钎焊时间对镀镍SiC_P/Al复合材料界面IMC生长的影响
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摘要
采用Sn-3.0Ag-0.5Cu-3.0Bi钎料对镀镍60%和镀镍15%Si CP/6063Al复合材料之间进行真空钎焊.采用SEM,XRD对接头界面微观组织和成分进行分析.结果表明,在钎焊过程中,钎料与镍层发生界面反应生成了连续的扇贝状金属间化合物(IMC),其具体成分为(Cu,Ni)6Sn5;该IMC层排列紧凑,生长方向都垂直于界面指向钎料的内部;在钎焊过程中,IMC的生长分为生长速率较快和生长速率较缓慢两个阶段.在270℃,钎焊时间由10 min延长至40 min时,界面IMC层扇贝状形貌不变,晶粒尺寸变大;IMC层厚度增加,但是其厚度增长速率逐渐降低;钎焊接头抗剪强度不断增大.
SiC_p/6063Al composites containing high and low volume fraction Si C after electroless nickel plating were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum.The microstructure and components of the interface were studied by means of SEM and XRD.The results show that in the soldering process,the solder reacts with the nickel layer and continuous scalloped intermetallic compound forms at the interface and the IMC is(Cu,Ni)_6Sn_5.The IMC layer is arranged compact and its growth direction perpendicular to the interface point to solder.In the soldering process,the growth of IMC can be divided into a faster growth rate stage and a slower growth rate stage.At the soldering temperature of 270℃,when soldering time is extended from 10 min to 40 min,scallop-shaped morphology of IMC keeps unchanged,the grain of IMC becomes larger.Thickness of IMC layer increases,but its growth rate is gradually reduced with increasing soldering time.The shear strength of the soldered joint improves continuously.
SiC_p/6063Al composites containing high and low volume fraction Si C after electroless nickel plating were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum.The microstructure and components of the interface were studied by means of SEM and XRD.The results show that in the soldering process,the solder reacts with the nickel layer and continuous scalloped intermetallic compound forms at the interface and the IMC is(Cu,Ni)_6Sn_5.The IMC layer is arranged compact and its growth direction perpendicular to the interface point to solder.In the soldering process,the growth of IMC can be divided into a faster growth rate stage and a slower growth rate stage.At the soldering temperature of 270℃,when soldering time is extended from 10 min to 40 min,scallop-shaped morphology of IMC keeps unchanged,the grain of IMC becomes larger.Thickness of IMC layer increases,but its growth rate is gradually reduced with increasing soldering time.The shear strength of the soldered joint improves continuously.
引文
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[5]Choi W K,Mo Lee H.Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and(Cu,electroless Ni/P)substrate[J].Journal of Electronic Materials,2000,29(10):1207-1213.
[6]Choi W K,Jang S Y,Kim J H,et al.Grain morphology of intermetallic compounds at solder joints[J].Journal of Material Research,2002,17(3):597-599.
[7]Kang S K.Ag3Sn plate formation in the solidification of nearternary eutectic Sn-Ag-Cu alloys[J].The Journal of The Minerals,Metals&Materials Society,2003,55(6):61-65.
[8]Yu D Q,Wang L.The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction[J].Journal of Alloys and Compounds,2008,458(1-2):542-547.
[9]Kim H K,Tu K N.Kinetic analysis of the soldering reaction between eutectic Sn-Pb alloy and Cu accompanied by ripening[J].Physical Review B,1996,53:16027-16034.
[10]Ronka K J,Vanloo F J,Kivilaht J J.The local nomial composition-useful concept for microjoining and interconnection applications[J].Scripta Materialia,1997,37(10):1575-1581.
[11]商延赓,孙大千,朗波,等.金属间化合物对Sn-Ag-Cu无铅钎料钎焊接头性能的影响[J].吉林大学学报,2006,36(6):846-850.Shang Yangeng,Sun Daqian,Lang Bo,et al.Effects of intermetallic compounds on the properties of Sn-Ag-Cu lead-free solder joints[J].Journal of Jilin University,2006,36(6):846-850.