摘要
在不同保温时间下,分别采用Sn-3.0Ag-0.5Cu和Sn-3.0Ag-0.5Cu-3.0Bi无铅软钎料,对表面镀镍的两种不同体积分数的SiCP/6063Al复合材料进行真空软钎焊。通过剪切强度测试、显微组织分析、能谱分析等手段研究了钎焊接头的组织和性能。结果表明:Bi元素的加入改善了Sn-3.0Ag-0.5Cu钎料的铺展润湿性,降低了熔点,提高了焊缝的抗剪强度;在270℃保温35min时,Sn-3.0Ag-0.5Cu-3.0Bi钎料钎焊接头抗剪强度达到最高值38.23MPa;钎焊过程中只是两侧镀镍层间的焊接,钎料并未透过镍层与母材发生扩散反应。
SiCP/Al composites containing high and low volume fraction SiC after electroless nickel plating on the surface were soldered by using Sn-3.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu-3.0Bi solders in vacuum under different holding time.The microstructure and mechanical performance of soldered joints were studied by shearing strength test,SEM and EDS analysis.The results show that the Sn-3.0Ag-0.5Cu-3.0Bi solder has better spreading wettability,lower melting temperature and the shear strength of the seam is increased with the addition of Bi element.The shear strength of the soldered joint by using Sn-3.0Ag-0.5Cu-3.0Bi alloy reaches to the maximum of 38.23 MPa under soldering temperature of 270 ℃ and holding time for 35 min.Soldering process only occurs between the nickelplating layer on both sides and the diffusion reaction does not occur through the solder to the base metal.
引文
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