粉末冶金50%Si_p/6061Al复合材料的结构与性能
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摘要
以Si粉和6061Al合金粉末为原料,采用机械球磨-常压烧结工艺制备硅颗粒含量(质量分数)为50%的颗粒增强铝基复合材料,利用扫描电镜和X射线衍射仪分析不同温度下烧结的复合材料结构与物相组成,并测试材料的密度、抗弯强度、硬度及热膨胀系数等性能。结果表明,通过球磨可获得成分均匀的Si_p/6061Al复合粉体。烧结温度为700℃时,50%Si_p/6061Al复合材料仅含少量Al_2O_3杂质,Si相分布均匀,呈半连续骨架结构,Si颗粒与6061Al基体合金结合良好,材料中孔隙的数量和尺寸都最小。在680~750℃温度范围内,随烧结温度升高,50%Si_p/Al复合材料的致密度及抗弯强度先增大后降低,在700℃烧结的50%Si_p/6061Al复合材料具有优异的综合性能,其致密度、抗弯强度、硬度(HB)、热膨胀系数(室温)分别为96.4%,310.8 MPa,225.4和7.43×10~(-6)/K。
50%Si_p/6061 Al composites were fabricated by a powder metallurgy technique via mechanical ball milling and pressureless sintering using Si and 6061 Al powders as raw materials. Microstructures and phase composition were analyzed by scanning electronic microscope(SEM) and X-ray diffraction(XRD). Density, bending strength, hardness and coefficient of thermal expansion(CTE) at room temperature(RT) of the composites were also detected. The results show that the mechanical ball milling is beneficial to form the homogeneous Si_p/6061 Al composite powder. When the sintering temperature is 700 ℃, the sintered 50%Si_p/6061 Al composites have a high purity. Only a little bit Al_2O_3 impurities are contained, and the Si phase distributes in the composite uniformly with a semi-continuous skeleton-like structure and combines well with the Al alloy matrix, in which the number and size of pores are the minimum. With increasing the sintering temperature from 680 ℃ to 750 ℃, the relative density and bending strength of the composites increase initially and then decrease. The Si_p/6061 Al composites sintered at 700 ℃ have the optimal properties: relative density of 96.4%, bending strength of 310.8 MPa, Brinell hardness of HB 225.4 and CTE(RT) of 7.43×10~(-6)/K.
50%Si_p/6061 Al composites were fabricated by a powder metallurgy technique via mechanical ball milling and pressureless sintering using Si and 6061 Al powders as raw materials. Microstructures and phase composition were analyzed by scanning electronic microscope(SEM) and X-ray diffraction(XRD). Density, bending strength, hardness and coefficient of thermal expansion(CTE) at room temperature(RT) of the composites were also detected. The results show that the mechanical ball milling is beneficial to form the homogeneous Si_p/6061 Al composite powder. When the sintering temperature is 700 ℃, the sintered 50%Si_p/6061 Al composites have a high purity. Only a little bit Al_2O_3 impurities are contained, and the Si phase distributes in the composite uniformly with a semi-continuous skeleton-like structure and combines well with the Al alloy matrix, in which the number and size of pores are the minimum. With increasing the sintering temperature from 680 ℃ to 750 ℃, the relative density and bending strength of the composites increase initially and then decrease. The Si_p/6061 Al composites sintered at 700 ℃ have the optimal properties: relative density of 96.4%, bending strength of 310.8 MPa, Brinell hardness of HB 225.4 and CTE(RT) of 7.43×10~(-6)/K.
引文
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[15]CAI Zhiyong,ZHANG Chun,WANG Richu,et al.Preparation of Al-Si alloys by a rapid solidification and powder metallurgy route[J].Materials and Design,2015,87(11):996-1002.
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[3]魏衍广.喷射成形Si-Al电子封装材料的制备及组织性能研究[D].北京:北京有色金属研究总院,2006.WEI Yanguang.Research on producing microstructures and properties of spray-formed Si-Al alloys used for electronic packaging[D].Beijing:Beijing General Research Institute for Nonferrous Metals,2006.
[4]CHEN Y Y,CHUNG D D L.Silicon-aluminum network composites fabricated by liquid metal infiltration[J].Journal of Materials Science,1994,29(23):6069-6075.
[5]甘卫平,陈招科,杨伏良,等.高硅铝合金轻质电子封装材料研究现状及进展[J].材料导报,2004,18(6):79-82.GAN Weiping,CHEN Zhaoke,YANG Fuliang,et al.Research status and development of high silicon aluminum alloy for light weight electronic package materials[J].Materials Review,2004,18(6):79-82.
[6]冯曦,郑子樵,李世晨,等.热压法制备Si-A1电子封装材料及其性能[J].稀有金属,2005,29(1):11-15.FENG Xi,ZHENG Ziqiao,LI Shichen,et al.Properties of Si-Al electronic packaging materials fabricated by hot pressing[J].Chinese Journal of Rare Metals,2005,29(1):11-15.
[7]冯曦,杨迎新,郑子樵,等.压制压力对Si-Al电子封装材料性能的影响[J].中南大学学报:自然科学版,2005,36(2):198-203.FENG Xi,YANG Yingxin,ZHENG Ziqiao,et al.Effect of pressing pressure on properties of Si-Al electronic packaging materials[J].Journal of Central South University:Science and Technology,2005,36(2):198-203.
[8]韩凤麟,马福康,曹勇家.粉末冶金技术手册[M].北京:化学工业出版社,2009.HAN Fenglin,MA Fukang,CAO Yongjia.Handbook of Powder Metallurgy Technology[M].Beijing:Chemical Industry Press,2009.
[9]SUBRATA K G,PARTHA S,SHYAM K.Influence of size and volume fraction of Si C particulates on properties of ex situ reinforced Al-4.5Cu-3Mg metal matrix composite prepared by direct metal laser sintering process[J].Materials Science and Engineering:A,2010,527(18):4694-4701.
[10]LIU Haili,TANG Wenming,WANG Yuexia,et al.Structural evolutions of the Fe-40Al-5Cr powders during mechanical alloying and subsequent heat treatment[J].Journal of Alloys and Compounds,2010,506(2):963-968.
[11]窦玉海,刘咏,刘延斌,等.机械合金化结合热压制备高硅铝合金的组织及性能[J].粉末冶金材料科学与工程,2013,18(4):566-571.DOU Yuhai,LIU Yong,LIU Yanbin,et al.Microstructures and properties of high-silicon aluminum alloys fabricated by mechanical alloying and hot pressing[J].Materials Science and Engineering of Powder Metallurgy,2013,18(4):566-571.
[12]黄培云.粉末冶金原理[M].北京:冶金工业出版社,1997.HUANG Peiyun.Power Metallurgy Principle[M].Beijing:Metallurgical Industry Press,1997.
[13]吴其胜,蔡安兰,杨亚群.材料物理性能[M].上海:华东理工大学出版社,2010.WU Qisheng,CAI Anlan,YANG Yaqun.Physical Properties of Materials[M].Shanghai:East China University of Science and Technology,2010.
[14]YU Kun,LI Shaojun,CHEN Lisan,et al.Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications[J].Transactions of Nonferrous Metals Society of China,2012,22(6):1412-1417.
[15]CAI Zhiyong,ZHANG Chun,WANG Richu,et al.Preparation of Al-Si alloys by a rapid solidification and powder metallurgy route[J].Materials and Design,2015,87(11):996-1002.