浅析SMT焊接质量的主要影响因素和改善措施
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摘要
SMT工艺作为电子组装的核心工艺,其焊接质量的好坏直接影响产品的整体质量和生产成本,因此,改善SMT焊接质量,减少客户投诉,能提高公司产品的竞争力。本文结合自己多年的SMT生产实践经验,简要的从物料、PCB焊盘设计、锡膏印刷、元件贴装、回流焊接等方面对SMT焊接质量的影响,并提出相应的预防和改善措施。
SMT process as the core of the electronics assembly process,the welding quality directly affects the overall quality of the products and the production cost,therefore,to improve the SMT welding quality,reduce customer complaints,improve the competitiveness of the company's products. In this paper,the author combines his years of SMT production experience,briefly from material,PCB plate design,solder paste printing,component mount,reflow soldering and other aspects of SMT Soldering Quality influence,and puts forward corresponding measures to prevent and improve.
SMT process as the core of the electronics assembly process,the welding quality directly affects the overall quality of the products and the production cost,therefore,to improve the SMT welding quality,reduce customer complaints,improve the competitiveness of the company's products. In this paper,the author combines his years of SMT production experience,briefly from material,PCB plate design,solder paste printing,component mount,reflow soldering and other aspects of SMT Soldering Quality influence,and puts forward corresponding measures to prevent and improve.
引文
[1]袁翠苹.浅析SMT提升再流焊质量的技术措施[J].电子技术与软件工程,2015.
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[3]IPC-7525A模板钢网设计指南[S].2004,2.
[4]何健,潘静.SMT锡膏性能和印刷参数的优化[J].企业技术开发,2010.
[5]顾霭云.SMT关键工序-再流焊工艺控制[M].2013,3.
[2]贾忠中.SMT核心工艺解析与案例分析(第二版)[M].电子工业出版社,2013.
[3]IPC-7525A模板钢网设计指南[S].2004,2.
[4]何健,潘静.SMT锡膏性能和印刷参数的优化[J].企业技术开发,2010.
[5]顾霭云.SMT关键工序-再流焊工艺控制[M].2013,3.