外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能
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摘要
采用SEM、EDS、XRD等方法研究了超声、电场外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头的组织与性能。结果表明,借助于超声、超声-电场外能辅助能细化Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头钎缝组织并使共晶组织比例增加,界面区金属间化合物(IMC)平均厚度、粗糙度和界面IMC颗粒尺寸减小。超声和电场外能辅助下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头强度与其界面IMC层粗糙度密切相关,超声的作用更为显著,在超声-电场外能辅助钎焊接头界面IMC层粗糙度降低中占主导作用,施加超声-电场外能辅助下钎焊接头剪切强度与传统钎焊相比提高24.1%;施加超声、超声-电场外能辅助使Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头断裂途径由钎缝和界面IMC层组成的界面过渡区向钎缝侧迁移,呈界面(Cu,Ni)_6Sn_5 IMC解理和钎缝解理+韧窝的脆-韧混合型断裂机制,使接头剪切断口塑性区比例增加,从而提高接头剪切强度。
The Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints were fabricated by the ultrasonic wave(USW) and electric field(E) assisted soldering technique.The microstructure and mechanical properties of the solder joints were analyzed by the scanning electron microscope(SEM),energy dispersive spectrometer(EDS) and X-ray diffraction(XRD).Results show that the USW or the USW-E have great influence on the microstructure of the solder joints.The USW or USW-E assisted soldering technique refines microstructure of the Sn2.5Ag0.7 Cu0.1RE0.05Ni/Cu solder joints and promotes the proportion of eutectic structure,as well as reduces the average thickness,roughness and grain size of interfacial IMC.The shear strength of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints under the USW-E assisted soldering is closely related to the roughness of interfacial IMC layer.The USW plays an important role in the decrease of roughness of the interfacial IMC during the USW-E assisted soldering.Compared with shear strength of the traditional soldering joints,an increment of 24.1% in shear strength of the soldering joints is achieved with the USW-E assisted soldering.With applying the USW or the USW-E,the fracture path of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints transfers from the interfacial transitional region composed of soldering seam and interfacial IMC layer to the side of soldering seam.The fracture mechanism of the soldering joints obtained by the USW or the USW-E assisted soldering are brittle-ductile mixed fracture with the cleavage of interfacial(Cu,Ni)_6Sn_5 IMC and the cleavage-dimple of soldering seam,which increases the proportion of ductile fracture zone and the shear strength of soldering joints.
The Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints were fabricated by the ultrasonic wave(USW) and electric field(E) assisted soldering technique.The microstructure and mechanical properties of the solder joints were analyzed by the scanning electron microscope(SEM),energy dispersive spectrometer(EDS) and X-ray diffraction(XRD).Results show that the USW or the USW-E have great influence on the microstructure of the solder joints.The USW or USW-E assisted soldering technique refines microstructure of the Sn2.5Ag0.7 Cu0.1RE0.05Ni/Cu solder joints and promotes the proportion of eutectic structure,as well as reduces the average thickness,roughness and grain size of interfacial IMC.The shear strength of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints under the USW-E assisted soldering is closely related to the roughness of interfacial IMC layer.The USW plays an important role in the decrease of roughness of the interfacial IMC during the USW-E assisted soldering.Compared with shear strength of the traditional soldering joints,an increment of 24.1% in shear strength of the soldering joints is achieved with the USW-E assisted soldering.With applying the USW or the USW-E,the fracture path of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints transfers from the interfacial transitional region composed of soldering seam and interfacial IMC layer to the side of soldering seam.The fracture mechanism of the soldering joints obtained by the USW or the USW-E assisted soldering are brittle-ductile mixed fracture with the cleavage of interfacial(Cu,Ni)_6Sn_5 IMC and the cleavage-dimple of soldering seam,which increases the proportion of ductile fracture zone and the shear strength of soldering joints.
引文
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[3]Zhang Xiaojiao(张晓娇),Zhang Keke(张柯柯),Zhao Kai(赵恺)et al.Transactions of Materials&Heat Treatment(材料热处理学报)[J],2014,35(9):70
[4]Liu Ping,Yao Pei,Liu Jim.Journal of Alloys&Compounds[J],2009,486(1-2):474
[5]Zhang Keke,Zhang Xiaojiao,Qiu Ranfeng et al.Journal of Materials Science:Materials in Electronics[J],2014,25(4):1681
[6]Naka M,Hafez K M.Journal of Materials Science[J],2003,38(16):3491
[7]Chinnam R K,Fauteux C,Neuenschwander J et al.Acta Materialia[J],2011,59(4):1474
[8]Kang J,Conrad H.Materials Science&Engineering A[J],2003,356(1-2):8
[9]Tan A T,Tan A W,Yusof F.Journal of Alloys&Compounds[J],2017,705:188
[10]Yu D Q,Wang L.Journal of Alloys&Compounds[J],2008,458(1-2):542
[11]Ren Huailiang(任怀亮).Metallographic Experimental Technique(金相实验技术)[M].Beijing:Metallurgical Industry Press,2005:140
[12]Zhang Keke(张柯柯),Guo Xingdong(郭兴东),Wang Huigai(王悔改)et al.Rare Metal Materials and Engineering(稀有金属材料与工程)[J],2017,46(5):1353
[13]Ji Hongjun,Wang Qiang,Li Mingyu et al.Journal of Electronic Materials[J],2014,43(7):2467
[14]Ji Hongjun,Wang Qiang,Li Mingyu.Journal of Electronic Materials[J],2016,45(1):1
[15]Ji Hongjun,Qiao Yunfei,Li Mingyu.Scripta Materialia[J],2016,110:19
[16]Conrad H,Guo Z,Sprecher A F.Scripta Metallurgica[J],1989,23(6):821
[17]Yu Daquan(于大全).Research on Lead-free Solder and Its Interface in Electronic Packaging Interconnection(电子封装互连无铅钎料及其界面问题研究)[D].Dalian:Dalian University of Technology,2004
[18]Liu Xiaoying,Huang Mingliang,Zhao Yanhui et al.Journal of Alloys&Compounds[J],2010,492(1):433
[19]Teo J W R,Sun Y F.Acta Materialia[J],2008,56(2):242