印制电路板微孔背钻技术研究
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摘要
为适应通讯设备高频高速的发展需要,未来的高速电路板上布线密度将越来越高,钻孔取刀也会越来越小,同时为减少信号干扰的背钻刀径也越来越小,因此,微孔背钻技术提升成为了迫切需要。然而,背钻堵孔问题一直是困扰PCB业界的共同难题。从对背钻堵孔形态和堵孔原因进行分析,针对钻刀设计原理进行了研究,设计出一种特殊结构的背钻钻刀,解决了微孔背钻堵孔问题,使得背钻加工技术能力在行业内取得领先水平。
In order to meet the requirement of high frequency and high speed development of communication equipments the density of wiring on the high-speed PCB will be higher and higher,and the diameter of drilling hole will be smaller and smaller In the future. At the same time, the diameter of back drilling tool to reduce the signal interference will be smaller and smaller.Therefore, The improvement of micro-via back drilling technology has become an urgent need.However, the common problem of micro-via back drill is hole plugging in the PCB industry. The form and reason of the micro-via back drill hole plugging have been analyzed. Based on the research on drill bit design principle, back drill bit with special structure has been designed to solve the hole plugging problem. As a result, the micro-via back drill processing ability ranks the top in PCB industry now.
In order to meet the requirement of high frequency and high speed development of communication equipments the density of wiring on the high-speed PCB will be higher and higher,and the diameter of drilling hole will be smaller and smaller In the future. At the same time, the diameter of back drilling tool to reduce the signal interference will be smaller and smaller.Therefore, The improvement of micro-via back drilling technology has become an urgent need.However, the common problem of micro-via back drill is hole plugging in the PCB industry. The form and reason of the micro-via back drill hole plugging have been analyzed. Based on the research on drill bit design principle, back drill bit with special structure has been designed to solve the hole plugging problem. As a result, the micro-via back drill processing ability ranks the top in PCB industry now.
引文
[1]李金鸿,陈显任,罗龙.不同背钻工艺流程的研究[C]. 2012年秋季国际PCB技术/信息论坛.东莞:中国印制电路行业协会, 2012.
[2]周尚松.关于改善小孔背钻堵孔的研究[J].印制电路信息,2013(4):154-158.
[3]王瑾,周明镝,李小晓,等.1.0 mmBGA/0.20 mm过孔背钻走2线工艺技术研究[J].印制电路信息,2013(4):105-114.
[4]郑李娟.微细钻头钻削印刷电路板加工机理研究[D].广州:广东工业大学,2011.
[5]王忠魁周长江.麻花钻横刃角度的计算与分析[J].《工具技术》1996(12):16-19.
[6]王成勇,郑李娟,黄欣,等.印制电路板微孔机械钻削研究[J].印制电路信息,2015,23(3):51-59.
[7]林劲德.微孔钻头的折断与防断对策[J].机械工艺师,1998(2):25-26.
[8]言兰,周志雄.微钻头刚度的有效元分析[J].机械工艺师,2006(4):65-67.
[2]周尚松.关于改善小孔背钻堵孔的研究[J].印制电路信息,2013(4):154-158.
[3]王瑾,周明镝,李小晓,等.1.0 mmBGA/0.20 mm过孔背钻走2线工艺技术研究[J].印制电路信息,2013(4):105-114.
[4]郑李娟.微细钻头钻削印刷电路板加工机理研究[D].广州:广东工业大学,2011.
[5]王忠魁周长江.麻花钻横刃角度的计算与分析[J].《工具技术》1996(12):16-19.
[6]王成勇,郑李娟,黄欣,等.印制电路板微孔机械钻削研究[J].印制电路信息,2015,23(3):51-59.
[7]林劲德.微孔钻头的折断与防断对策[J].机械工艺师,1998(2):25-26.
[8]言兰,周志雄.微钻头刚度的有效元分析[J].机械工艺师,2006(4):65-67.