分层提取匹配印刷电路板元器件缺陷检测
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摘要
文中提出了一种基于数学形态学与种子填充相结合的分层提取匹配算法,检测印刷电路板(PCB)中的贴片电阻和电容丢失与立碑、集成电路(IC)芯片丢失与极性错误等缺陷。算法分为PCB图像预处理、分层提取、模板分类匹配3部分。算法的关键在于消除无关信息干扰并通过种子填充算法对各类元器件进行分层提取,然后将不同元器件分别进行基于单链表的模板分类匹配。本算法在检测长度为19 cm、宽度为13.5 cm的PCB样本时,在确保精度为0.1 mm以上的情况下最快检测速度可以达到2 s/块。
A hierarchical extraction classification matching algorithm based on mathematical morphology and seed filling is proposed,to detect the defects of printed circuit board( PCB),include the missing and cocked of chip resistors and capacitors,also include the missing and polarity errors of IC chip.The algorithm is divided into three parts: PCB image preprocessing,hierarchical extraction and template classification.The key to the algorithm is to eliminate irrelevant information interference and the various components of PCB are extracted by seed filling algorithm.And then different components were based on single-linked list of template classification and matching.This algorithm is used to detect PCB samples with a length of 19 cm and a width of 13.5 cm,in the case of ensuring a precision of 0.1 mm or more,the fastest detection speed can be up to 2 sec/block.
A hierarchical extraction classification matching algorithm based on mathematical morphology and seed filling is proposed,to detect the defects of printed circuit board( PCB),include the missing and cocked of chip resistors and capacitors,also include the missing and polarity errors of IC chip.The algorithm is divided into three parts: PCB image preprocessing,hierarchical extraction and template classification.The key to the algorithm is to eliminate irrelevant information interference and the various components of PCB are extracted by seed filling algorithm.And then different components were based on single-linked list of template classification and matching.This algorithm is used to detect PCB samples with a length of 19 cm and a width of 13.5 cm,in the case of ensuring a precision of 0.1 mm or more,the fastest detection speed can be up to 2 sec/block.
引文
[1]武锦辉,闫晓燕,王高.基于无损检测的高分辨率PCB板焊点缺陷检测系统[J].仪表技术与传感器,2013(6):90-92.
[2]AYOUB G.Real-time SPC with AOI[J].Surface Mount Technology Magazine,2001,15(6):36-38.
[3]SHIRVAIKAR M.Trends in automated visual inspection[J].Journal of Real-Time Image Processing,2006,1(1):41-43.
[4]熊光洁,马树元,聂学俊,等.基于机器视觉的高密度电路板缺陷检测系统[J].计算机测量与控制,2011(8):1824-1826.
[5]MAR N S S,YARLAGADDA P K D V,FOOKES C.Design and development of automatic visual inspection system for PCB manufacturing[J].Robotics and Computer-Intergrated Manufaturing,2011,27(5):949-962.
[6]STEGER C,ULRICH M,WIEDEMANN C.Machine Vision Algorithms and Applications[M].Beijing:Tsinghua University Press,2007.
[7]JUDI H M,KAPOYAH K,ASHAARINS.Visualising automatic product inspection of PCB units[C]//International Conference on Electrical Engineering and Informatics.IEEE,2009:204-207.
[8]李正明,黎宏,孙俊.基于数字图像处理的印刷PCB缺陷检测[J].仪表技术与传感器,2012(8):87-89.
[9]谢宏威,张宪民,邝泳聪,等.印刷PCB焊点的智能检测[J].光学精密工程,2011(9):2154-2162.
[10]程良伦,江伟欢.基于二值投影的PCB元件安装缺陷检测算法研究[J].计算机工程与设计,2010(3):642-646.
[11]张静,叶玉堂,谢煜,等.采用Gerber文档的印刷PCB表观检测[J].光学精密工程,2013(10):2679-2687.
[12]向静波,苏秀琴.基于数学形态学的金字塔图像去噪[J].光子学报,2009(2):457-460.
[13]姜慧研,冯锐杰.基于改进的变分水平集和区域生长的图像分割方法的研究[J].电子学报,2012(8):1659-1664.
[14]黄飞,吴敏渊,曹开田.基于HIS空间的彩色图象分割[J].小型微型计算机系统,2004(3):471-474.
[15]熊光洁,马树元,刘瑞祯.PCB检测中圆Mark的快速精确定位[J].计算机工程,2012(11):211-213;216.
[16]乔闹生,张奋.一种印刷PCB缺陷图像边缘信息提取方法[J].计算机工程与应用,2015(20):11-15;27.
[17]黄杰贤,李迪,叶峰,等.挠性印制PCB焊盘表面缺陷的检测[J].光学精密工程,2010(11):2443-2453.
[18]LIAO C T,LEE W H,LAI S H.A flexible PCB inspection system based on statistical learning[J].Journal of Signal Processing Systems,2012,67(3):279-290.
[19]吴晖辉,张宪民,洪始良.综合边缘和颜色特征的IC类贴装器件的检测[J].光学精密工程,2009(9):2283-2291.
[20]李颖,谭立新,李斌.基于机器视觉的PCB在线检测设备的图像采集系统[J].仪表技术与传感器,2007(7):43-45.
[21]LOH H H,LU M S.Printed circuit board inspection using image analysis[J].Industry Applications IEEE Transactions on,1999,35(2):426-432.
[2]AYOUB G.Real-time SPC with AOI[J].Surface Mount Technology Magazine,2001,15(6):36-38.
[3]SHIRVAIKAR M.Trends in automated visual inspection[J].Journal of Real-Time Image Processing,2006,1(1):41-43.
[4]熊光洁,马树元,聂学俊,等.基于机器视觉的高密度电路板缺陷检测系统[J].计算机测量与控制,2011(8):1824-1826.
[5]MAR N S S,YARLAGADDA P K D V,FOOKES C.Design and development of automatic visual inspection system for PCB manufacturing[J].Robotics and Computer-Intergrated Manufaturing,2011,27(5):949-962.
[6]STEGER C,ULRICH M,WIEDEMANN C.Machine Vision Algorithms and Applications[M].Beijing:Tsinghua University Press,2007.
[7]JUDI H M,KAPOYAH K,ASHAARINS.Visualising automatic product inspection of PCB units[C]//International Conference on Electrical Engineering and Informatics.IEEE,2009:204-207.
[8]李正明,黎宏,孙俊.基于数字图像处理的印刷PCB缺陷检测[J].仪表技术与传感器,2012(8):87-89.
[9]谢宏威,张宪民,邝泳聪,等.印刷PCB焊点的智能检测[J].光学精密工程,2011(9):2154-2162.
[10]程良伦,江伟欢.基于二值投影的PCB元件安装缺陷检测算法研究[J].计算机工程与设计,2010(3):642-646.
[11]张静,叶玉堂,谢煜,等.采用Gerber文档的印刷PCB表观检测[J].光学精密工程,2013(10):2679-2687.
[12]向静波,苏秀琴.基于数学形态学的金字塔图像去噪[J].光子学报,2009(2):457-460.
[13]姜慧研,冯锐杰.基于改进的变分水平集和区域生长的图像分割方法的研究[J].电子学报,2012(8):1659-1664.
[14]黄飞,吴敏渊,曹开田.基于HIS空间的彩色图象分割[J].小型微型计算机系统,2004(3):471-474.
[15]熊光洁,马树元,刘瑞祯.PCB检测中圆Mark的快速精确定位[J].计算机工程,2012(11):211-213;216.
[16]乔闹生,张奋.一种印刷PCB缺陷图像边缘信息提取方法[J].计算机工程与应用,2015(20):11-15;27.
[17]黄杰贤,李迪,叶峰,等.挠性印制PCB焊盘表面缺陷的检测[J].光学精密工程,2010(11):2443-2453.
[18]LIAO C T,LEE W H,LAI S H.A flexible PCB inspection system based on statistical learning[J].Journal of Signal Processing Systems,2012,67(3):279-290.
[19]吴晖辉,张宪民,洪始良.综合边缘和颜色特征的IC类贴装器件的检测[J].光学精密工程,2009(9):2283-2291.
[20]李颖,谭立新,李斌.基于机器视觉的PCB在线检测设备的图像采集系统[J].仪表技术与传感器,2007(7):43-45.
[21]LOH H H,LU M S.Printed circuit board inspection using image analysis[J].Industry Applications IEEE Transactions on,1999,35(2):426-432.