Sn-3.0Ag-0.5Cu-3.0Bi钎料对SiC_P/6063Al复合材料真空钎焊接头组织的影响
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摘要
采用自制Sn-3.0Ag-0.5Cu-3.0Bi合金对Si CP/6063Al复合材料进行真空钎焊。通过SEM、EDX实验方法分析钎料与化学镀镍后Si CP/6063Al复合材料真空钎焊接头的显微组织。结果表明:无铅钎料Sn-3.0Ag-0.5Cu-3.0Bi合金显微组织主要由富Sn相、共晶组织和单质Bi构成;其显微组织形成机制可以用化学亲和力来表征,元素间的化学亲和力参数越大,越容易形成化合物;Si Cp/6063Al复合材料真空钎焊后的焊缝组织致密,钎料对镀镍复合材料的润湿性良好;界面生成的IMC为(CuxNi1-x)6Sn5,其晶体结构与Cu6Sn5相似,只是部分Cu原子被Ni取代。
Si Cp/6063 Al composites were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum. The microstructure of the solder and the vacuum soldered joint of the Si Cp/6063 Al composite after electroless nickel plating were studied by means of SEM and EDX. The results show that Sn-3.0Ag-0.5Cu-3.0Bi alloy mainly consists of Sn-riched phase,eutectic structure and elemental Bi. The chemical affinity can be used to characterize the microstructure formation mechanism of Sn- 3.0Ag-0.5Cu-3.0Bi alloy. The higher the chemical affinity parameters between elements,the easier the compounds form. The microstructure of soldered seam is quite compact since the lead-free solder has a good wettability with nickel plated composite. The IMC at the interface is(CuxNi1- x)6Sn5,and its crystal structure is similar to Cu6Sn5,except that part of Cu is substituted by Ni.
Si Cp/6063 Al composites were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum. The microstructure of the solder and the vacuum soldered joint of the Si Cp/6063 Al composite after electroless nickel plating were studied by means of SEM and EDX. The results show that Sn-3.0Ag-0.5Cu-3.0Bi alloy mainly consists of Sn-riched phase,eutectic structure and elemental Bi. The chemical affinity can be used to characterize the microstructure formation mechanism of Sn- 3.0Ag-0.5Cu-3.0Bi alloy. The higher the chemical affinity parameters between elements,the easier the compounds form. The microstructure of soldered seam is quite compact since the lead-free solder has a good wettability with nickel plated composite. The IMC at the interface is(CuxNi1- x)6Sn5,and its crystal structure is similar to Cu6Sn5,except that part of Cu is substituted by Ni.
引文
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[16]李卓然,矫宁,马吉才,等.合金元素对Ag Cu Zn系钎料合金组织与性能的影响[J].焊接学报,2008,29(3):65-68.
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[18]陈念贻.键参数函数及其应用[M].北京:科学出版社,1976:15-20.
[19]王丽凤,孙凤莲,刘晓晶,等.Sn-Ag-Cu-Bi钎料合金设计与组织性能分析[J].焊接学报,2008,29(7):9-13.
[20]ZENG K,VUORINEN V,KIVILAHTI J.Interfacial reactions between lead-free Sn Ag Cu solder and Ni(P)surface finish on printed circuit boards[J].Electronics Packaging Manufacturing,2002,25(3):162-167.
[2]赵正平.21世纪初微电子技术发展展望[J].半导体情报,1999,36(1):1-9.
[3]LLOYD D J.Particle reinforced aluminum and magnesium matrix composites[J].International Materials Reviews,1994,39(1):1-23.
[4]GAIN A K,CHAN Y C.Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt%nanoZr O2composite solders[J].Microelectronics Reliability,2014,54:945-955.
[5]EMEK A H,EKERE N D.High temperature reliability of leadfree solder joints in aflip chip assembly[J].Journal of Materials Processing Technology,2012,212:471-483.
[6]ELDALY A A,ELTAHER A M,DALLOUL T R.Enhanced ductility and mechanical strength of Ni-doped Sn-3.0Ag-0.5Cu lead-free solders[J].International Journal of Mechanics and Materials in Design,2014,55:309-318.
[7]ELDALY A A,FAWZY A,MANSOUR S F,et al.Novel Si C nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance[J].Materials Science and Engineering A,2013,578:62-71.
[8]ELDALY A A,ALGANAINY G S,FAWZY A,et al.Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy[J].International Journal of Mechanics and Materials in Design,2014,55:837-845.
[9]周俊生,池水莲,修建国.合金元素添加对锡基无铅钎料性能的影响[J].热加工工艺,2012,41(11):163-169.
[10]ELDALY A A,ELTAHER A M,GOUDA S.Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products[J].Materials and Design,2015,65:796-805.
[11]ERIKA H,MARIAN P,EMIL L,et al.Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X(X=Bi,In)solders with Cu substrate[J].Journal of Alloys and Compounds,2011,509:7052-7059.
[12]张洋.超声波作用下Si C与Zn-Al连接界面行为及焊缝强化机理[D].哈尔滨:哈尔滨工业大学,2009.
[13]范晓杰,徐冬霞,牛济泰,等.Sn Ag Cu Bi无铅钎料对不同体积比Si CP/6063Al复合材料真空软钎焊接头组织和性能的影响[J].材料导报,2015,29(8):89-93.
[14]LI L B,AN M Z,WU G H.A new electroless nickel deposition technique to metallise Si Cp/Al composites[J].Surface&Coatings Technology,2006,200:5102-5112.
[15]尹明勇,马立群,王娟,等.Si Cp/Al复合材料表面化学镀镍磷合金层的工艺改进[J].机械工程材料,2012,36(9):47-49.
[16]李卓然,矫宁,马吉才,等.合金元素对Ag Cu Zn系钎料合金组织与性能的影响[J].焊接学报,2008,29(3):65-68.
[17]易蕰琛,周钢.合金元素对低锡钎料润湿性和抗腐蚀性能的影响[J].焊接学报,1990,11(1):50-56.
[18]陈念贻.键参数函数及其应用[M].北京:科学出版社,1976:15-20.
[19]王丽凤,孙凤莲,刘晓晶,等.Sn-Ag-Cu-Bi钎料合金设计与组织性能分析[J].焊接学报,2008,29(7):9-13.
[20]ZENG K,VUORINEN V,KIVILAHTI J.Interfacial reactions between lead-free Sn Ag Cu solder and Ni(P)surface finish on printed circuit boards[J].Electronics Packaging Manufacturing,2002,25(3):162-167.