基于DOB工艺的卫星导航抗干扰专用裸芯片测试板设计
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摘要
针对卫星导航抗干扰专用芯片,为了在裸芯片封装前能够更快速地进行芯片功能测试,采用DOB工艺,将芯片裸片分别装联到常规矩形排列的PCB焊盘和优化后交错排列的PCB焊盘上,通过破坏性拉力实验对比发现,键合强度存在较大差异,经过优化的PCB焊盘设计更能满足DOB工艺需求,此外通过对比焊盘优化后承载裸芯片的PCB和承载封装后芯片的PCB电性能参数,验证了基于DOB工艺裸芯片测试的可行性,提高芯片测试效率,为芯片优化和上市节约时间,降低成本。
In order to test the function of the satellite navigation anti-interference special die, this paper describes the design of test board based on DOB process. The pads on bare die are connected to two different kinds of PCB pads, which one are kept in line and the other are kept staggered. There is an obvious difference about the bonding strength between them. Otherwise, there is no difference about the electrical characteristics between ASIC with package and die without package, so that the PCB design based on DOB process is effective in saving time and costs.
In order to test the function of the satellite navigation anti-interference special die, this paper describes the design of test board based on DOB process. The pads on bare die are connected to two different kinds of PCB pads, which one are kept in line and the other are kept staggered. There is an obvious difference about the bonding strength between them. Otherwise, there is no difference about the electrical characteristics between ASIC with package and die without package, so that the PCB design based on DOB process is effective in saving time and costs.
引文
[1]叶雨欣.晶圆级热电堆探测器测试技术的研究[J].制造业自动化,2015,9(9):37-41.
[2]Rogalski A.History of infrared detectors[J].OptoElectronics Review,2012.20(3):279-308.
[3]祁姝琪.LED芯片的COB封装技术[A].杭州电子科技大学,2012:11-12.
[4]黄玉财.集成电路封装中的引线键合技术[J].电子与封装,2006,6(7):16-21.
[2]Rogalski A.History of infrared detectors[J].OptoElectronics Review,2012.20(3):279-308.
[3]祁姝琪.LED芯片的COB封装技术[A].杭州电子科技大学,2012:11-12.
[4]黄玉财.集成电路封装中的引线键合技术[J].电子与封装,2006,6(7):16-21.