SnAgCuBi无铅钎料对不同体积比SiC_P/6063Al复合材料真空软钎焊接头组织和性能的影响
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  • 英文篇名:Effect of SnAgCuBi Lead-free Solder on Microstructure and Performance of Soldered Joints of High and Low Ratio SiC_P/6063Al Composite in Vacuum Soldering
  • 作者:范晓杰 ; 徐冬霞 ; 牛济泰 ; 王东斌 ; 陈思杰
  • 英文作者:FAN Xiaojie;XU Dongxia;NIU Jitai;WANG Dongbin;CHEN Sijie;Department of Materials Science and Engineering,Henan Polytechnic University;State Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology;Henan Jingtai Aerospace High-Novel Materials Technology Co.,Ltd.;
  • 关键词:SiCP/6063Al复合材料 ; 无铅钎料 ; 真空软钎焊 ; 抗剪强度
  • 英文关键词:SiCP/6063Al composite,lead-free solder,vacuum soldering,shear strength
  • 中文刊名:CLDB
  • 英文刊名:Materials Review
  • 机构:河南理工大学材料科学与工程学院;哈尔滨工业大学先进焊接与连接国家重点实验室;河南晶泰航空航天高新科技有限公司;
  • 出版日期:2015-08-25
  • 出版单位:材料导报
  • 年:2015
  • 期:v.29
  • 基金:河南省教育厅科学技术研究重点项目(13A430326);; 河南省科技攻关项目(142102210434);; 河南省高等学校矿业工程材料重点学科开放实验室开放课题(MEM14-18);; 河南理工大学青年基金(Q2012-25A);; 河南理工大学博士基金(B2009-74)
  • 语种:中文;
  • 页:CLDB201516021
  • 页数:5
  • CN:16
  • ISSN:50-1078/TB
  • 分类号:93-97
摘要
在不同保温时间下,分别采用Sn-3.0Ag-0.5Cu和Sn-3.0Ag-0.5Cu-3.0Bi无铅软钎料,对表面镀镍的两种不同体积分数的SiCP/6063Al复合材料进行真空软钎焊。通过剪切强度测试、显微组织分析、能谱分析等手段研究了钎焊接头的组织和性能。结果表明:Bi元素的加入改善了Sn-3.0Ag-0.5Cu钎料的铺展润湿性,降低了熔点,提高了焊缝的抗剪强度;在270℃保温35min时,Sn-3.0Ag-0.5Cu-3.0Bi钎料钎焊接头抗剪强度达到最高值38.23MPa;钎焊过程中只是两侧镀镍层间的焊接,钎料并未透过镍层与母材发生扩散反应。
        SiCP/Al composites containing high and low volume fraction SiC after electroless nickel plating on the surface were soldered by using Sn-3.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu-3.0Bi solders in vacuum under different holding time.The microstructure and mechanical performance of soldered joints were studied by shearing strength test,SEM and EDS analysis.The results show that the Sn-3.0Ag-0.5Cu-3.0Bi solder has better spreading wettability,lower melting temperature and the shear strength of the seam is increased with the addition of Bi element.The shear strength of the soldered joint by using Sn-3.0Ag-0.5Cu-3.0Bi alloy reaches to the maximum of 38.23 MPa under soldering temperature of 270 ℃ and holding time for 35 min.Soldering process only occurs between the nickelplating layer on both sides and the diffusion reaction does not occur through the solder to the base metal.
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