贴片胶对高量程MEMS加速度传感器性能的影响
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摘要
贴片工艺是高量程MEMS加速度传感器封装工艺中一个非常重要的环节,对传感器的灵敏度和可靠性具有重要的影响。根据一种自制的、量程为XX的高量程MEMS加速度传感器的贴片封装模式,利用有限元分析法建立了传感器的贴片封装模型,基于理论、有限元方法研究了贴片胶弹性模量对传感器性能的影响。使用两种不同弹性模量的贴片胶对传感器进行了封装,开展了基于霍普金森压杆测试系统的传感器性能测试试验。模拟和试验结果表明:对于使用贴片封装模式的高量程MEMS传感器,其灵敏度随着贴片胶弹性模量的增加而相应的提高。
The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with different elasticity modulus. The effect of the die adhesive on the performances has been studied by using finite element analysis( FEA) and Hopkinson pressure bar measurement system simultaneously. With the consistent package process,we have experimentally demonstrated that the characteristic of dynamic sensitivity for the prepared MEMS high-g accelerometers increases with the increasing of elasticity modulus of the die attach adhesives. From this result,it is possible to fabricate MEMS high-g accelerometer with bigger sensitivity by applying die attach adhesive with bigger elasticity modulus.
The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with different elasticity modulus. The effect of the die adhesive on the performances has been studied by using finite element analysis( FEA) and Hopkinson pressure bar measurement system simultaneously. With the consistent package process,we have experimentally demonstrated that the characteristic of dynamic sensitivity for the prepared MEMS high-g accelerometers increases with the increasing of elasticity modulus of the die attach adhesives. From this result,it is possible to fabricate MEMS high-g accelerometer with bigger sensitivity by applying die attach adhesive with bigger elasticity modulus.
引文
[1]蒋玉齐,杜茂华,罗乐.灌封对高量程微机械加速度计封装的影响[J].机械强度,2004(02):149-153.Jiang Yu Qi,Du Mao Hua,LUO Le.Effect of potting on the packaging of high-g MEMS accelerometer[J].Journal of Mechanical Strength,2004(02):149-153(In Chinese).
[2]郭涛,徐雁,李平.MEMS高g加速度传感器封装贴片技术的研究[J].化工自动化及仪表,2011(09):133-135.GUO Tao,XU Yan,LI Ping.The research of die adhesive in the High-G MEMS Accelerometer[J].Control and Instruments in Chemical Industry.2011(09):149-153(In Chinese).
[3]Shi Yun-Bo.Consistency of High-g Acceleration sensor performance[J].Applied Mechanics and Materials,2012(07):68-75.
[4]Hu Y Q,Wang L S,Zeng Z J,et al.Structural failure analysis and numerical simulation of microaccelerometers under impulsive loading[J].International Journal of Nonlinear Sciences and Numerical Simulation,2002(3):311-314.
[5]石云波,祈晓瑾,刘俊,等.微型高过载加速度传感器的加工与测试[J].机械工程学报,2008(44):200-203.SHI Yun Bo,QI Xiao Jin,LIU Jun,et al.Fabrication and test of micro overloading acceleration sensor[J].Journal of Mechanical Engineering.2008(44):200-203(In Chinese).
[6]郑君如.信号与系统[M]北京:高等教育出版社,2011:236-250.ZHENG JunRu.Signal and systems[M].Beijing:High Education Press.2011:236-250(In Chinese).
[7]王立森,胡宇群,李志宏等.微加速度计在冲击载荷作用下的失效分析[J].机械强度,2001(23):516-522.WANG Li Qun,HU Yu Qun,LI Zhi Hong,et al.Failure analysis of micro accelerometer under impact loading[J].Journal of Mechanical Strength,2001(23):516-522(In Chinese).
[8]赵亚溥.纳米与介观力学[M].北京:科学出版社,2014:156-188.ZHAO Ya Bo.Nano and mesoscopic mechanics[M].Beijing:Science Press,2014:156-188(In Chinese).
[9]景鹏.高g值冲击测试关键技术研究[D].太原:中北大学,2009(05):23-45.JI Peng.High-g impact test value of the research of key technologies[D].Taiyuan:North University of China,2009(05):23-45(In Chinese).
[10]李玉龙,郭伟国.高g值加速度传感器校准系统的研究[J].爆炸与冲击,1997(17):90-96.LI Yu Long,GUO Wei Guo,JIA De Xin,et al.An equipment for calibrating high shock acceleration sensors[J].Explosion and Shock Waves,1997(17):90-96(In Chinese).
[11]石云波,杨志才,王艳阳,等.高g值压阻式加速度计的Hopkinson杆冲击测试及失效分析[J].中国惯性技术学报,2015(03):2-3.SHI Yun Bo,YANG Zhi Cai,WANG Yan Yang,et al.Impact test and failure analysis of high-range piezo-resistive accelerometer based on Hopkinson bar[J].Journal of Chinese Inertial Technology,2015(03):2-3(In Chinese).
[12]康凤霞.高g值加速度传感器的动态特性研究[D].太原:中北大学,2009:20-25.KANG Feng Xia.The research of dynamic performance of high-g accelerometer[D].Taiyuan:North University of China.2009:20-25(In Chinese).
[13]郭伟国,李玉龙.应力波基础简明教程[M].西安:西北工业大学出版社,2007:55-71.GUO Wei Guo,LI Yu Long.Stress wave basic introductory tutorial[M].Xi’an:Northwestern Polytechnical University Press,2009:20-25(In Chinese).
[14]宋力.霍普金森压杆实验的加载设计与数据处理[D].合肥:中国科技大学,2005:19-20.SONG Li.Loading design and date processing of Hopkinson pressure bar experiment[D].Heifei:University of Science and Technology of China,2005:19-20(In Chinese).
[15]黎渊.三轴高g值加速度计的测试理论与实验研究[D].长沙:国防科技大学,2008:31-33.Li Yuan.Study on calibration theory and experiment of a triaxial high-g accelerometer[D].Changsha:National University of Defense Technology,2008:31-33(In Chinese).
[2]郭涛,徐雁,李平.MEMS高g加速度传感器封装贴片技术的研究[J].化工自动化及仪表,2011(09):133-135.GUO Tao,XU Yan,LI Ping.The research of die adhesive in the High-G MEMS Accelerometer[J].Control and Instruments in Chemical Industry.2011(09):149-153(In Chinese).
[3]Shi Yun-Bo.Consistency of High-g Acceleration sensor performance[J].Applied Mechanics and Materials,2012(07):68-75.
[4]Hu Y Q,Wang L S,Zeng Z J,et al.Structural failure analysis and numerical simulation of microaccelerometers under impulsive loading[J].International Journal of Nonlinear Sciences and Numerical Simulation,2002(3):311-314.
[5]石云波,祈晓瑾,刘俊,等.微型高过载加速度传感器的加工与测试[J].机械工程学报,2008(44):200-203.SHI Yun Bo,QI Xiao Jin,LIU Jun,et al.Fabrication and test of micro overloading acceleration sensor[J].Journal of Mechanical Engineering.2008(44):200-203(In Chinese).
[6]郑君如.信号与系统[M]北京:高等教育出版社,2011:236-250.ZHENG JunRu.Signal and systems[M].Beijing:High Education Press.2011:236-250(In Chinese).
[7]王立森,胡宇群,李志宏等.微加速度计在冲击载荷作用下的失效分析[J].机械强度,2001(23):516-522.WANG Li Qun,HU Yu Qun,LI Zhi Hong,et al.Failure analysis of micro accelerometer under impact loading[J].Journal of Mechanical Strength,2001(23):516-522(In Chinese).
[8]赵亚溥.纳米与介观力学[M].北京:科学出版社,2014:156-188.ZHAO Ya Bo.Nano and mesoscopic mechanics[M].Beijing:Science Press,2014:156-188(In Chinese).
[9]景鹏.高g值冲击测试关键技术研究[D].太原:中北大学,2009(05):23-45.JI Peng.High-g impact test value of the research of key technologies[D].Taiyuan:North University of China,2009(05):23-45(In Chinese).
[10]李玉龙,郭伟国.高g值加速度传感器校准系统的研究[J].爆炸与冲击,1997(17):90-96.LI Yu Long,GUO Wei Guo,JIA De Xin,et al.An equipment for calibrating high shock acceleration sensors[J].Explosion and Shock Waves,1997(17):90-96(In Chinese).
[11]石云波,杨志才,王艳阳,等.高g值压阻式加速度计的Hopkinson杆冲击测试及失效分析[J].中国惯性技术学报,2015(03):2-3.SHI Yun Bo,YANG Zhi Cai,WANG Yan Yang,et al.Impact test and failure analysis of high-range piezo-resistive accelerometer based on Hopkinson bar[J].Journal of Chinese Inertial Technology,2015(03):2-3(In Chinese).
[12]康凤霞.高g值加速度传感器的动态特性研究[D].太原:中北大学,2009:20-25.KANG Feng Xia.The research of dynamic performance of high-g accelerometer[D].Taiyuan:North University of China.2009:20-25(In Chinese).
[13]郭伟国,李玉龙.应力波基础简明教程[M].西安:西北工业大学出版社,2007:55-71.GUO Wei Guo,LI Yu Long.Stress wave basic introductory tutorial[M].Xi’an:Northwestern Polytechnical University Press,2009:20-25(In Chinese).
[14]宋力.霍普金森压杆实验的加载设计与数据处理[D].合肥:中国科技大学,2005:19-20.SONG Li.Loading design and date processing of Hopkinson pressure bar experiment[D].Heifei:University of Science and Technology of China,2005:19-20(In Chinese).
[15]黎渊.三轴高g值加速度计的测试理论与实验研究[D].长沙:国防科技大学,2008:31-33.Li Yuan.Study on calibration theory and experiment of a triaxial high-g accelerometer[D].Changsha:National University of Defense Technology,2008:31-33(In Chinese).