光电材料加工用套料钻头和研磨减薄砂轮关键制造技术
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摘要
主要介绍了光电材料加工用套料钻头和蓝宝石切片减薄用研磨减薄砂轮制作技术。阐述了光电材料如蓝宝石、特种陶瓷等此类难加工材料用套料钻头在结构设计上的要点、配方设计与加工对象的适应性问题以及制备过程中的关键技术和品质控制。介绍了由蓝宝石研磨性特点所决定的减薄砂轮性能要求,与机台应用参数匹配要点以保证良好的应用效果以及该减薄砂轮制造过程的关键技术和产品质量控制,并介绍了以蓝宝石为加工对象所用到的套料钻头和减薄砂轮产品的规格型号。
Key manufacturing technology of diamond core bits and lapping and thinning grinding wheels applied in processing photoelectric materials was introduced in this paper. It explained the structure design, the adaptability of formula design and processing objects, key manufacturing techniques, and quality control of diamond core bits applied in processing difficult-to-machining photoelectric materials such as sapphire and special ceramics. It stated the required performance of diamond thinning grinding wheels which was constrained by the grinding features of sapphire, appropriate parameters of grinding machines to achieve an optimal performance, the key manufacturing techniques, and the quality control points. It also introduced the specifications of diamond core bits and grinding wheels used for back side thinning in processing sapphire.
Key manufacturing technology of diamond core bits and lapping and thinning grinding wheels applied in processing photoelectric materials was introduced in this paper. It explained the structure design, the adaptability of formula design and processing objects, key manufacturing techniques, and quality control of diamond core bits applied in processing difficult-to-machining photoelectric materials such as sapphire and special ceramics. It stated the required performance of diamond thinning grinding wheels which was constrained by the grinding features of sapphire, appropriate parameters of grinding machines to achieve an optimal performance, the key manufacturing techniques, and the quality control points. It also introduced the specifications of diamond core bits and grinding wheels used for back side thinning in processing sapphire.
引文
[1] 边少卿,陈逸贞.单晶蓝宝石全球市场调查报告,2012:https://max.book118.com/html/2017/0510/105802434.shtm.
[2] 殷海荣,陈福,武丽华,等.光电材料的研究进展[J].云南大学学报(自然科学版),2005,27(5A):594-596.
[3] 牛淑云,彭鱼昆,寇瑾.纳米光电材料研究简介[J].辽宁师范大学学报,2003,26(1):63-67.
[4] 李克华,郭强,赵延军,等.IC硅片超精密背磨用树脂2000#金刚石砂轮研究[J]..超硬材料工程,2010,22(2):14-20
[5] 张禄,叶培培,孟烨勇.新需求引爆十倍空间——蓝宝石产业的机遇与挑战系列报告之一,蓝宝石行业研究[R/OL].2014.4:http://www.xincailiao.com/news/news_detail.aspx?id=8439.
[6] 李大佛、屠厚泽、李天明,等.金刚石、PDC钻头与工艺学[M].北京:地质出版社,2008.12.
[7] 国家标准化管理委员会.蓝宝石单晶抛光衬底片:GB/T 13843-1992[S].北京:中国标准出版社,2004.
[8] 徐晓明,周海,卓志国,等.蓝宝石衬底基片工艺质量检测指标及方法的研究进展[J].现代制造工程.2013(3):87-90.
[9] Loan D.Marinescu,Hans k.Toenshoff,Ichiro Inasaki.Handbook of ceramic grinding and polishing[M].Noyes Publications,William Andrew Publishing,Norwick,NY.I.,2001.
[10] Loan D.Marinescu,Mike Hitchiner,Eckart Uhlmann,ect.,Handbook of machining with grinding wheels[M].CRC Press,2007 by Taylor & Francis Group.
[2] 殷海荣,陈福,武丽华,等.光电材料的研究进展[J].云南大学学报(自然科学版),2005,27(5A):594-596.
[3] 牛淑云,彭鱼昆,寇瑾.纳米光电材料研究简介[J].辽宁师范大学学报,2003,26(1):63-67.
[4] 李克华,郭强,赵延军,等.IC硅片超精密背磨用树脂2000#金刚石砂轮研究[J]..超硬材料工程,2010,22(2):14-20
[5] 张禄,叶培培,孟烨勇.新需求引爆十倍空间——蓝宝石产业的机遇与挑战系列报告之一,蓝宝石行业研究[R/OL].2014.4:http://www.xincailiao.com/news/news_detail.aspx?id=8439.
[6] 李大佛、屠厚泽、李天明,等.金刚石、PDC钻头与工艺学[M].北京:地质出版社,2008.12.
[7] 国家标准化管理委员会.蓝宝石单晶抛光衬底片:GB/T 13843-1992[S].北京:中国标准出版社,2004.
[8] 徐晓明,周海,卓志国,等.蓝宝石衬底基片工艺质量检测指标及方法的研究进展[J].现代制造工程.2013(3):87-90.
[9] Loan D.Marinescu,Hans k.Toenshoff,Ichiro Inasaki.Handbook of ceramic grinding and polishing[M].Noyes Publications,William Andrew Publishing,Norwick,NY.I.,2001.
[10] Loan D.Marinescu,Mike Hitchiner,Eckart Uhlmann,ect.,Handbook of machining with grinding wheels[M].CRC Press,2007 by Taylor & Francis Group.