AlTiN-Cu涂层的组织结构和性能
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摘要
采用阴极弧离子镀法在硬质合金基体上分别沉积AlTiN与AlTiN-Cu涂层,利用XRD、SEM、EDS、XPS、纳米压痕与切削实验等对比研究AlTiN涂层和AlTiN-Cu涂层的显微组织与切削性能。结果表明:AlTiN涂层为典型柱状晶粒结构,Cu的引入改变AlTiN涂层的晶粒生长方式与择优取向,细化晶粒组织,降低涂层硬度。对比AlTiN与AlTiN-Cu涂层可转位硬质合金刀片的切削性能发现,由于金属铜的润滑作用,AlTiN-Cu涂层在干式切削时切削寿命提高44%;Cu的引入导致涂层硬度降低,AlTiN涂层在湿式切削时性能更佳。
AlTiN and AlTiN-Cu coatings were deposited on cemented carbide substrates with cathodic arc ion plating. The properties of coatings were studied by X-ray diffractometry(XRD), scanning electron microscopy(SEM), energy dispersive X-ray spectroscopy(EDX), X-ray photoelectron spectroscopy(XPS), nanoindentation and cutting tests. The results show that AlTiN coating is typical columnar structure, Cu changes the grain growth way and preferred orientation, refines the grain sizes of the coating and reduces the coating hardness. AlTiN layer and AlTiN-Cu layer applied on the indexable inserts were compared in cutting tests. The AlTiN-Cu coatings cutting life is improved by 44% under conditions of dry cutting, which is caused by the effect of the lubrication of copper. Whereas, the AlTiN coatings are more successful at wet cutting, it can be attributed to the addition of Cu decreases the hardness of the coatings.
AlTiN and AlTiN-Cu coatings were deposited on cemented carbide substrates with cathodic arc ion plating. The properties of coatings were studied by X-ray diffractometry(XRD), scanning electron microscopy(SEM), energy dispersive X-ray spectroscopy(EDX), X-ray photoelectron spectroscopy(XPS), nanoindentation and cutting tests. The results show that AlTiN coating is typical columnar structure, Cu changes the grain growth way and preferred orientation, refines the grain sizes of the coating and reduces the coating hardness. AlTiN layer and AlTiN-Cu layer applied on the indexable inserts were compared in cutting tests. The AlTiN-Cu coatings cutting life is improved by 44% under conditions of dry cutting, which is caused by the effect of the lubrication of copper. Whereas, the AlTiN coatings are more successful at wet cutting, it can be attributed to the addition of Cu decreases the hardness of the coatings.
引文
[1]WILSON S,ALPAS A T.Effect of temperature and sliding velocity on Ti N coating wear[J].Surface&Coatings Technology,1997,94/95:53-59.
[2]WANG C F,SHIH-FU O U,CHIOU S Y.Microstructures of Ti N,Ti Al N and Ti Al VN coatings on AISI M2 steel deposited by magnetron reactive sputtering[J].Transactions of Nonferrous Metals Society of China,2014,24(8):2559-2565.
[3]曹华伟,张程煜,乔生儒,曹晓雨.物理气相沉积Ti Al N涂层的研究进展[J].材料导报,2011,25(6):25-29.CAO Hua-wei,ZHANG Cheng-yu,QIAO Sheng-ru,CAO Xiao-yu.Recent Progresses in physical vapor deposited Ti Al N coating[J].Materials Review,2011,25(6):25-29.
[4]黄自谦,贺跃辉,蔡海涛,肖逸锋,黄伯云.Ti Al N涂层的热残余应力分析[J].中国有色金属学报,2007,17(6):897-902.HUANG Zi-qian,HE Yue-hui,CAI Hai-tao,XIAO Yi-feng,HUANG Bai-yun.Thermal residual stress analysis of Ti Al N coating[J].The Chinese Journal of Nonferrous Metals,2007,17(6):897-902.
[5]PRENGEL H G,SANTHANAMB A T,PENICH R M,JINDAL P C,WENDT K H.Advanced PVD-Ti Al N coatings on carbide and cermet cutting tools[J].Surface&Coatings Technology,1997,94/95:597-602.
[6]VAZ F,REBOUTA L,ANDRITSCHKY M,SILVA M F D,SOARES J C.Thermal oxidation of Ti1-xAlxN coatings in air[J].Journal of the European Ceramic Society,1997,17(15/16):1971-1977.
[7]CHEN L,PAULITSCH J,DU Y,MAYRHOFER P H.Thermal stability and oxidation resistance of Ti-Al-N coatings[J].Surface&Coatings Technology,2012,206(11/12):2954-2960.
[8]ELYUTIN A V,BLINKOV I V,VOLKHONSKY A O,BELOV D S.Properties of nanocrystalline arc PVD Ti N-Cu coatings[J].Inorganic Materials,2013,49(11):1106-1112.
[9]FOX-RABINOVICH G S,YAMAMOTO K,AGUIRRE M H,GAHILLD D G,VELDHUISA S C,BIKSAA A,DOSBAEVAA G,SHUSTERE L S.Multi-functional nano-multilayered Al Ti N/Cu PVD coating for machining of Inconel 718superalloy[J].Surface&Coatings Technology,2010,204(15):2465-2471.
[10]陈利,吴恩熙,尹飞,王社权,汪秀全.(Ti,Al)N涂层的微观组织和性能[J].中国有色金属学报,2006,16(2):279-283.CHEN Li,WU En-xi,YIN Fei,WANG She-quan,WANG Xiu-quan.Microstructure and properties of(Ti,Al)N coating[J].The Chinese Journal of Nonferrous Metals,2006,16(2):279-283.
[11]IVANOV YU F,KOVA N N,KRYSINA O V,BAUMBACH T,DOYLE S,SLOBODSKY T,TIMCHENKO N A,GALIMOV R M,SHMAKOV A N.Superhard nanocrystalline Ti-Cu-N coatings deposited by vacuum arc evaporation of a sintered cathode[J].Surface&Coatings Technology,2012,207:430-434.
[12]HARRIS S G,DOYLE E D,WONG Y C,MUNROE P R,CAIRNEY J M,LONG J M.Reducing the macroparticle content of cathodic arc evaporated Ti N coatings[J].Surface&Coatings Technology,2004,183(2):283-294.
[13]SANDERS D M,ANDERS A.Review of cathodic arc deposition technology at the start of the new millennium[J].Surface&Coatings Technology,2000,133/134:78-90.
[14]WANG X Q,ZHAO Y H,YU B H,XIAO J Q,LI F Q.Deposition,structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating[J].Vacuum,2011,86:415-421.
[15]ZHANG L,MA G J,LIN G Q,HAN K C,MA H.Synthesis of Cu doped Ti N composite films deposited by pulsed bias arc ion plating[J].Nuclear Instruments&Methods in Physics Research,2014,320:17-21.
[16]BELOV D S,BLINKOV I V,VOLKHONSKII A O,KUZNETSOV D V,KIRYUKHANTSEV-KORNEEV F V,PUSTOV YU A,SERGEVNIN V S.Thermal stability and chemical resistance of(Ti,Al)N-Cu and(Ti,Al)N-Ni metal-ceramic nanostructured coatings[J].Applied Surface Science,2016,388:2-12.
[17]ZHU YAOCAN,FUJITA K,IWAMOTO N,NAGASAKA H,KATAOKA T.Influence of boron ion implantation on the wear resistance of Ti Al N coatings[J].Surface&Coatings Technology,2002,158/159:664-668.
[18]MYUNG H S,LEE H M,SHAGINYAN L R,HAN J G.Microstructure and mechanical properties of Cu doped Ti N superhard nanocomposite coatings[J].Surface&Coatings Technology,2003,163/164:591-596.
[2]WANG C F,SHIH-FU O U,CHIOU S Y.Microstructures of Ti N,Ti Al N and Ti Al VN coatings on AISI M2 steel deposited by magnetron reactive sputtering[J].Transactions of Nonferrous Metals Society of China,2014,24(8):2559-2565.
[3]曹华伟,张程煜,乔生儒,曹晓雨.物理气相沉积Ti Al N涂层的研究进展[J].材料导报,2011,25(6):25-29.CAO Hua-wei,ZHANG Cheng-yu,QIAO Sheng-ru,CAO Xiao-yu.Recent Progresses in physical vapor deposited Ti Al N coating[J].Materials Review,2011,25(6):25-29.
[4]黄自谦,贺跃辉,蔡海涛,肖逸锋,黄伯云.Ti Al N涂层的热残余应力分析[J].中国有色金属学报,2007,17(6):897-902.HUANG Zi-qian,HE Yue-hui,CAI Hai-tao,XIAO Yi-feng,HUANG Bai-yun.Thermal residual stress analysis of Ti Al N coating[J].The Chinese Journal of Nonferrous Metals,2007,17(6):897-902.
[5]PRENGEL H G,SANTHANAMB A T,PENICH R M,JINDAL P C,WENDT K H.Advanced PVD-Ti Al N coatings on carbide and cermet cutting tools[J].Surface&Coatings Technology,1997,94/95:597-602.
[6]VAZ F,REBOUTA L,ANDRITSCHKY M,SILVA M F D,SOARES J C.Thermal oxidation of Ti1-xAlxN coatings in air[J].Journal of the European Ceramic Society,1997,17(15/16):1971-1977.
[7]CHEN L,PAULITSCH J,DU Y,MAYRHOFER P H.Thermal stability and oxidation resistance of Ti-Al-N coatings[J].Surface&Coatings Technology,2012,206(11/12):2954-2960.
[8]ELYUTIN A V,BLINKOV I V,VOLKHONSKY A O,BELOV D S.Properties of nanocrystalline arc PVD Ti N-Cu coatings[J].Inorganic Materials,2013,49(11):1106-1112.
[9]FOX-RABINOVICH G S,YAMAMOTO K,AGUIRRE M H,GAHILLD D G,VELDHUISA S C,BIKSAA A,DOSBAEVAA G,SHUSTERE L S.Multi-functional nano-multilayered Al Ti N/Cu PVD coating for machining of Inconel 718superalloy[J].Surface&Coatings Technology,2010,204(15):2465-2471.
[10]陈利,吴恩熙,尹飞,王社权,汪秀全.(Ti,Al)N涂层的微观组织和性能[J].中国有色金属学报,2006,16(2):279-283.CHEN Li,WU En-xi,YIN Fei,WANG She-quan,WANG Xiu-quan.Microstructure and properties of(Ti,Al)N coating[J].The Chinese Journal of Nonferrous Metals,2006,16(2):279-283.
[11]IVANOV YU F,KOVA N N,KRYSINA O V,BAUMBACH T,DOYLE S,SLOBODSKY T,TIMCHENKO N A,GALIMOV R M,SHMAKOV A N.Superhard nanocrystalline Ti-Cu-N coatings deposited by vacuum arc evaporation of a sintered cathode[J].Surface&Coatings Technology,2012,207:430-434.
[12]HARRIS S G,DOYLE E D,WONG Y C,MUNROE P R,CAIRNEY J M,LONG J M.Reducing the macroparticle content of cathodic arc evaporated Ti N coatings[J].Surface&Coatings Technology,2004,183(2):283-294.
[13]SANDERS D M,ANDERS A.Review of cathodic arc deposition technology at the start of the new millennium[J].Surface&Coatings Technology,2000,133/134:78-90.
[14]WANG X Q,ZHAO Y H,YU B H,XIAO J Q,LI F Q.Deposition,structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating[J].Vacuum,2011,86:415-421.
[15]ZHANG L,MA G J,LIN G Q,HAN K C,MA H.Synthesis of Cu doped Ti N composite films deposited by pulsed bias arc ion plating[J].Nuclear Instruments&Methods in Physics Research,2014,320:17-21.
[16]BELOV D S,BLINKOV I V,VOLKHONSKII A O,KUZNETSOV D V,KIRYUKHANTSEV-KORNEEV F V,PUSTOV YU A,SERGEVNIN V S.Thermal stability and chemical resistance of(Ti,Al)N-Cu and(Ti,Al)N-Ni metal-ceramic nanostructured coatings[J].Applied Surface Science,2016,388:2-12.
[17]ZHU YAOCAN,FUJITA K,IWAMOTO N,NAGASAKA H,KATAOKA T.Influence of boron ion implantation on the wear resistance of Ti Al N coatings[J].Surface&Coatings Technology,2002,158/159:664-668.
[18]MYUNG H S,LEE H M,SHAGINYAN L R,HAN J G.Microstructure and mechanical properties of Cu doped Ti N superhard nanocomposite coatings[J].Surface&Coatings Technology,2003,163/164:591-596.