一体化半导体激光器的ANSYS热仿真及结构设计
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摘要
传统半导体激光器与驱动控制器多采用分离式设计,故半导体激光器系统的体积很难紧凑化,而一体化半导体激光器存在电路集成度高,发热严重等问题,因此,本文提出了对半导体激光器进行一体化、小型化设计的方法。为了保证所设计的半导体激光器运行时系统温度分布均匀,输出激光不受温度变化影响,在结构设计之前,利用ANSYS软件对元器件集成度较高的电路板等热源进行了热仿真,提高了集成后结构的可靠性。仿真结果显示,优化设计后的半导体激光器一体化结构满足激光器温度要求,系统温度分布均匀,能保证激光器稳定运行。设计的新型半导体激光器的整体结构尺寸仅为85mm×95mm×115mm,不仅实现了半导体激光器与驱动控制器的一体化与小型化集成,并且结构中留有准直光路设计空间,便于后期的应用研究。
Conventional semiconductor laser technology always chooses a separate design with its controller system,so that the semiconductor laser volume can not be compressed any more.Meanwhile,the integrated structure of the semiconductor laser has serious radiation heat.To overcome the problems mentioned above,this paper proposes a new design method of the semiconductor laser for its integration and miniaturization.To guarantee the laser to be operated stably and to show good thermal management,the ANSYS software is used to perform a thermal simulation for the high-density components such as Print Circuit Board(PCB)to improve the structure reliability before the structure manufacturing.Simulation experiments indicate that designed novel structure allows the semiconductor laser to integrate with the drive controller.,and has uniform temperature distribution and an appropriate space,and can guarantee the laser to operate stably.The whole sizes of the semiconductor is only 85mm×95mm×115mm.Moreover,the appropriate space is left in the structure of the semiconductor,which is conductive to the design of a collimated lightpath for its future applications.
Conventional semiconductor laser technology always chooses a separate design with its controller system,so that the semiconductor laser volume can not be compressed any more.Meanwhile,the integrated structure of the semiconductor laser has serious radiation heat.To overcome the problems mentioned above,this paper proposes a new design method of the semiconductor laser for its integration and miniaturization.To guarantee the laser to be operated stably and to show good thermal management,the ANSYS software is used to perform a thermal simulation for the high-density components such as Print Circuit Board(PCB)to improve the structure reliability before the structure manufacturing.Simulation experiments indicate that designed novel structure allows the semiconductor laser to integrate with the drive controller.,and has uniform temperature distribution and an appropriate space,and can guarantee the laser to operate stably.The whole sizes of the semiconductor is only 85mm×95mm×115mm.Moreover,the appropriate space is left in the structure of the semiconductor,which is conductive to the design of a collimated lightpath for its future applications.
引文
[1]KORNACK T W,GHOSH R K,ROMALIS M V.Nuclear spin gyroscope based on an atomic comagnetometer[J].Physical Review Letters,2005,95(23),230801.
[2]秦杰.基于129Xe-Cs的SERF原子自旋陀螺仪原理实验研究[D].北京:北京航空航天大学,2012.QIN J.Experimental study SERF atomic spin gyroscope principle based 129 Xe-Cs[D].Beijing:Beihang University,2012.(in Chinese)
[3]COOK E C,MARTIN P J,BROWN-HEFT T L,et al..High passive-stability diode-laser design for use in atomic-physics experiments[J].Review of Scientific Instruments,2012,83(4):043101.
[4]邢辉,赵慧洁,张颖,等.热控涂层性能在轨测试用辐射计原理样机的设计与仿真[J].仪器仪表学报,2011,32(2):241-246.XING H,ZHAO H J,ZHANG Y,et al..Design and simulation of a radiometer prototype for thermal control coating characteristic on-orbit test[J].Chinese Journal of Scientific Instrument,2011,32(2):241-246.(in Chinese)
[5]WEY T,PHAM D,FINFROCK D.Modeling of a closed-loop pump laser temperature control unit,including nonlinear electronics controller,and thermoelectric cooler and mechanical assembly[C].Industrial Electronics,2006 IEEE International Symposium on.IEEE,2006,4:2637-2641.
[6]ANTONOVA E E,LOOMAN D C.Finite elements for thermoelectric device analysis in ANSYS[C].Thermoelectrics,2005.ICT 2005.24th International Conference on.IEEE,2005:215-218.
[7]COLDRENL A,CORZINE S W,MASHANOVITCH M L.Diode Lasers and Photonic Integrated Circuits[M].John Wiley&Sons,212.
[8]PANKOVE J I.Temperature dependence of emission efficiency and lasing threshold in laser diodes[J].Quantum Electronics,IEEE Journal of,1968,4(4):119-122.
[9]李亮,宋健,李永,等.制动器热分析的快速有限元仿真模型研究[J].系统仿真学报,2005,17(12):2869-2877.LI L,SONG J,LI Y,et al..Study on fast finite element simulation model of thermal analysis of vehicle brake[J].Journal of System Simulation,2005,17(12):2869-2877.
[10]DZIURDZIA P,KOS A.Tool for fast modelling active heat sinks[C].Semiconductor Thermal Measurement and Management,2001.Seventeenth Annual IEEE Symposium.IEEE,2001:174-179.
[11]郭亮,吴清文,颜昌翔.空间光谱成像仪热设计及其分析与验证[J].光学精密工程,2011,19(6):1272-1280.GUO L,WU Q W,YAN CH X,et al..Thermal design of space spectral imaging apparatus and its analysis and verification[J].Opt.Precision Eng.,2011,19(6):1272-1280.(in Chinese)
[12]赵镇南.传热学[M].北京:高等教育出版社,2008.ZHAO ZH N.Heat Transfer[M].Beijing:Higher Education Press,2008.(in Chinese)
[13]王永康.ANSYS ICEPAK电子散热基础教程[M].北京:国防工业出版社,2015WANG Y K.ANSYS ICEPAK Electronic cooling basic tutorial[M].Beijing:National Defense Industry Press,2015.(in Chinese)
[14]华庆,殷景华,焦国芹,等.基于ANSYS的功率VDMOS器件的热分析及优化设计[J].电子器件,2009,32(2):354-356.HUA Q,YIN J H,JIAO G Q,et al..Thermal analysis and optimization of power VDMOS transistor based on analysis[J].Chinese Journal of Electro Device.2009,32(2):354-356.(in Chinese)
[15]阳红,殷国富,方辉,等.机床有限元热分析中对流换热系数的计算方法研究[J].四川大学学报(工程科学版),2011,43(4):241-248.YANG H,YIN G F,FANG H,et al..Research on calculation methods of convective heat transfer coefficients for machine tools thermal analysis[J].Journal of Sichuan university(Engineering science edition),2011,43(4):241-248.(in Chinese)
[16]陈立恒,吴清文,罗志涛,等.空间相机电子设备热控系统设计[J].光学精密工程,2009,17(9):2145.CHEN L H,WU Q W,LUO ZH T,et al..Design for thermal control system of electronic equipment in space camera[J].Opt.Precision Eng.,2009,17(9):2145.(in Chinese)
[17]张斌.集成电路芯片级热分析方法研究[D].北京:北京工业大学,2015.ZHANG B.The methods of chip-level thermal analysis of integrated circuits[D].Beijing:Beijing University of Technology,2015.(in Chinese)
[18]宋洪涛,宾鸿赞.热仿真技术在电子设备结构设计中的作用[J].Applied Science and Technology,2001,28(8):4-6.SONG H T,BING H Z.Application of thermal simulation in the structural design of electronic system[J].Applied Science and Technology,2001,28(8):4-6.(in Chinese)
[19]吴清彬,陈时锦,董申.参数优化方法在轻质反射镜结构设计中的应用[J].光学精密工程,2003,11(5):466-471.WU Q B,CHEN SH J,DONG SH.Optimization of parameters structural design of lightweight reflector[J].Opt.Precision Eng.,2003,11(5):466-471.(in Chinese)
[20]杨剑锋,徐振邦,吴清文,等.空间光学载荷六维隔振系统的设计[J].光学精密工程,2015,23(5):1347-1357.YANG J F,XU ZH B,WU Q W,et al..Design of six dimensional vibration isolation system for space optical payload[J].Opt.Precision Eng.,2015,23(5):1347-1357.(in Chinese)
[2]秦杰.基于129Xe-Cs的SERF原子自旋陀螺仪原理实验研究[D].北京:北京航空航天大学,2012.QIN J.Experimental study SERF atomic spin gyroscope principle based 129 Xe-Cs[D].Beijing:Beihang University,2012.(in Chinese)
[3]COOK E C,MARTIN P J,BROWN-HEFT T L,et al..High passive-stability diode-laser design for use in atomic-physics experiments[J].Review of Scientific Instruments,2012,83(4):043101.
[4]邢辉,赵慧洁,张颖,等.热控涂层性能在轨测试用辐射计原理样机的设计与仿真[J].仪器仪表学报,2011,32(2):241-246.XING H,ZHAO H J,ZHANG Y,et al..Design and simulation of a radiometer prototype for thermal control coating characteristic on-orbit test[J].Chinese Journal of Scientific Instrument,2011,32(2):241-246.(in Chinese)
[5]WEY T,PHAM D,FINFROCK D.Modeling of a closed-loop pump laser temperature control unit,including nonlinear electronics controller,and thermoelectric cooler and mechanical assembly[C].Industrial Electronics,2006 IEEE International Symposium on.IEEE,2006,4:2637-2641.
[6]ANTONOVA E E,LOOMAN D C.Finite elements for thermoelectric device analysis in ANSYS[C].Thermoelectrics,2005.ICT 2005.24th International Conference on.IEEE,2005:215-218.
[7]COLDRENL A,CORZINE S W,MASHANOVITCH M L.Diode Lasers and Photonic Integrated Circuits[M].John Wiley&Sons,212.
[8]PANKOVE J I.Temperature dependence of emission efficiency and lasing threshold in laser diodes[J].Quantum Electronics,IEEE Journal of,1968,4(4):119-122.
[9]李亮,宋健,李永,等.制动器热分析的快速有限元仿真模型研究[J].系统仿真学报,2005,17(12):2869-2877.LI L,SONG J,LI Y,et al..Study on fast finite element simulation model of thermal analysis of vehicle brake[J].Journal of System Simulation,2005,17(12):2869-2877.
[10]DZIURDZIA P,KOS A.Tool for fast modelling active heat sinks[C].Semiconductor Thermal Measurement and Management,2001.Seventeenth Annual IEEE Symposium.IEEE,2001:174-179.
[11]郭亮,吴清文,颜昌翔.空间光谱成像仪热设计及其分析与验证[J].光学精密工程,2011,19(6):1272-1280.GUO L,WU Q W,YAN CH X,et al..Thermal design of space spectral imaging apparatus and its analysis and verification[J].Opt.Precision Eng.,2011,19(6):1272-1280.(in Chinese)
[12]赵镇南.传热学[M].北京:高等教育出版社,2008.ZHAO ZH N.Heat Transfer[M].Beijing:Higher Education Press,2008.(in Chinese)
[13]王永康.ANSYS ICEPAK电子散热基础教程[M].北京:国防工业出版社,2015WANG Y K.ANSYS ICEPAK Electronic cooling basic tutorial[M].Beijing:National Defense Industry Press,2015.(in Chinese)
[14]华庆,殷景华,焦国芹,等.基于ANSYS的功率VDMOS器件的热分析及优化设计[J].电子器件,2009,32(2):354-356.HUA Q,YIN J H,JIAO G Q,et al..Thermal analysis and optimization of power VDMOS transistor based on analysis[J].Chinese Journal of Electro Device.2009,32(2):354-356.(in Chinese)
[15]阳红,殷国富,方辉,等.机床有限元热分析中对流换热系数的计算方法研究[J].四川大学学报(工程科学版),2011,43(4):241-248.YANG H,YIN G F,FANG H,et al..Research on calculation methods of convective heat transfer coefficients for machine tools thermal analysis[J].Journal of Sichuan university(Engineering science edition),2011,43(4):241-248.(in Chinese)
[16]陈立恒,吴清文,罗志涛,等.空间相机电子设备热控系统设计[J].光学精密工程,2009,17(9):2145.CHEN L H,WU Q W,LUO ZH T,et al..Design for thermal control system of electronic equipment in space camera[J].Opt.Precision Eng.,2009,17(9):2145.(in Chinese)
[17]张斌.集成电路芯片级热分析方法研究[D].北京:北京工业大学,2015.ZHANG B.The methods of chip-level thermal analysis of integrated circuits[D].Beijing:Beijing University of Technology,2015.(in Chinese)
[18]宋洪涛,宾鸿赞.热仿真技术在电子设备结构设计中的作用[J].Applied Science and Technology,2001,28(8):4-6.SONG H T,BING H Z.Application of thermal simulation in the structural design of electronic system[J].Applied Science and Technology,2001,28(8):4-6.(in Chinese)
[19]吴清彬,陈时锦,董申.参数优化方法在轻质反射镜结构设计中的应用[J].光学精密工程,2003,11(5):466-471.WU Q B,CHEN SH J,DONG SH.Optimization of parameters structural design of lightweight reflector[J].Opt.Precision Eng.,2003,11(5):466-471.(in Chinese)
[20]杨剑锋,徐振邦,吴清文,等.空间光学载荷六维隔振系统的设计[J].光学精密工程,2015,23(5):1347-1357.YANG J F,XU ZH B,WU Q W,et al..Design of six dimensional vibration isolation system for space optical payload[J].Opt.Precision Eng.,2015,23(5):1347-1357.(in Chinese)