Sn-Bi系电子互连材料研究进展
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摘要
简述了近十年来国内外对Sn-Bi系无铅钎料的研究,着重研究Cu、Zn、Al、Ag、Ga、In、Sb、稀土等元素对Sn-Bi系低温无铅钎料的熔化特性、润湿性能、显微组织、力学性能和界面组织的影响,同时对Sn-Bi系无铅钎料研究过程中存在的问题进行了探讨并提出相应的解决方法。
The investigation of Sn-Bi lead-free solders are reviewed at home and abroad last decade and the study is focused on the effects of Cu, Zn, Al, Ag, Ga, In, Sb and rare earths on the melting temperature, wettability, microstructure mechanical properties and IMC(interface metal compound). In addition, the problems which appear in the study of Sn-Bi solders are discussed and solutions are proposed.
The investigation of Sn-Bi lead-free solders are reviewed at home and abroad last decade and the study is focused on the effects of Cu, Zn, Al, Ag, Ga, In, Sb and rare earths on the melting temperature, wettability, microstructure mechanical properties and IMC(interface metal compound). In addition, the problems which appear in the study of Sn-Bi solders are discussed and solutions are proposed.
引文
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[2]LI J,YUAN Z F,QIAO Z Y,et al.Measurement and calculation of surface tension of molten Sn-Bi alloy[J].J Colloid Interface Sci,2006297(1):261-265.
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[5]BRUNETTI B,GOZZI D,IERVOLINO M.et al.Bismuth activity in lead-free solder Bi-In-Sn alloys[J].Comput Coupling Phase Diagram Thermochem,2006,30(4):431-442.
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[7]韩宗杰,李孝轩,胡永芳,等.电子组装用无铅钎料的研究和发展[J].电焊机,2010,40(12):1-7.
[8]乔芝郁,谢允安,曹战民,等.无铅锡基钎料合金设计和合金相图及其计算[J].中国有色金属学报,2004,14(11):1789-1798.
[9]JAYAGANTHAN R,MOHANKUMAR K,SEKHAR V N,et al.Fractal analysis of intermetallic compounds in Sn-Ag,Sn-Ag-Bi,and Sn-Ag-Cu diffusion couples[J].Mater Lett,2006,60(8):1089-1094.
[10]GUO Z N,YUAN W X,HINDLER M,et al.Thermodynamic properties of liquid Au-Bi Sn alloys[J].J Chem Thermodyn,2012,48(6):201-206.
[11]PENG Y T,DENG K.Study on the mechanical properties of the novel Sn Bi/graphene nanocomposite by finite element simulation[J].J Alloys Compd,2015,625:44-51.
[12]WANG S H,CHIN T S,YANG C F,et al.Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium[J].J Alloy Compd,2010497(s1-2):428-431.
[13]SUH M S,PARK C J,KWON H S,et al.Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath[J].Surf Coating Technol,2006,200(11):3527-3532.
[14]叶明娟,揭晓华,郭黎,等.无铅焊锡膏的研究进展及应用现状[J].热加工工艺,2014,43(23):9-11.
[15]闵文锦,宣天鹏.锡基无铅电子焊料的研究进展与发展趋势[J].金属功能材料,2009,16(2):55-59.
[16]胡小武,艾凡荣,闫洪,等.Sn基无铅钎料与Cu基板间化合物Cu6Sn5的研究进展[J].电子元件与材料,2012,31(6):79-83.
[17]李元山,陈振华,雷小娟,等.快速冷却和扩散退火对Sn-Bi-X焊料的影响[J].中国有色金属学报,2007,17(8):1319-1323.
[18]JIN S,MCCORMACK M.Dispersoid additions to a Pb-free solder for suppression of microstructural coarsening[J].J Electron Mater,199423(8):735-739.
[19]何洪文,徐广臣,郭福,等.电迁移促进Cu/Sn-58Bi/Cu焊点阳极界面Bi层形成的机理分析[J].焊接学报,2010,31(10):35-38.
[20]孙凤莲,胡文刚,王丽凤,等.Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响[J].焊接学报,2008,29(10):5-8.
[21]刘平,龙郑易,顾小龙,等.低温无铅焊料[J].电子工艺技术,2014,35(4):198-200.
[22]MA D L,WU P.Effects of Zn addition on mechanical properties of eutectic Sn-58Bi solder during liquid-state aging[J].Trans Nonferrous Met Soc Chin,2015,25(4):1225-1233.
[23]ABTEW M,SELVADURAY G.Lead-free solders in microelectronics[J].Mater Sci Eng,2000,27(5/6):95-141.
[24]PENG Y T,DENG K.Fabrication of reduced graphene oxide nanosheets reinforced Sn-Bi nanocomposites by electro-chemical deposition[J].Compos Part A:Appl Sci Manuf,2015,73:55-62.
[25]SHEN J,PU Y Y,YIN H G,et al.Effects of minor Cu and Zn additions on the thermal,microstructure and tensile properties of Sn-Bi-based solder alloys[J].J Alloy Compd,2014,614(10):63-70.
[26]SHALABY R M.Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys[J].Mater Sci Eng A,2013,560(1):86-95.
[27]何鹏,吕晓春,张斌斌,等.合金元素对Sn-57Bi无铅钎料组织及韧性的影响[J].材料工程,2010(10):13-17.
[28]董文兴,郝虎,史耀武,等.稀土改性的Sn-58Bi低温无铅钎料[J].电子元件与材料,2007,26(6):21-23.
[29]汤清华,潘晓光,Wu C M L,等.添加Sn-Ag对Sn-Bi焊接特性的改善[J].电子元件与材料,1999,18(4):27-29.
[30]LIN S K,NGUYEN T L,WU S C,et al.Effective suppression of interfacial intermetallic compound growth between Sn-58%Bi solders and Cu substrates by minor Ga addition[J].J Alloy Comp,2014,586(4):319-327.
[31]CHEN X,XUE F,ZHOU J,et al.Effect of In on microstructure,thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder[J].J Alloy Compd,2015,633:377-383.
[32]赵四勇,蔡志红,张宇鹏,等.Sb掺杂对锡铋近共晶钎料组织和力学性能的影响[J].焊接设备与材料,2010,39(3):47-50.
[33]董昌慧,王凤江,丁海健,等.微量Co的添加对Sn-Bi共晶钎料性能的影响[J].热加工工艺,2015,44(1):190-192.
[34]何鹏,安晶,马鑫,等.含碳纳米管的Sn-58Bi钎料的制备及其钎焊性[J].焊接学报,2011,32(9):9-12.
[35]SHIUE Y Y,CHUANG T H.Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads[J].J Alloy Compd,2010,491(s1/2):610-617.
[36]DONG W X,SHI Y W,XIA Z D,et al.Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder Alloy[J].J Electron Mater,2008,37(7):982-991.
[37]孙磊,张亮.Sn-Zn系无铅钎料最新进展[J].电子工艺技术,2015,36(1):4-11.
[38]张亮,TU K N,孙磊,等.纳米-微米颗粒增强复合钎料研究最新进展[J].中南大学学报,2015,46(1):49-65.
[39]ZANG L K,YUAN Z F,ZHAO H X,et al.Wettability of molten Sn-Bi-Cu solder on Cu substrate[J].Mater Lett,2009,63(23):2067-2069.
[40]CHEN X,XUE F,ZHOU J,et al.Microstructure,thermal and wetting properties of Sn-Bi-Zn lead-free solder[J].J Electron Mater,2013,42(8):2708-2715.
[41]李群,黄继华,张华,等.Al对Sn-58Bi无铅钎料组织及性能的影响[J].电子工艺技术,2008,29(1):1-4.
[42]ZHANG L,SUN L,GUO Y H,et al.Microstructures and properties of Sn58Bi,Sn35Bi0.3Ag,Sn35Bi1.0Ag solder and solder joints[J].J Mater Sci Mater Electron,2015,26(10):7629-7634.
[43]许磊,张宇鹏,张宇航,等.时效处理对Sb改性的Sn-58Bi低温无铅钎料的影响[J].材料研究与应用,2010,4(4):542-545.
[44]YANG L,DU C C,DAI J,et al.Effect of nanosized graphite on properties of Sn-Bi solder[J].J Mater Sci Mater Electron,2013,24(11):4180-4185.
[45]董文兴,史耀武,雷永平,等.添加微量稀土对Sn Bi基无铅钎料显微组织和性能的影响[J].焊接学报,2008(7):43-46.
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