粉末冶金工艺对Sn2.5Ag0.7Cu0.1RE无铅钎料组织性能的影响
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摘要
在低熔点Sn2.5Ag0.7Cu0.1RE钎料合金粉末冶金制备工艺设计基础上,研究了预压和烧结对钎料合金组织与力学性能的影响。研究结果表明:低熔点Sn2.5Ag0.7Cu0.1RE钎料合金粉末冶金工艺预压应力和烧结温度分别为160 MPa和210℃,均高于高熔点铜、铝合金的预压应力和烧结温度。与熔炼法相比,Sn2.5Ag0.7Cu0.1RE钎料合金抗拉强度提高了15.5%。烧结会影响Sn2.5Ag0.7Cu0.1RE钎料合金初生β-Sn相和共晶组织形态,随烧结温度升高,初生β-Sn相组织比例升高。
Based on the powder metallurgy( PM) process design of low-melting Sn2. 5 Ag0. 7 Cu0. 1 RE alloy,the effects of compacting and sintering on the microstructure and mechanical properties of the solder alloy were studied. The results shows that the compacting stress and sintering temperature of low-melting Sn2. 5 Ag 0. 7 Cu0. 1 RE solder alloy are higher than that of copper and aluminum high-melting alloys. The preparation of Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy is achieved at the compacting stress 160 MPa and sintering temperature210 ℃ by PM. In addition,the tensile strength of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy increases by 15. 5%compared with the melting technology. The sintering has effects on themorphologies of the primary β-Sn phase and the eutectic structure of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy. The proportion of primary β-Sn phase increases with the increase of sintering temperature.
Based on the powder metallurgy( PM) process design of low-melting Sn2. 5 Ag0. 7 Cu0. 1 RE alloy,the effects of compacting and sintering on the microstructure and mechanical properties of the solder alloy were studied. The results shows that the compacting stress and sintering temperature of low-melting Sn2. 5 Ag 0. 7 Cu0. 1 RE solder alloy are higher than that of copper and aluminum high-melting alloys. The preparation of Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy is achieved at the compacting stress 160 MPa and sintering temperature210 ℃ by PM. In addition,the tensile strength of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy increases by 15. 5%compared with the melting technology. The sintering has effects on themorphologies of the primary β-Sn phase and the eutectic structure of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy. The proportion of primary β-Sn phase increases with the increase of sintering temperature.
引文
[1]周迎春,潘清林,李文斌,等.La对Sn-Ag-Cu无铅钎料与铜钎焊接头金属间化合物的影响[J].中国有色金属学报,2008,18(9):1651-1657.
[2]郭兴东,张柯柯,邱然锋,等.苛刻热循环对Sn2.5Ag0.7Cu0.1REx Ni/Cu钎焊界面及接头性能的影响[J].中国有色金属学报,2016,26(12):2573-2579.
[3]HUANG Y S,HSIAO H Y,CHEN C,et al.The effect of a concentration gradient on interfacial reactions in microbumps of Ni/Sn Ag/Cu during liquid-state soldering[J].Scripta materialia,2012,66(10):741-744.
[4]CHENG S F,HUANG C M,PECHT M.A review of lead-free solders for electronics applications[J].Microelectronics reliability,2017,75:77-95.
[5]张超,张柯柯,马宁,等.Sn2.5Ag0.7Cu0.1Re/Cu钎焊接头在热循环下的电迁移行为[J].河南科技大学学报(自然科学版),2017,38(6):1-6.
[6]孙萌萌,张柯柯,张超,等.Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移组织与性能[J].河南科技大学学报(自然科学版),2018,39(3):13-16,23.
[7]张柯柯,涂益民.特种先进连接方法[M].哈尔滨:哈尔滨工业大学出版社,2012.
[8]汪源.纳米Ag3Sn、Cu6Sn5颗粒对Sn基无铅焊料性能影响研究[D].北京:北京理工大学,2015.
[9]张亮,TU K N,孙磊,等.纳米-微米颗粒增强复合钎料研究最新进展[J].中南大学学报(自然科学版),2015,46(1):49-65.
[10]NOOR E E M,SINGH A,CHUAN Y T.A review:influence of nano particles reinforced on solder alloy[J].Soldering&surface mount technology,2013,25(4):229-241.
[11]CHANG S Y,JAIN C C,CHUANG T H,et al.Effect of addition of Ti O2nanoparticles on the microstructure,microhardness and interfacial reactions of Sn3.5Ag XCu solder[J].Materials&design,2011,32(10):4720-4727.
[12]KOTADIA H R,HOWES P D,MANNAN S H.A review:on the development of low melting temperature Pb-free solders[J].Microelectronics reliability,2014,54(6/7):1253-1273.
[13]LUO H B,SUI Y W,QI J Q,et al.Mechanical enhancement of copper matrix composites with homogeneously dispersed graphene modified by silver nanoparticles[J].Journal of alloys&compounds,2017,729:293-302.
[14]YAN S J,DAI S L,ZHANG X Y,et al.Investigating aluminum alloy reinforced by graphenenanoflakes[J].Materials science&engineering a,2014,612(33):440-444.
[15]XU L Y,CHEN X,JING H Y,et al.Design and performance of Ag nanoparticle-modified graphene/Sn Ag Cu lead-free solders[J].Materials science&engineering a,2016,667:87-96.
[16]黄培云.粉末冶金原理[M].2版.北京:冶金工业出版社,1997.
[17]JI H J,WANG Q,LI M Y.Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering[J].Journal of electronic materials,2016,45(1):88-97.
[2]郭兴东,张柯柯,邱然锋,等.苛刻热循环对Sn2.5Ag0.7Cu0.1REx Ni/Cu钎焊界面及接头性能的影响[J].中国有色金属学报,2016,26(12):2573-2579.
[3]HUANG Y S,HSIAO H Y,CHEN C,et al.The effect of a concentration gradient on interfacial reactions in microbumps of Ni/Sn Ag/Cu during liquid-state soldering[J].Scripta materialia,2012,66(10):741-744.
[4]CHENG S F,HUANG C M,PECHT M.A review of lead-free solders for electronics applications[J].Microelectronics reliability,2017,75:77-95.
[5]张超,张柯柯,马宁,等.Sn2.5Ag0.7Cu0.1Re/Cu钎焊接头在热循环下的电迁移行为[J].河南科技大学学报(自然科学版),2017,38(6):1-6.
[6]孙萌萌,张柯柯,张超,等.Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移组织与性能[J].河南科技大学学报(自然科学版),2018,39(3):13-16,23.
[7]张柯柯,涂益民.特种先进连接方法[M].哈尔滨:哈尔滨工业大学出版社,2012.
[8]汪源.纳米Ag3Sn、Cu6Sn5颗粒对Sn基无铅焊料性能影响研究[D].北京:北京理工大学,2015.
[9]张亮,TU K N,孙磊,等.纳米-微米颗粒增强复合钎料研究最新进展[J].中南大学学报(自然科学版),2015,46(1):49-65.
[10]NOOR E E M,SINGH A,CHUAN Y T.A review:influence of nano particles reinforced on solder alloy[J].Soldering&surface mount technology,2013,25(4):229-241.
[11]CHANG S Y,JAIN C C,CHUANG T H,et al.Effect of addition of Ti O2nanoparticles on the microstructure,microhardness and interfacial reactions of Sn3.5Ag XCu solder[J].Materials&design,2011,32(10):4720-4727.
[12]KOTADIA H R,HOWES P D,MANNAN S H.A review:on the development of low melting temperature Pb-free solders[J].Microelectronics reliability,2014,54(6/7):1253-1273.
[13]LUO H B,SUI Y W,QI J Q,et al.Mechanical enhancement of copper matrix composites with homogeneously dispersed graphene modified by silver nanoparticles[J].Journal of alloys&compounds,2017,729:293-302.
[14]YAN S J,DAI S L,ZHANG X Y,et al.Investigating aluminum alloy reinforced by graphenenanoflakes[J].Materials science&engineering a,2014,612(33):440-444.
[15]XU L Y,CHEN X,JING H Y,et al.Design and performance of Ag nanoparticle-modified graphene/Sn Ag Cu lead-free solders[J].Materials science&engineering a,2016,667:87-96.
[16]黄培云.粉末冶金原理[M].2版.北京:冶金工业出版社,1997.
[17]JI H J,WANG Q,LI M Y.Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering[J].Journal of electronic materials,2016,45(1):88-97.