氟化钙对单晶硅片磨削用树脂结合剂金刚石砂轮磨削性能的影响
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摘要
在单晶硅片磨削用树脂结合剂金刚石砂轮中分别添加不同体积分数的固体润滑剂氟化钙(CaF_2),评估其对砂轮表面结构、砂轮磨损量、磨床主轴电流的影响,并测量和计算单晶硅片的表面粗糙度和表面损伤层厚度。结果显示:随CaF_2用量增加,磨床主轴电流、砂轮磨损量、单晶硅片的表面粗糙度值和表面损伤层厚度均下降;当CaF_2体积分数为25%时,主轴电流降至约6.4 A,砂轮磨损量降到每片0.448 6μm,单晶硅片的表面粗糙度R_a、R_y和R_z分别为0.056μm、0.382μm和0.396μm,表面损伤层厚0.559 6μm。加入CaF_2固体润滑剂可有效改善树脂金刚石砂轮的性能,提高单晶硅片表面的加工质量,且CaF_2体积分数为25%时效果最佳。
Solid lubricant Calcium fluoride(CaF_2) with different volume fractions is added into resin-bonded diamond wheels for single crystal silicon wafer grinding. Its influence on surface structure and wear ratio of the wheel, as well as the spindle current of grinding machine, is analyzed. The surface roughness of the wafer and the thickness of damage layer on its surface are measured and calculated. Results show that as the content of CaF_2 increases, the current, the wear ratio and the surface roughness and damage layer thickness all decrease. When the volume fraction of CaF_2 added is 25%, the current is about 6.4 A, and wear ratio of wheel decreased to 0.448 6 μm, with R_a 0.056 μm, R_y 0.382 μm and R_z 0.396 μm on the wafer surface and thickness of damage layer0.559 6μm. In conclusion, the performance of resin-bonded diamond wheels and the quality of machined single crystal silicon wafer could be enhanced by adding CaF_2 as solid lubricant, and the best volume fraction of CaF_2 is 25%.
Solid lubricant Calcium fluoride(CaF_2) with different volume fractions is added into resin-bonded diamond wheels for single crystal silicon wafer grinding. Its influence on surface structure and wear ratio of the wheel, as well as the spindle current of grinding machine, is analyzed. The surface roughness of the wafer and the thickness of damage layer on its surface are measured and calculated. Results show that as the content of CaF_2 increases, the current, the wear ratio and the surface roughness and damage layer thickness all decrease. When the volume fraction of CaF_2 added is 25%, the current is about 6.4 A, and wear ratio of wheel decreased to 0.448 6 μm, with R_a 0.056 μm, R_y 0.382 μm and R_z 0.396 μm on the wafer surface and thickness of damage layer0.559 6μm. In conclusion, the performance of resin-bonded diamond wheels and the quality of machined single crystal silicon wafer could be enhanced by adding CaF_2 as solid lubricant, and the best volume fraction of CaF_2 is 25%.
引文
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[9] SHAJI S, RADHAKRISHNAN V. Application of solid lubricants in grinding: investigations of graphite sandwiched grinding wheels [J]. Machine Science Technology, 2003, 7(1): 137-155.
[10] REDDY N S, RAO P V. Experimental investigation to study the effect of solid lubricants on cutting forces and surface quality in end milling [J]. International Journal of Machine & Tools Design, 2006, 46(2): 189-198.
[11] MUKHOPADHYAY D, BANERJEE S, REDDY N S. Investigation to study the application of solid lubricant in turning AISI 1040 steel [J]. CIRP Conference on High Performance Cutting, 2007, 129(3): 520-526.
[12] ZHANG Y, LI C, JIA D, et al. Experimental evaluation of MoS2 nanoparticles in jet MQL grinding with different types of vegetable oil as base oil [J]. Journal of Cleaner Production, 2015, 87(15): 930-940.
[13] 焦阳, 李郝林. 数控磨削过程中砂轮电机电流的实时检测 [J]. 上海理工大学学报,2009, 31(1): 77–79.JIAO Yang, LI Haolin. Real-time monitoring of grinding wheel motor current in the numerical control grinding processing [J]. Journal of University of Shanghai for Science and Technology, 2009, 31(1): 77-79.
[14] 张银霞. 单晶硅片超精密加工表面\\亚表面损伤检测技术 [J]. 电子质量, 2004(7): 72–75.ZHANG Yinxia. Measurement of silicon wafer surface\\subsurface damage induced by ultra-precision processing [J]. Electronics Quality, 2004(7): 72-75.
[15] SHAJI S, RADHAKRISHNAN V. An investigation on solid lubricant moulded grinding wheels [J]. International Journal of Machine Tools & Manufacture, 2003, 43(9): 965-972.
[16] LANDSDOWN A R. High temperature lubrication [M]. London: Mechanical Engineering Publication Ltd., 1994.
[2] 林培勇, 魏昕, 陈卓, 等. 树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究 [J]. 金刚石与磨料磨具工程, 2010, 32(4): 19–22.LIN Peiyong, WEI Xin, CHEN Zhuo, et al. Research on the grinding force when machining monocrystalline silicon wafer with resin-bonded diamond grinding wheel [J]. Diamond & Abrasives Engineering, 2010, 32(4): 19-22.
[3] GAO S, KANG R K, LI Y, et al. Surface and subsurface damages of CdZnTe substrates ground by diamond grinding wheel [J]. Key Engineering Materials, 2011, 487: 1-5.
[4] 惠珍, 丁玉龙, 丁春生, 等. 不同晶型金刚石树脂砂轮磨削性能研究 [J]. 金刚石与磨料磨具工程, 2015, 35(5): 63–66.HUI Zhen, DING Yulong, DING Chunsheng, et al. Study on grinding performance of resin bond grinding wheels made of different types of crystal diamond [J]. Diamond & Abrasives Engineering, 2015, 35(5): 63-66.
[5] MATSUMOTO D, WASLASKE W F, SLAE B L. Abrasive tools for grinding electronic components: US patent 6394888 [P]. 2002-05-28.
[6] RAMANATH S, BULJAN S T, WILSON J R, et al. Porous abrasive tool and method for making the same: US patent 10465054 [P]. 2003-12-18.
[7] SHAJI S, RADHAKRISHNAN V. Investigations on the application of solid lubricants in grinding [J]. Proceedings of the Institution of Mechanical Engineers Part B–Journal of Engineering Manufacture, 2002, 216(10): 1325-1343.
[8] SHAJI S, RADHAKRISHNAN V. An investigation on surface grinding using graphite as lubricant [J]. International Journal of Machine Tools & Manufacture, 2002, 42(6): 733-740.
[9] SHAJI S, RADHAKRISHNAN V. Application of solid lubricants in grinding: investigations of graphite sandwiched grinding wheels [J]. Machine Science Technology, 2003, 7(1): 137-155.
[10] REDDY N S, RAO P V. Experimental investigation to study the effect of solid lubricants on cutting forces and surface quality in end milling [J]. International Journal of Machine & Tools Design, 2006, 46(2): 189-198.
[11] MUKHOPADHYAY D, BANERJEE S, REDDY N S. Investigation to study the application of solid lubricant in turning AISI 1040 steel [J]. CIRP Conference on High Performance Cutting, 2007, 129(3): 520-526.
[12] ZHANG Y, LI C, JIA D, et al. Experimental evaluation of MoS2 nanoparticles in jet MQL grinding with different types of vegetable oil as base oil [J]. Journal of Cleaner Production, 2015, 87(15): 930-940.
[13] 焦阳, 李郝林. 数控磨削过程中砂轮电机电流的实时检测 [J]. 上海理工大学学报,2009, 31(1): 77–79.JIAO Yang, LI Haolin. Real-time monitoring of grinding wheel motor current in the numerical control grinding processing [J]. Journal of University of Shanghai for Science and Technology, 2009, 31(1): 77-79.
[14] 张银霞. 单晶硅片超精密加工表面\\亚表面损伤检测技术 [J]. 电子质量, 2004(7): 72–75.ZHANG Yinxia. Measurement of silicon wafer surface\\subsurface damage induced by ultra-precision processing [J]. Electronics Quality, 2004(7): 72-75.
[15] SHAJI S, RADHAKRISHNAN V. An investigation on solid lubricant moulded grinding wheels [J]. International Journal of Machine Tools & Manufacture, 2003, 43(9): 965-972.
[16] LANDSDOWN A R. High temperature lubrication [M]. London: Mechanical Engineering Publication Ltd., 1994.