无压烧结BiCuSeO/Cu的热电性能
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  • 英文篇名:Thermoelectric Properties of BiCuSeO/Cu by Pressureless Method
  • 作者:朱志秀 ; 任丽萍 ; 王彪 ; 李洪涛
  • 英文作者:ZHU Zhixiu;REN Liping;WANG Biao;LI Hongtao;Technical Center for Industrial Product and Raw Material Inspection and Testing of SHCIQ;
  • 关键词:热电材料 ; 无压烧结 ; BiCuSeO ; 功率因子
  • 英文关键词:thermoelectric materials;;pressureless sintering;;BiCuSeO;;power factor
  • 中文刊名:TCXB
  • 英文刊名:Journal of Ceramics
  • 机构:上海出入境检验检疫局工业品与原材料检测技术中心;
  • 出版日期:2017-11-24 11:41
  • 出版单位:陶瓷学报
  • 年:2017
  • 期:v.38
  • 基金:国家质量监督检验检疫总局科技计划项目(2012IK049)
  • 语种:中文;
  • 页:TCXB201705032
  • 页数:5
  • CN:05
  • ISSN:36-1205/TS
  • 分类号:156-160
摘要
BiCuSeO是目前热电性能最高的氧化物热电陶瓷,对其研究目前主要研究集中在掺杂改性方面,通过掺杂提高它的载流子浓度进而优化其热电性能。本文利用无压烧结方法制备了Cu复合的BiCuSeO热电陶瓷,测试并分析了300-650K温度条件下不同Cu含量对BiCuSeO热电性能的影响。结果表明,通过复合Cu能够增大BiCuSeO的电导率,而少量Cu的加入基本对BiCuSeO的Seebeck系数和热导率没有影响。复合1%Cu的BiCuSeO的功率因子在室温条件下达到0.54μW.cm-1K-2,比BiCuSeO高35%。而且,在300-650K温度范围内复合1%Cu样品的品质因子均高于BiCuSeO的数值。这些结果表明通过高电导的金属复合能够有效提高BiCuSeO的热电性能。
        Recently, BiCuSeO based oxide ceramics have attracted considerable attention due to its high thermoelectric performance. Most of the works are focus on doping to tune the carrier concentration of BiCuSeO. In this study, polycrystalline BiCuSeO composite with Cu were prepared by solid state reaction followed by pressureless sintering method. The thermoelectric properties including Seebeck coefficient, electrical conductivity and thermal conductivity were studied from 300 to 650 K. The electrical conductivity of BiCuSeO increased significiently with an increase of content of Cu. However, the Seebeck coefficient and thermal conductivity of BiCuSeO were not infulented largely by compositing with some mount of Cu. Both the power factor and figure of meirt of BiCuSeO were improved by compositing with 1 wt% Cu. These results indicate that compositing with metal is beneficial to improve the thermoelectric performance of BiCuSeO.
引文
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