热沉衬底金刚石/铜复合材料表面金属化工艺研究
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摘要
为了改善金刚石/铜复合材料的表面特性,采用化学镀镍与电镀金结合的方式。先通过SnCl2溶液和PdCl2溶液对复合材料表面进行敏化、活化等预处理,并研究预处理对后续化学镀镍层产生的影响。通过SEM(扫描电子显微镜)、EDXS(能量色散X射线光谱仪)、OM(光学显微镜)和热振、高温烘烤等实验措施数据的分析对复合镀层进行研究,研究结果表明,通过化学镀加电镀的方法在金刚石/铜复合材料表面得到了高结合力、均匀致密的镍合金镀层。
To improve the surface properties of diamond/Cu composite material,the combination of electroless nickel plating and gold electroplating is adopted. The pretreatments such as composite surface sensitization and activation through SnCl2 solution and PdCl2 solution are conducted at first,and the effects of the pretreatments on the following electroless nickel plating are researched. The composite coating is examined by analyzing the experimental data from SEM,EDX,OM,thermal vibration,high temperature baking and so on. The results show that the uniform,compact and tight-bonded Ni-Au coating could be plated on the surface of diamond/Cu composite material.
To improve the surface properties of diamond/Cu composite material,the combination of electroless nickel plating and gold electroplating is adopted. The pretreatments such as composite surface sensitization and activation through SnCl2 solution and PdCl2 solution are conducted at first,and the effects of the pretreatments on the following electroless nickel plating are researched. The composite coating is examined by analyzing the experimental data from SEM,EDX,OM,thermal vibration,high temperature baking and so on. The results show that the uniform,compact and tight-bonded Ni-Au coating could be plated on the surface of diamond/Cu composite material.
引文
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[8]刘东光,卢海燕,周明智.微波组件Al-Si封装材料表面改性工艺研究[J].雷达科学与技术,2013,11(6):675-678.
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[10] LIU D G,MAI Y J,SUN J,et al.Surface metallization of Cu/Ni/Au coatings on diamond/Cu composite materials for heat sink application[J]. Ceramics International,2017,43(16):13133-13139.
[2]黄强,顾明元,金燕萍.电子封装材料的研究现状[J].材料导报,2000,14(9):28-32.
[3] SHANG Q L,TAO J M,XU M C,et al. Research progress of diamond-Cu composite material for electronic packaging[J]. Electronics Process Technology,2009,30(1):5.
[4]刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2001,24(2):49-54.
[5]夏扬,宋月清,崔舜,等.热管理材料的研究进展[J].材料导报,2008,22(1):4-7.
[6]邓安强,樊静波,谭占秋,等.金刚石/铜复合材料在电子封装领域的研究进展[J].金刚石与磨料磨具工程,2010,30(5):56-61.
[7]王洪波,贾成厂,郭宏.电子封装用Diamond/Cu复合材料的化学镀镍[J].功能材料,2011,42(2):233-236.
[8]刘东光,卢海燕,周明智.微波组件Al-Si封装材料表面改性工艺研究[J].雷达科学与技术,2013,11(6):675-678.
[9]刘东光,胡江华.细间距图形电路无氰化学镀金工艺研究[J].电子与封装,2013,13(5):31-33.
[10] LIU D G,MAI Y J,SUN J,et al.Surface metallization of Cu/Ni/Au coatings on diamond/Cu composite materials for heat sink application[J]. Ceramics International,2017,43(16):13133-13139.