on the Mg alloy surface and then formed a protective film by condensation reaction.The protective film decrease the surface roughness,and also increase the friction coefficient in the polishing process.SDBS could be absorbed by Al2O3 polishing particles,which could inhibit the aggregation of particles.Al2O3 abrasive particle agglomeration is suppressed to reduce the scratches in the polishing process when SDBS content is of 1.0%.
A series of alkaline polishing slurry were used to investigate the effects of corrosion inhibitor,sodium dodecyl benzene sulfonate(SDBS),on Mg alloy.Corrosion test,electrochemical analysis and abrasive article size test were used to study the inhibiting-mechanism of SDBS.The results showed that,SDBS strongly inhibited the corrosion of Mg alloy in polishing slurry.The inhibition efficiency of 1.0% SDBS was more than 91%.SDBS was absorbed on the Mg alloy surface and then formed a protective film by condensation reaction.The protective film decrease the surface roughness,and also increase the friction coefficient in the polishing process.SDBS could be absorbed by Al2O3 polishing particles,which could inhibit the aggregation of particles.Al2O3 abrasive particle agglomeration is suppressed to reduce the scratches in the polishing process when SDBS content is of 1.0%.
引文
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[2]龚桦,王宁,顾忠华,等.铜化学机械抛光中复合缓蚀剂的作用机制[J].润滑与密封,2013(9):6-10,32.
[3]刘玉岭,王伟,牛新环,等.镁铝合金材料表面化学机械抛光液的制备方法[P].中国:CN102020975A,2011-04-20.
[4]陈景,刘玉岭,王晓云,等.镁合金抛光机理与CMP工艺研究[J].微纳电子技术,2008(2):114-117,122.
[5]张研,刘玉岭,牛新环,等.Mg-Al合金化学机械抛光中表面状态的研究[J].半导体技术,2010(1):75-78.
[6]Fang J Y,Tsai M S,Dai B T,et al.Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing[J].Journal of Electrochemical Society,2006,153(1):G44-G46.
[7]Fang J Y,Tsai M S,Dai B T,et al.Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing[J].Electrochemical and Solid State Letters,2005,8(5):G128-G130.
[8]Li X J,Guo D M,Ren R,et al.Research on effects of slurry additives in Cu CMP for ULSI manufacturing[J].Key Engineering Materials,2006,304/305:350-354.
[9]赵蕊.氯化钠溶液中AZ91D镁合金缓蚀剂的研究[D].北京:北京化工大学化学工程学院,2010.
[10]刘丙春.铝合金化学加速振动抛光试验及其理论研究[D].无锡:江南大学机械工程学院,2011.
[11]顾坚,李正兴,赵永武,等.单头单面旋转式化学机械抛光机的运动机理研究[J].煤矿机械,2006(8):39-41.
[12]姚志明.镁合金绿色缓蚀剂及其缓蚀机理研究[D].重庆:重庆大学化学化工学院,2008.
[13]Lou Chao,Zhang Xiyan,Duan Gaolin,et al.Characteristics of twin lamellar structure in magnesium alloy during room temperature dynamic plastic deformation[J].Journal of Materials Science&Technology,2014(1):41-46.
[14]Lunder O,Lein J E,Aune T K,et al.The roll of Mg17A112phase in the corrosion behavior of Mg-Al alloys[J].Corrosion,1989,45(9):741-748
[15]李凌杰,姚志明,雷惊雷,等.十二烷基苯磺酸钠在AZ31镁合金表面的吸附及其缓蚀作用[J].物理化学学报,2009(7):1332-1336.